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Making Headlines

Get a closer look at what’s happening at Tescan through the latest news, media coverage, and stories from across our global community.

Press releases

5 January

Tescan Announces Carlyle Agreement with Shimadzu Corporation

Tescan announces that Carlyle, together with the other shareholders, has entered into a definitive agreement with Shimadzu Corporation for the sale of the company, resulting in a change in Tescan’s shareholding structure.

23 September

Tescan acquires FemtoInnovations and launches Laser Technology Business Unit

Tescan Group today announced the acquisition of FemtoInnovations, a leading innovator in ultrafast laser technologies, and the creation of a dedicated Laser Technology Business Unit (LT BU) headquartered at the University of Connecticut (UConn) Tech Park.

1 September

Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery

CEO Jean-Charles Chen shares how the rebrand goes beyond design, marking Tescan’s evolution from product maker to solutions partner - committed to “Accelerating the Art of Discovery.”

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In the news

05 January

From Early Methods to Today’s Challenges: Dr. Gorelik on 3D-ED

we welcomed Dr. Tatiana Gorelik, a pioneer in electron crystallography, for a focused session on 3D electron diffraction (3D-ED). Her visit was part of our ongoing commitment to working side-by-side with the scientific community to improve instrumentation and support advanced analytical techniques.

17 December

iCT Conference 2026 in Linz

The iCT Conference returns to Linz from 10 to 13 February 2026, bringing researchers, engineers, and industry teams together at FH OOE, Linz Campus. As a sponsor, Tescan will take part throughout the event with a booth and an industry-day presentation focused on advancing in-situ micro-CT. The week offers keynotes, technical sessions, short talks, posters, and lab tours across both Linz and Wels campuses.

15 December

ISTFA 2025: Complete Event Overview and How Tescan Stood Out

ISTFA 2025 took place from November 16 to 20 at the Pasadena Convention Center in California. The International Symposium for Testing and Failure Analysis is widely recognized as the most important global event for semiconductor failure analysis, advanced packaging, and microelectronics reliability. With that context, we can look more closely at what this year’s ISTFA revealed and how the event reflected the industry’s direction.

12 December

Enhances Construction Materials Research Through Tescan FIB-SEM Technology

The Faculty of Civil Engineering at the Czech Technical University in Prague (CTU) has commissioned a new Tescan AMBER X electron microscope equipped with a xenon plasma focused ion beam (Xe plasma FIB). The system strengthens the university’s ability to study construction materials with precision suited for long-term scientific work.

For Media

For media

Jana Šilarová
Marketing Director

+420 778 788 844
media@tescan.com