Stay Ahead with the Latest in Electron Microscopy

SGS celebrates the 100th TESCAN TIMA installation in Chile, advancing automated mineralogy and high-throughput mineral characterization.

Tescan showcased new technologies, AMBER X2, and TENSOR at the National CEMS Conference 2025, highlighting innovation in electron microscopy and workflow efficiency.

Tescan showcased new technologies, AMBER X2, and TENSOR at the National CEMS Conference 2025, highlighting innovation in electron microscopy and workflow efficiency.

SGS celebrates the 100th TESCAN TIMA installation in Chile, advancing automated mineralogy and high-throughput mineral characterization.

Tescan and Dragonfly Energy showcase how advanced microscopy and data analytics accelerate lithium-ion battery innovation and sustainable manufacturing.

Dr. Jana Jurmanová from Masaryk University discusses how the TESCAN CLARA electron microscope supports materials research and student training.

Tescan joins Mikrolux at the 32nd Annual Meeting of the Croatian Microscopy Society in Zagreb to connect with researchers and share innovations.

Tescan supports the new Plasma FIB-SEM laboratory at CTU Prague, advancing materials science research and innovation in civil engineering.

Tescan introduces the FemtoChisel femtosecond laser platform, delivering faster, more precise semiconductor sample preparation and integrated workflow performance.

Discover how Tescan’s cryo-electron microscopy workflow helped uncover algae’s adaptive response to ZnO nanoparticles in collaboration with Mendel University.

Tescan will join the Cryo-Microscopy Group Meeting at the University of Nottingham to showcase its Cryo SOLARIS X² system and latest cryo-microscopy innovations for life sciences.

Discover how Tescan showcased its latest developments in TEM lamella preparation, 4D-STEM analysis, and energy materials research at the CMC Workshop 2025.

Discover how Tescan’s workflow integration and regional expansion are transforming semiconductor analysis and packaging. Watch the DIGITIMES interview with Hervé Macé and Sean Lee.

Highlights from the 3rd Tescan Collaboration Network Meeting at ER-C

Tescan Group today announced the acquisition of FemtoInnovations and the creation of a dedicated Laser Technology Business Unit (LT BU).

Remove bottlenecks in TEM workflows by taking lift-out outside the FIB-SEM and into a dedicated EXLO station

Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery

At IPFA 2025, Tescan presented cutting-edge FIB-SEM & Micro-CT platforms solving semiconductor failure analysis, yield, and reliability challenges.

TESCAN’s AMBER X 2 Plasma FIB-SEM wins the 2025 R&D 100 Award for combining high-throughput 3D analysis with nanometer-precision TEM specimen prep.

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Tescan introduces AutoSection and TEM AutoPrep PRO at M&M 2025 - accelerating semiconductor workflows through precision automation and user-friendly software.