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Discover Tescan’s

Original Equipment Manufacturing

Advanced FIB and SEM columns, paired with gas injection and secondary electron detection, give you precise control and high-resolution insight at the nanoscale. Designed for seamless OEM integration, these technologies support flexible, modular system architectures-engineered for industrial-grade performance, reliability, automation, and smooth integration into tailored solutions.

SEM columns

e-CLIPSE Plus
e-CLIPSE Plus

High resolution electron imaging for all your analysis

e-CLIPSE Plus is the ultimate electrostatic SEM present on worldwide market offering extreme compactness thanks to its objective design. This SEM column is optimized to reach the best resolution at large working distance (compared to standard electro-magnetic SEM columns). e-CLIPSE Plus enables to work at both low and high currents keeping a sharp beam especially for analysis. Its wide energy range allows to reach great performances on a large panel of applications from equipment manufacturers to R&D laboratories.

Key Features

  Source

 Schottky FEG (Field Emission Gun)

  Energy Range

 500 eV - 30 keV

  Probe Current 

 10 pA - 100 nA

  Working  Distance

 12 mm (up to 45 mm)

Technical Sheet Application Note
Vortex - electrostatic customizable SEM
Vortex

Refined SEM column for UHV environment

Vortex is our entirely electrostatic customizable SEM column dedicated to high currents at middle range energy.
Its compactness allows an easy implementation on any dedicated UHV chambers reducing both analysis accessories overcrowding near the sample area and outside the chamber. Each Vortex column is fully personalized to your exact requirement and application such as probe imaging, navigation, surface analysis,... Vortex offers a nice compelling combination of price, ease of use and performances while preserving a good reliability in a UHV environment.

Key Features

  Source

 Schottky FEG (Field Emission Gun)

  Energy Range

 500 eV - 10 keV

  Probe Current 

 20 pA - 10 nA

  Working  Distance

 12 mm (up to 45 mm)

Technical Sheet

FIB columns

DeepFIB
DeepFIB

Unleash the power: Redefying limits of the gallium focused beam

DeepFIB is our very last Ga FIB column released. DeepFIB extends the panel of applications thanks to both an optimized design for low energy work and a sharply focused beam even for high currents.

DeepFIB column allows to reach the smallest resolution at high acceleration voltage (< 2.5nm) and at low energy (<400 nm @500 eV) and to keep an ultra-fine resolution in a wide range of possible currents. The high current mode increased up to 135 nA enables a faster milling and a huge time saving keeping the sharpest beam.

DeepFIB is easily adaptable on any vacuum chamber as it is also available in a UHV configuration and so bakeable up to 120°C. DeepFIB has a large field of view (1000 μm x 1000 μm) allowing to locate easily the regions of interest..

Key Features

  Source

 LMIS (Liquid Metal Ion Source)

  Ion Species

 Ga+

  Energy Range

 500 eV - 35 keV

  Probe Current 

 <0.3 pA – 135 nA

  Working  Distance

 12 mm

  Ultimate resolution - 35 keV

 <2.5nm

  Ultimate resolution - 1 keV

 <115 nm

  Ultimate resolution - 500 eV

 <400 nm

Technical Sheet
Orage
Orage

Extended performances with our new Ga FIB column

Orage is our very last Ga FIB column released. While keeping the well-proven performances of Cobra, Orage extends the panel of applications thanks to both an optimized design for low energy work and a sharply focused beam even for high currents. The addition of a piezo-controlled motor source gives an excellent FIB characteristic reproducibility and ease-of-use regardless of energy or current applied.

Key Features

  Source

 LMIS (Liquid Metal Ion Source)

  Ion Species

 Ga+

  Energy Range

 500 eV - 30 keV

  Probe Current 

 1 pA – 100 nA

  Working  Distance

 12 mm

  Optional UHV Configuration

 Maximum bakeout temperature is 120 °C

Technical Sheet
Ultra-high vacuum FIB column for ion implantation and nanofabrication
Cobra

The well-recognized Ga FIB column

With an ultimate beam resolution of 2.5 nm, Cobra is the finest Gallium column. Cobra is designed to keep an extremely well-defined beam shape at different current modes. This well-approved FIB column allows both unique milling performances and imaging capabilities. Cobra FIB column is serially set up on mostly FIB-SEM instruments even for UHV atmospheres.

Key Features

  Source

 LMIS (Liquid Metal Ion Source)

  Ion Species

 Ga+

  Energy Range

 1 - 30 keV

  Probe Current 

 1 pA – 50 nA

  Working  Distance

 12 mm

  Optional UHV Configuration

  Maximum bakeout temperature is 120 °C

Technical Sheet
i-FIB+
i-FIB+

50 times faster than the most powerful Ga FIB

i-FIB+ column is the perfect answer for today’s low machining time growing demands. With the patented compact no cooling ECR source technology, i-FIB+ achieves a sputtering rate up to 50 times higher than the most powerful Ga FIB keeping sharp current distribution. These assets are well adapted for sub-100 nm thickness samples preparation required for high-quality TEM images. Not only has i-FIB+ the great asset to get rid of gallium primary ions thanks to the use of non-contaminant noble gas ions non-contaminant for microelectronic processes, but also it is able to deliver probe current up to 3 µA making the milling of large structure much more time effective. The column allows the preparation of large-area cross-sections, as large as 1mm wide at 30 keV, that is unmatched in the market.

Key Features

  Source

 LMIS (Liquid Metal Ion Source)

  Ion Species

 Ga+

  Energy Range

 500 eV - 30 keV

  Probe Current 

 1 pA - 100 nA

  Working  Distance

 12 mm

  Optional UHV Configuration

 Maximum bakeout temperature is 120 °C

Technical Sheet Application Note
Cobra ExB focused ion beam column with ExB mass filtering
Cobra ExB

High resolution Ga-free FIB column

Cobra ExB is a specific FIB column providing a performing alternative to the well-known Cobra FIB (gallium source). Thanks to the alliance of a LMAIS (Liquid Metal Alloy Ion Source) and a Wien Filter, Cobra ExB offers an easy solution for ion mass selection from light species to heavy clusters with great resolution imaging. This Ga-free FIB Column achieves precise milling and accurate selective surface implantation with a large panel of ion species.

Key Features

  Source

 LMAIS (Liquid Metal Alloy Ion Source) AuGe / AuSi / Bi / Ga

  Ion Species

 Au+, Au++, Au2+, Au3+, Ge+, Si+, Si++, Gold clusters (Aunq+ with n/q up to 100), Bi+, Bi++ ,…

  Energy Range

 1 - 30 keV

  Probe Current 

 1 pA – 20 nA

  Characteristics

 High mass resolution ExB Wien Filter with 12 movable acceptance apertures (M/ΔM > 45)

  Miscellaneous

 Alternative LMAIS can be available upon request

Technical Sheet Application note
Chroma ExB
Chroma ExB

Pentode objective for ultimate performances in Ga-free environment

Chroma ExB FIB column introduces an all-new objective design called “pentode” for optimizing both low and high current modes in one single device. The association of a LMAIS and a Wien Filter reaches accurate ion mass selection from light species to heavy clusters keeping extreme resolution imaging due to the pentode objective. This Ga-free primary beam achieves especially precise milling, low energy range working and selective implantation with a very large panel of ion species.

Key Features

  Source

 LMAIS (Liquid Metal Alloy Ion Source) AuGe / AuSi / Bi / Ga

  Ion Species

 Au+, Au++, Au2+, Au3+, Ge+, Si+, Si++, Gold clusters (Aunq+ with n/q up to 100), Bi+, Bi++ ,…

  Energy Range

 500 eV - 30 keV

  Probe Current 

 0.1 pA - 50 nA

  Characteristics

 High mass resolution ExB Wien Filter with 30 movable acceptance apertures (M/ΔM > 45)

  Miscellaneous

 Alternative LMAIS can be available upon request

Technical Sheet Application note

GAS INJECTION SYSTEM

1466696018
OptiGIS

The easy compact single
Gas Injection System

  • High speed temperature ramp-up: OptiGIS is ready to operate in less than 2 minutes after reservoir mounting

  • Its ultra-compact design is an important advantage for massively equipped detectors/devices to avoid over-crowding

  • Controlled injected gas flow
    by an accurate temperature regulator and conductance
    reduction diaphragms especially designed for high vapor
    pressure precursors

  • Easy reservoir exchange is possible without venting the chamber with a reliable security system to avoid any contact with chemical precursors

  • No gas remanence when stopping the injection thanks to an optimized reservoir positioning

  • Conductive or insulating deposition using FIBID or FEBID techniques (Focused Electron/Ion Beam Induced Depositions)

  • Versatile nozzle geometry regarding your application up to 300x300 uniform gaz delivery area for large area applications

  • Possibylity to adapt a special connector for pressurized gases injection

Technical Sheet Application Note
1466170927
5-line GIS

All-in-one Gas Injection System

  • 5 independent gases possibilities gathered in a single one device

  • No inadvertent cross-contamination inside the 5 separated injection lines

  • Conductive or insulating deposition using FIBID or FEBID techniques (Focused Electron/Ion
    Beam Induced Depositions)

  • Increased FIB etching rate with an expected quality, accuracy and repeatability using chemistry coupled to ion or electron sputtering

  • Controlled injected gas flow by an accurate temperature regulator

  • No possible chemical contact with precursors for user’s safety

  • Needle optimized position for each sample position

  • A Direct Injection Module (DIM) can be mount to inject a large choice of gaseous precursors

Technical Sheet Application Note

ADD-ON

SED
SED

Secondary Electron Detector for greater topography imaging

Thanks to a highly effective secondary electron collection, SED guarantees a sufficient brightness even for low particle emissions. Based on the Everhart-Thornley detection principle, Orsay Physics SED achieves high dynamic imaging. It includes a scintillator, a light pipe and a photomultiplier to intensify effectiveness of gathered secondary electrons.
It is customized to perfectly fit into any vacuum chambers and to ensure the best image quality.

Key Features

 Adjustable parameters

 Collector voltage / Accelerating voltage / Brightness / Contrast

 Main Characteristic

 Lenght-customizable nozzle

 Option

 Non-sensitive to light detector

 Adaptation Requirement

 35 CF flange

 Optional UHV configuration

 Maximum bakeout temperature is 120°C

Technical Sheet

GET IN Touch

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Where can you find us: 

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.479653 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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