Tescan opens new Korea demo lab supporting semiconductor analysis
Tescan offers on‑site demos in a new scanning electron microscopy lab in Korea, supporting the semiconductor industry, research institutions and universities with FIB‑SEM expertise.
WEBINAR | Correlated Microanalytical Workflows for Particle Analysis Using Automated Mineralogy, FIB-SEM and SIMS
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Tescan offers on‑site demos in a new scanning electron microscopy lab in Korea, supporting the semiconductor industry, research institutions and universities with FIB‑SEM expertise.
Carlyle and other shareholders have entered into an agreement with Shimadzu Corporation that may result in a change in Tescan’s shareholding structure, subject to approvals.
Tescan introduces the FemtoChisel femtosecond laser platform, delivering faster, more precise semiconductor sample preparation and integrated workflow performance.
Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery
Discover how Micro-CT, ultrafast laser processing, and FIB-SEM create a faster, more reliable failure analysis workflow for advanced semiconductor packaging.
Learn the fundamentals of sample preparation in electron microscopy, including cleaning, coating, mounting, TEM lamella preparation, and cryo-EM workflows.
Learn how TEM lamella thickness and window width influence stability during FIB preparation. Practical guidance for reducing bending, uneven polishing, and punch-through risk.
Discover how FemtoChisel™ laser solutions enable precise and efficient sample preparation workflows, supporting advanced microscopy and materials analysis.
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