Versatile System for Optimized Performance at Ultra-High Vacuum

Tescan NanoSpace

NanoSpace is a versatile system designed to operate under ultra-high vacuum (UHV) conditions. Its modular architecture allows the installation of a wide range of SEM and FIB columns, providing a comprehensive, customizable solution for high-resolution, contamination-free FIB nanomachining and advanced surface analysis in semiconductors, and materials science research.

Fully customizable and modular system to fulfill specific research and analytical needs, configurable as multi FIB-SEM, dual FIB-FIB, mono-beam FIB, or stand-alone SEM.

Local metal deposition and selective etching with UHV-compatible GIS.

Seamless connection to third-party UHV systems such as MBE clusters, APT chambers, or synchrotron beamlines.

Where Tescan NanoSpace

makes the difference

Full UHV design - Contamination free environment

Tescan NanoSpace is the first UHV-designed FIB-SEM instrument, fully bakeable to reach the ultimate vacuum level.

Fully customizable and modular system

Tescan NanoSpace can be customized in order to completely fulfill your specific needs. Total flexibility is given in selecting the FIB column, either with LMAIS, gas plasma ion source, Wien Filtered Liquid Metal Alloy Ion Source (LMAIS), or Wien filtered gas plasma ion source.

Designed to perform high quality surface analysis using SIMS

Excellent conditions and unique dual beam geometry allow correlation of in-situ SEM and high quality Secondary Ion Mass Spectrometry images in a single instrument.

Accurate sample control

The 6-axis stage UHV compatible allows for loading samples which dimensions up to 100 mm in length and width.

UHV connection

A UHV intermediate chamber is designed to ensure Nanospace’s connection to third party UHV instruments, process cluster or synchrotron beam line.

Fully automated instrument

NanoSpace control and imaging software is highly ergonomic and easy to use. Control of the vaccum system is fully automated to ensure safe, fast and easy vacuum operations.

High resolution imaging

Tescan NanoSpace is equipped with two different high-resolution electron beam columns, either fully electrostatic or electromagnetic. In combination with the Secondary Electron Detector, Tescan Nanospace produces high-quality images.

Tescan AMBER X2 Applications

Tescan AMBER X2 in Materials Science

Gain the detail you need to understand how materials behave, from nanoscale structures to millimeter-scale volumes.

Comprehensive 3D characterization for microstructural studies
Automated TEM lamella preparation with TEM AutoPrep Pro™
Correlative multimodal analysis combining EDS, EBSD and ToF-SIMS
Large-volume milling for full-field reconstruction and structural insight

AMBER X2 gives materials scientists a reliable way to study metals, ceramics, polymers and composites with both precision and scale. Its Xe plasma FIB and field-free SEM architecture support high-resolution imaging without unnecessary beam damage. This helpa you explore structure–property relationships and track material changes under load, heat or environmental exposure.

Tescan AMBER X2 in Energy and Batteries

Get a clearer view of electrode architecture, interface behavior, and the mechanisms that drive degradation.

Damage-free plasma FIB-SEM workflows for electrodes and interfaces
Cross-sectioning and 3D reconstruction of electrodes and solid-state architectures
Correlative EDS and ToF-SIMS for chemical and structural gradients
Safe, contamination-free milling of lithium-containing and beam-sensitive materials

AMBER X2 helps battery researchers examine internal structures with clarity, from active material morphology to subtle interface changes. Its high-throughput plasma FIB and multimodal analysis tools reveal degradation pathways, lithium distribution patterns, and stability issues. This gives you the insight needed to refine materials and design more reliable energy-storage systems.

Tescan AMBER X2 in Semiconductors

Uncover the electrical and structural details of today’s most advanced devices

Uncover the electrical and structural details of today’s most advanced devices with Tescan AMBER X 2 Plasma FIB-SEM. Purpose-built for semiconductor applications, AMBER X 2 combines Xe plasma FIB with proprietary Nanoflat, Chase, and C-Maze chemistries to deliver uniform, artifact-free delayering at sub-10 nm nodes.

The system ensures you have reproducible workflows across logic, memory, and I/O regions, supporting electrical fault isolation, failure analysis, and transistor-level probing.

Perform artifact-free delayering with Nanoflat, Chase, and C-Maze chemistries
Protect device integrity using low-kV Xe Plasma FIB milling
Control every step with end-point detection and live monitoring
Integrate delayering with in situ nanoprobing in a single workflow
Deprocess I/O and thick metal layers using low angle polishing

Resolve critical details with BrightBeam™ UHR SEM imaging at sub-500 eV

Tescan AMBER X2 in Life Sciences

Work confidently across cryogenic and room-temperature workflows, whether you're studying ultrastructure or preparing samples for high-resolution imaging.

Large-volume 3D FIB-SEM tomography of hard biological materials, including bone, shell and dental tissue
High-quality cryo lamella preparation with MISTRAL™ Plasma FIB for fast rough milling and precise low-energy polishing
Integrated CLEM workflows with METEOR 2.0 for accurate ROI targeting
Built-in cryo nanomanipulator for temperature-controlled, reliable lift-out
Advanced analytical options including EDS, ToF-SIMS and EBSD

AMBER X2 brings plasma FIB speed to demanding life science studies, from large-volume 3D analysis to delicate cryo sample preparation. Its stable beam performance helps you obtain clean, artifact-free results across biological interfaces, mineralized tissues and complex structural hierarchies.

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