See Where Tescan Is Making Headlines

Get a closer look at what’s happening at Tescan through the latest news, media coverage, and stories from across our global community.

Press releases

March 19, 2026

Tescan opens new Korea demo lab supporting semiconductor analysis

Tescan offers on‑site demos in a new scanning electron microscopy lab in Korea, supporting the semiconductor industry, research institutions and universities with FIB‑SEM expertise.

PRESS RELEASE
Tescan Opens New Demo Lab in Korea to Support Semiconductor Failure Analysis, Reliability, and Academic Research
January 5, 2026
PRESS RELEASE

Tescan Announces Carlyle Agreement with Shimadzu Corporation

Carlyle and other shareholders have entered into an agreement with Shimadzu Corporation that may result in a change in Tescan’s shareholding structure, subject to approvals.

November 18, 2025
PRESS RELEASE

Tescan Expands Semiconductor Workflows with FemtoChisel Laser Technology

Tescan introduces the FemtoChisel femtosecond laser platform, delivering faster, more precise semiconductor sample preparation and integrated workflow performance.

September 16, 2025
PRESS RELEASE

Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery

Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery

IN THE News

Blog

Micro-CT to FIB-SEM Failure Analysis Workflow | Advanced Packaging

Discover how Micro-CT, ultrafast laser processing, and FIB-SEM create a faster, more reliable failure analysis workflow for advanced semiconductor packaging.

Blog

Sample Preparation in Electron Microscopy | SEM & TEM Guide

Learn the fundamentals of sample preparation in electron microscopy, including cleaning, coating, mounting, TEM lamella preparation, and cryo-EM workflows.

Blog

TEM Lamella Thickness vs Width in FIB Preparation | Practical Tip

Learn how TEM lamella thickness and window width influence stability during FIB preparation. Practical guidance for reducing bending, uneven polishing, and punch-through risk.

Blog

FemtoChisel™ Laser Solutions for Semiconductor Sample Preparation

Discover how FemtoChisel™ laser solutions enable precise and efficient sample preparation workflows, supporting advanced microscopy and materials analysis.

Discover more

For media

Your contact

Jana Silarova

Marketing Director

+420 778 788 844

jana.silarova@tescan.com 

GET IN Touch

Contact us

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Where can
you find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic

info@tescan.com

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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