Effortless Imaging and Analysis
Easily switch between imaging and EDS analysis within a single live window using Essence™ EDS. This integration simplifies workflows and cuts down the time spent switching between tools.
Tescan MIRA™ SEM
Tescan MIRA™ SEM pairs a FEG Schottky source with integrated SEM imaging and live elemental analysis in a single Essence™ software window, simplifying the acquisition of morphological and compositional data.
MIRA™ is a practical analytical tool for quality control, failure analysis, and research workflows, offering fast navigation, flexible vacuum modes, and efficient operation across diverse materials.
- Navigate large samples with Wide Field Optics™ down to 2× magnification
- Switch imaging conditions instantly using In-Flight Beam Tracing™ and the Intermediate Lens™
- Collect compositional data directly in the SEM window with Essence™ EDS
- Work with challenging or non-conductive samples using SingleVac™ or optional MultiVac
- Increase resolving power with optional in-column SE/BSE detectors and Beam Deceleration Technology
- Support safe operation with the Essence™ 3D Collision Model for real-time movement awareness
Tescan MIRA in Materials Science
High Resolution SEM Imaging and Microanalysis for Diverse Material Analysis
- Resolve topography and morphology using chamber and in-column SE
- Assess materials contrast using BSE with high sensitivity
- Perform compositional checks using fully integrated Essence™ EDS
- Capture fine features at low kV for powders, nanoparticles, and coatings using Beam Deceleration Technology
Tescan MIRA enables detailed sub-micron analysis of metals, ceramics, polymers, and composites. Its stable FE source, flexible detectors, and unified SEM–EDS workflow support consistent, application-ready data across diverse research needs.
Tescan MIRA in Industrial Inspection & Quality Control
Fast, dependable SEM workflows for routine inspection tasks
- Inspect polished surfaces, cross-sections, and fractured surfaces
- Identify defects, inclusions, and contaminants using SE+BSE contrast
- Perform rapid elemental analysis using Essence™ EDS
- Use SingleVac™ or MultiVac to handle uncoated or charge-prone samples
Tescan MIRA in Failure Analysis & Microelectronics
Sub-micron inspection for device, interconnect, and wafer-level evaluation
- Image packaging features, wire bonds, and interconnects with high contrast
- Characterize layered structures using SE, BSE, and in-column detectors
- Investigate defects, contamination, and electromigration features
- Navigate quickly across wafers and devices using Wide Field Optics™
MIRA helps semiconductor and electronics teams with examining device faults, structural irregularities, and various inspection tasks. Featuring a stable FEG source, navigation, and integrated analytical tools, it reveals fine geometries and subtle features. This supports reliable assessments throughout device workflows. It simplifies acquiring morphological and elemental data, making it an efficient solution for quality control, failure analysis, and research in microelectronics.
Tescan ESSENCE™
Unified Control for Imaging and Analysis
Tescan Essence™ offers a modular interface for MIRA™, allowing users to manage imaging, navigation, and microanalysis within a single customizable layout. This adjustable design promotes efficient, consistent workflows for both routine and advanced SEM tasks.
- Access spectra, elemental maps, and imaging data within a single integrated Essence™ SW control interface
- Maintain consistent beam performance with In-Flight Beam Tracing™
- Navigate confidently using the real-time Essence™ 3D Collision Model to protect detectors and samples
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