The Microscopy & Microanalysis (M&M) conference is one of the most important events in the microscopy calendar, bringing together researchers, academics, industry experts, and technology innovators from around the world. This year's event in Milwaukee once again proved why M&M remains a key gathering place for scientific discovery and technological advancement.
For Tescan, M&M 2026 was an exceptional week filled with conversations, demonstrations, and meaningful interactions. From the moment the exhibition floor opened until the final day, our booth remained busy with visitors eager to learn more about the latest developments in electron microscopy, FIB-SEM systems, femtosecond laser technology, and micro-CT imaging.
A Week of Fully Booked Demonstrations
One of the strongest indicators of success was the overwhelming interest in our live demonstrations. Every available product demo slot was booked throughout the week, keeping our application specialists fully occupied. Visitors included long-standing Tescan users, researchers exploring new technologies, and attendees discovering the Tescan portfolio for the very first time.
The constant flow of scientists, professors, research institutions, and industry professionals highlighted a growing awareness of Tescan's expanding role in advanced microscopy and materials characterization. Many visitors came to discuss the latest challenges in sample preparation, automation, semiconductor research, battery development, and advanced materials analysis, while others simply wanted to see what innovations Tescan had brought to the market this year.
Tescan CLARA UHR-SEM Captures Attention
Among the most discussed systems at the booth was the newly introduced Tescan CLARA UHR-SEM.
Designed to deliver ultra-high-resolution imaging while maintaining ease of use and analytical flexibility, Tescan CLARA attracted significant attention from researchers seeking exceptional surface characterization and imaging performance. Throughout the event, visitors lined up to learn more about the system's capabilities and how it can support increasingly demanding research applications.
The strong interest confirmed what we had anticipated: researchers continue to seek higher imaging performance combined with workflows that simplify everyday operation.
Innovation Award for Tescan FemtoChisel™
Perhaps the biggest star of the week was Tescan FemtoChisel™, our groundbreaking femtosecond laser solution.
As the only integrated solution of its kind currently available on the market, FemtoChisel continues to generate tremendous excitement. Interest in femtosecond laser technologies was evident across the exhibition hall, with many suppliers presenting laser-based approaches. Yet Tescan stood out from the crowd with a unique solution that combines precision, speed, and workflow integration in ways researchers have been actively seeking.
Adding to the momentum, FemtoChisel was honored with an Innovation Award from the Microscopy Society of America, the organizer of M&M. The recognition served as a powerful validation of the work carried out by our scientists, engineers, product specialists, and development teams.
Receiving the award was a proud moment for Tescan, and our team was delighted to showcase the technology throughout the entire conference.
AMBER X 2 Demonstrates the Future of Automated FIB-SEM
While FemtoChisel attracted significant excitement, our flagship AMBER X 2 remained a major destination for visitors interested in advanced FIB-SEM workflows.
AMBER X 2 represents the highest level of Tescan's expertise in focused ion beam-scanning electron microscopy technology. In a highly competitive field, it continues to set a benchmark for performance, versatility, and reliability.
One topic repeatedly emerged in discussions around the instrument: automation.
Researchers are increasingly looking for ways to improve throughput, reduce operator workload, and ensure reproducible results. Visitors were particularly interested in how automation can accelerate complex workflows while maintaining high-quality analytical outcomes. AMBER X 2 demonstrated that advanced automation is no longer a future concept but an increasingly essential component of modern microscopy laboratories.
Bringing Micro-CT Innovation to a Microscopy Audience
Although M&M is primarily known as a microscopy conference, Tescan was proud to showcase the latest developments in X-ray computed tomography through UniTOM HR 2.
The system attracted steady interest throughout the week, demonstrating that researchers increasingly value complementary imaging technologies that provide both internal and external sample characterization. Visitors appreciated the opportunity to discuss how high-resolution micro-CT can be integrated with electron microscopy workflows to deliver more complete analytical insights.
The successful reception further confirmed the growing convergence of imaging technologies across research disciplines.
Tescan TENSOR Highlights New Cryo-EM Capabilities
Another important highlight was Tescan TENSOR, which attracted considerable attention from visitors interested in advanced analytical electron microscopy.
Particularly exciting were discussions around Tescan's newly introduced cryo-EM solution for analytical 4D-STEM characterization. As demand continues to grow for advanced techniques capable of revealing increasingly complex material properties, researchers were eager to understand how these new capabilities can support their work.
The strong engagement around TENSOR reflected the broader trend toward more sophisticated analytical approaches that combine high-resolution imaging with comprehensive materials characterization.
Growing Visibility Across Multiple Markets
What stood out most throughout the week was not simply the interest in individual instruments but the recognition of Tescan as an innovation leader across multiple technology areas.
For years, Tescan has built a strong reputation in electron microscopy and FIB-SEM solutions. At M&M 2026, it became increasingly clear that the company is also gaining significant visibility in the rapidly growing field of femtosecond laser technologies.
Visitors repeatedly approached our team to ask a simple question: What's new at Tescan?
The ability to answer that question with a portfolio spanning ultra-high-resolution SEM, award-winning femtosecond laser technology, flagship FIB-SEM systems, advanced micro-CT solutions, and next-generation cryo-EM workflows speaks volumes about the direction of the company.
Thank You, Milwaukee
M&M 2026 was more than an exhibition. It was an opportunity to connect with the scientific community, exchange ideas, gather feedback, and demonstrate how innovation continues to shape the future of microscopy and materials characterization.
The enthusiasm we experienced throughout the week, the fully booked demonstrations, the Innovation Award recognition, and the constant stream of visitors all pointed to one clear message: Tescan's visibility and impact on the global microscopy market continue to grow.
Thank you to everyone who visited our booth in Milwaukee. We look forward to continuing these conversations and helping researchers push the boundaries of discovery.
Related Resources
Tescan FemtoChisel™
Discover the award-winning femtosecond laser solution.
Tescan CLARA™
Ultra-high-resolution SEM for advanced materials analysis
Tescan AMBER™ X 2
Advanced plasma FIB-SEM with automated workflows.
