Efficient SEM–EDS Analytical Workflows
Integrated EssenceTM EDS Provide imaging and EDS in one window, enabling fast collection of spectra and maps Directly correlated to SEM image
Tescan MIRA SEM
Tescan MIRA SEM delivers high-resolution imaging and microanalysis with FEG source, and optional Essence™ EDS for fast transitions between imaging and analytical conditions.
- Navigate large samples with Wide Field Optics™ and a live SEM navigation with magnification as low as 2×
- Switch between modes instantly using In-Flight Beam Tracing™ and the Intermediate Lens™
- Acquire compositional data directly in the SEM window with integrated Essence™ EDS
- Characterize challenging materials using SingleVac™ or optional MultiVac low vacuum modes
- Enhance the resolving power with optional in-column SE/BSE detectors and Beam Deceleration Technology
- Protect hardware with the Essence™ 3D Collision Model for real-time movement awareness
Tescan MIRA in Materials Science
High Resolution SEM Imaging and Microanalysis for Diverse Material Analysis
- Resolve topography and morphology using chamber and in-column SE
- Assess materials contrast using BSE with high sensitivity
- Perform compositional checks using fully integrated Essence™ EDS
- Capture fine features at low kV for powders, nanoparticles, and coatings using Beam Deceleration Technology
Tescan MIRA enables detailed sub-micron analysis of metals, ceramics, polymers, and composites. Its stable FE source, flexible detectors, and unified SEM–EDS workflow support consistent, application-ready data across diverse research needs.
Tescan MIRA in Industrial Inspection & Quality Control
Fast, dependable SEM workflows for routine inspection tasks
- Inspect polished surfaces, cross-sections, and fractured surfaces
- Identify defects, inclusions, and contaminants using SE+BSE contrast
- Perform rapid elemental analysis using Essence™ EDS
- Use SingleVac™ or MultiVac to handle uncoated or charge-prone samples
Tescan MIRA in Failure Analysis & Microelectronics
Sub-micron inspection for device, interconnect, and wafer-level evaluation
- Image packaging features, wire bonds, and interconnects with high contrast
- Characterize layered structures using SE, BSE, and in-column detectors
- Investigate defects, contamination, and electromigration features
- Navigate quickly across wafers and devices using Wide Field Optics™
MIRA helps semiconductor and electronics teams with examining device faults, structural irregularities, and various inspection tasks. Featuring a stable FEG source, navigation, and integrated analytical tools, it reveals fine geometries and subtle features. This supports reliable assessments throughout device workflows. It simplifies acquiring morphological and elemental data, making it an efficient solution for quality control, failure analysis, and research in microelectronics.
TESCAN ESSENCE™
Unified Control for Imaging and Analysis
Tescan Essence™ offers a modular interface for MIRA, allowing users to manage imaging, navigation, and microanalysis within a single customizable layout. This adjustable design promotes efficient, consistent workflows for both routine and advanced SEM tasks.
- Access spectra, maps, and profiles directly in the SEM window using integrated Essence™ EDS
- Maintain stable beam conditions with automated routines and In-Flight Beam Tracing™
- Navigate safely with real-time chamber monitoring using the Essence™ 3D Collision Model
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