Get a closer look at what’s happening at Tescan through the latest news, media coverage, and stories from across our global community.
Tescan expands its semaiconductor portfolio with FemtoChisel, a next-generation femtosecond laser platform designed to enhance semiconductor sample preparation workflows with exceptional speed, precision, reproducibility, and quality. The instrument will be officially unveiled at ISTFA 2025 in Pasadena, CA.
Tescan Group today announced the acquisition of FemtoInnovations, a leading innovator in ultrafast laser technologies, and the creation of a dedicated Laser Technology Business Unit (LT BU) headquartered at the University of Connecticut (UConn) Tech Park.
The week at the 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2025) in Penang from August 5 to 8 delivered what the semiconductor industry needs most: education, practical discussion, and forward-looking solutions.
CEO Jean-Charles Chen shares how the rebrand goes beyond design, marking Tescan’s evolution from product maker to solutions partner — committed to “Accelerating the Art of Discovery.”
Follow Tescan on LinkedIn to get the latest updates on new solutions, webinars, application insights, expert content, and events. Right where you already are.
The iCT Conference returns to Linz from 10 to 13 February 2026, bringing researchers, engineers, and industry teams together at FH OOE, Linz Campus. As a sponsor, Tescan will take part throughout the event with a booth and an industry-day presentation focused on advancing in-situ micro-CT. The week offers keynotes, technical sessions, short talks, posters, and lab tours across both Linz and Wels campuses.
ISTFA 2025 took place from November 16 to 20 at the Pasadena Convention Center in California. The International Symposium for Testing and Failure Analysis is widely recognized as the most important global event for semiconductor failure analysis, advanced packaging, and microelectronics reliability. With that context, we can look more closely at what this year’s ISTFA revealed and how the event reflected the industry’s direction.
The Faculty of Civil Engineering at the Czech Technical University in Prague (CTU) has commissioned a new Tescan AMBER X electron microscope equipped with a xenon plasma focused ion beam (Xe plasma FIB). The system strengthens the university’s ability to study construction materials with precision suited for long-term scientific work.
The SEMT Meeting 2025 brings the microscopy community together to share practical insights that strengthen day-to-day research. Scientists and technicians rely on clear, dependable imaging to make confident decisions, and events like SEMT help by connecting users with peers who understand real laboratory challenges.
Jana Šilarová
Marketing Director
+420 778 788 844
media@tescan.com