Tescan Announces Carlyle Agreement with Shimadzu Corporation
Carlyle and other shareholders have entered into an agreement with Shimadzu Corporation that may result in a change in Tescan’s shareholding structure, subject to approvals.
WEBINAR | Diamond Engineering via Focused Ion Beam Implantation for Quantum Technologies
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Carlyle and other shareholders have entered into an agreement with Shimadzu Corporation that may result in a change in Tescan’s shareholding structure, subject to approvals.
Tescan introduces the FemtoChisel femtosecond laser platform, delivering faster, more precise semiconductor sample preparation and integrated workflow performance.
Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery
Discover how integrating micro-CT and plasma FIB-SEM enables multiscale 3D characterization of heterogeneous materials, linking structure, chemistry, and performance.
Learn how to reduce EBL stitching errors on a standard SEM using technological layers and smart write-field placement in a GDSII workflow.
Learn practical methods to estimate lamella thickness for TEM, including FIB-SEM transparency, EELS-based measurement, and X-mark polishing techniques.
An interview with Riley Tejcek on performance and safety, including how non-destructive X-ray CT supports materials inspection in demanding environments.
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