Tescan SOLARIS X 2

Accurate cross-sectioning and high-resolution imaging for complex 3D microstructures

• Xe Plasma FIB milling for fast, large-volume cross-sections

• Artifact-free polishing using TRUE X-sectioning and Rocking Stage technologies

• Damage-free analysis of micro-scale mechanical structures

For MEMS research and failure analysis, SOLARIS X 2 combines high-current Xe Plasma FIB with artifact-suppression technology to reveal buried interfaces and microactuator geometries in detail. The system supports development and quality assessment of sensors, actuators, and other 3D microsystems where mechanical precision and clean sectioning are critical.

Large-area FIB-SEM for analyzing thin-film and multilayer display stacks

• High-throughput cross-sectioning of OLED and TFT displays

• Precise end-pointing across complex layered structures

• Reliable imaging of conductive and beam-sensitive materials

For display manufacturers and materials researchers, SOLARIS X 2 enables detailed inspection of pixel arrays, contact interfaces, and encapsulation layers. Deep sectioning with inert Xe ions preserves delicate thin-film structures, ensuring accurate visualization of electrical, optical, and mechanical defects within next-generation display technologies.

High-resolution imaging and cross-sectioning for optical and photonic components

• Clean sectioning of LEDs, VCSELs, and laser diodes

• High-contrast SEM imaging for optical interface evaluation

• Ga-free milling preserves active optical layers and coatings

Tescan Solaris X 2 supports precise structural and compositional analysis of complex optoelectronic assemblies. Its combination of sharp Xe Plasma FIB milling and sensitive SEM imaging enables engineers to investigate layer bonding, defect propagation, and structural alignment within photonic and light-emitting devices.

Efficient, Ga-free sample preparation for high-quality TEM and STEM analysis

• Automated lamella thinning under 100 nm

• Inert Xe ions prevent implantation and sample contamination

• Optimized for sub-surface target exposure in complex devices

With its high resolutionXe Plasma FIB and precise beam control, SOLARIS X 2 streamlines TEM specimen preparation for semiconductor and materials applications. The Ga-free workflow eliminates contamination and preserves true microstructural integrity, ensuring accurate characterization in STEM, EDS, and EBSD studies.

Large-volume 3D microanalysis for advanced materials and composites

• Combined 3D EDS and EBSD for composition and crystallography

• Artifact-free sectioning of ceramics, polymers, and glass materials

• Fast, automated reconstruction for structural and chemical mapping

Beyond semiconductor analysis, SOLARIS X 2 provides powerful 3D analytical capabilities for diverse materials research. Its plasma FIB-SEM workflow enables correlative microanalysis at multiple scales—capturing the chemical, structural, and crystallographic details that drive innovation in materials science and engineering.

Tescan SOLARIS X 2 combines Mistral™ Xe plasma FIB with UHR-SEM immersion optics for precise lamella preparation and high-quality volume imaging. Its enhanced beam profile enables fast milling and low-energy polishing, ideal for large-volume and high-throughput cryo workflows.

• Mistral™ Xe Plasma FIB Column: Enhanced beam profile for fast milling and precise low-energy polishing.

• UHR-SEM Immersion Optics: Optimized for high-quality cryo imaging.

• Integrated Leica/Quorum cryo workflow

• Built-in Tescan Cryo-Nanomanipulator: Temperature-controlled system for safe and efficient lamella lift-out

• Integrated CLEM: Precise ROI targeting with integrated METEOR 2.0

• Tescan Essence™ Software: Designed for multi-user environments, ensuring effortless operation regardless of experience level.

From comprehensive cryo electron tomography sample preparation to high-quality cryo volume imaging enabled by immersion-SEM optics, SOLARIS X2 integrates every tool needed for advanced structural biology research.