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Femtosecond-laser solution with software-selectable wavelength and intelligent multi-gas processing - for the fastest, cleanest semiconductor sample preparation.

Tescan FemtoChisel

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FemtoChisel is the next-generation femtosecond laser solution built specifically for semiconductor sample preparation. For too long, the industry has had to compromise between throughput, precision, and Surface Quality. Now all are delivered on one integrated platform.  

FemtoChisel brings several unique Tescan’s proprietary technologies:

  1. Intelligent Multi-Gas Processing – A thermodynamically controlled gas delivery system that dynamically tracks the laser position in real time, optimizing ablation conditions and ensuring clean, debris-free material removal.

  2. Laser Protective Layer (LPL) – A layer that is applied and removed in seconds without relocating the sample from the laser system and shields the underlying structures from beam induced damage. 

  3. Correlative Machine Vision & Targeting – A fully integrated, multi-resolution digital microscope that learns from other imaging modalities (e.g., SEM, optical, X-ray) to automatically navigate and target the precise region of interest with sub-micron accuracy.

  4. Software-Selectable Laser Wavelength – Combines the performance of two laser systems in one; users can instantly switch wavelengths via software control, expanding material compatibility and simplifying workflows- no manual adjustment required. 

  • High-throughput, versatile sample preparation
    • Handles everything from wafers and die to packaged devices and displays. 
    • Suitable for near-line applications where ease of use is essential, while remaining open and flexible for advanced R&D & FA labs requiring more sophisticated features.
  • Pristine, damage-free surfaces
     
    • Intelligent multi-gas-assisted processing and laser protective layering result in debris-free surfaces with virtually no heat damage.
    • Often eliminates or reduces the need for FIB polishing. A major time sink in semiconductor analysis workflows.
  • Nanometer-scale precision with automation 
    • Combines nanometer-level control with intelligent automation.
    • Enables stable, repeatable, high-throughput workflows while maintaining exceptional control over material interactions.

Tescan FemtoChisel MAKES THE DIFFERENCE

Key Benefits

> 90% Workflow time saving

for large scale X-sectioning and Delayering of heterogeneous materials thanks to true femtosecond Laser processing being up to 2000X faster than Xe Plasma FIB and up to x10000 than Ga FIB: Boosting lab productivity, reduce both time-to-sample and cost-per-sample. 

Pristine surfaces with minimal/no debris and redeposition & HAZ

with proprietary intelligent multi-gas processing, laser protective layer and advanced laser beam time and space modulation, FemtoChisel enables final FIB polishing within few microns of the target region with <0.2 um of HAZ significantly reducing FIB processing.

Heterogeneous materials No longer an issue

Combination of unprecedented laser fluence regimes and software selectable multi-wavelength operation makes FemtoChisel Material agnostic.  

Correlative Multi-resolution Machine Vision & Targeting System

FemtoChisel intelligently navigates to region on interest by bringing image from ANY CT, Optical or SEM instrument. 

Nanometer-level endpoint precision 

using integrated confocal height sensor with single digit nm resolution and high-resolution machine vision for in-process depth monitoring enabling all-in-plane features of interest. 

Modular system architecture 

with a full digital twin technology  enabling field upgradeability, customization and advanced recipe development 

Prepare large volume (cubic mm scale) samples or access deeply buried Regions of Interest 

quickly and efficiently – even in non-conductive hard materials (glass, polymers, ceramics) – with the faster material removal rates of the laser and Plasma FIB combined.

Tescan FemtoChisel APPLICATIONS

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Tescan FemtoChisel in Semiconductors

High-precision laser micromachining for semiconductor sample preparation and failure analysis

  • Adaptive multi-material processing, with proprietary intelligent multi-gas processing and laser protective layer that preserve device integrity across metals, polymers, and advanced packaging stacks.

  • High-throughput access to buried structures with taper-corrected, debris-free cross-sections – often eliminating the need for post FIB polishing. 

  • Selective backside thinning with mirror-like surfaces (Ra < 0.4 µm), enabling optical fault analysis without artifacts. 

  • Large-area delayering (5–10 mm) with automated endpointing for accurate layer-by-layer removal at laser speeds. 

  • By uniting laser processing, electron microscopy, and FIB into complementary workflows, Tescan is helping semiconductor innovators overcome traditional bottlenecks in sample preparation. FemtoChisel serves both recipe-driven environments and flexible research in advanced packaging and R&D labs, providing a versatile solution for current and future semiconductor demands. 

Tescan FemtoChisel accelerates semiconductor workflows that demand speed, precision, and surface integrity. Operating in the non-thermal ablation regime, it enables engineers to access deeply buried regions of interest without microcracks, melt zones, or redeposition. The system delivers reproducible, analysis-ready results across advanced devices, supporting physical failure analysis, process development, and reverse engineering.

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Tescan FemtoChisel

Laser Precision for Every Layer

Intelligent Multi-Gas Processing and Protective Layer Technology

FemtoChisel combines an intelligent multi-gas processing with a removable laser protective layer to deliver faster and cleaner sample preparation. The gas is thermodynamically  optimized and delivered during laser ablation to improve material removal efficiency and mitigate redeposition. The protective layer absorbs and redistributes thermal energy, prevents oxidation and surface damage while maintaining smooth and stable ablation conditions. These features enable high-throughput cross-sectioning of complex semiconductor structures, often eliminating the need for additional FIB polishing and significantly reducing preparation time.

Correlative Multi-Resolution Vision and Any GDS File Alignment

FemtoChisel integrates a correlative multi-resolution vision system that correlates optical, thermal, and X-ray imaging for precise region-of-interest localization. By overlaying these imaging  data, operators gain a complete visual understanding of both surface and buried device structures. The system’s full CAD file compatibility allows direct import of layout data, aligning live imaging with the device design. This correlation enables accurate targeting of vias, interconnects, and circuit patterns, reducing navigation time and improving accuracy in failure analysis and advanced packaging workflows.

Modular Architecture with Digital Twin Control

FemtoChisel is built on a modular platform architecture that supports field upgrades and long-term scalability. Its integrated digital twin continuously mirrors the physical system, simulating alignment, motion accuracy, and process conditions in real time. This allows users to test and optimize setups virtually before applying them to real samples. The combination of modular hardware and predictive digital control ensures consistent process quality, reduced downtime, and a reliable return on investment for semiconductor laboratories.

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Tescan FemtoChisel

Technical specification

Tescan FemtoChisel is a precision intelligent nanomachining system designed for a wide range of applications, including sample preparation, failure analysis, and biomedical device manufacturing.

The specifications of Tescan FemtoChisel are organized into several modules that are fully integrated into a single, all-in-one system.

Laser Source

 

Max Power 20W

Dual Wavelength: 1030 nm (IR) / 515 nm (green)

Pulse duration: < 250 fs to 10 ps (tunable)​

Pulse energy: up to 200 µJ

Stage 

XYZ stages + rotation (360°) + tilt (±30°)
​

Travel: 300 mm × 300 mm; Z range: 40 mm

Scan Optics

Spot size: < 15 µm (IR), < 8 µm (green)
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Scan field: up to 25 mm × 25 mm​

Total laser-accessible is defined by laser travel range (subject to sample size and Machine vision restrictions)

Gas-assisted Processing 

Intelligent dual-gas system (CO₂ + secondary gas: air/N₂/Ar)

CO₂ feed: gas or liquid

Vision & Targeting

Dual-camera machine vision (overview + high-resolution)
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~1 µm optical resolution with autofocus/auto-exposure
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Correlative navigation/targeting (CT/SEM/optical data), CAD import

Software

Unified control of laser, stages, vision; synchronized stage/laser processing

Compliance & Facility 

 

CE; UL / SEMI S2/S8 on request

208–220 V, 20 A; CO₂ ​

Air/water cooled chiller; vacuum pump; fume extractor
 
Tescan FemtoChisel Laser Solution

GET IN Touch

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Where you can find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic



info@Tescan.com