Get a closer look at what’s happening at Tescan through the latest news, media coverage, and stories from across our global community.
Tescan Group today announced the acquisition of FemtoInnovations, a leading innovator in ultrafast laser technologies, and the creation of a dedicated Laser Technology Business Unit (LT BU) headquartered at the University of Connecticut (UConn) Tech Park.
The week at the 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2025) in Penang from August 5 to 8 delivered what the semiconductor industry needs most: education, practical discussion, and forward-looking solutions.
CEO Jean-Charles Chen shares how the rebrand goes beyond design, marking Tescan’s evolution from product maker to solutions partner — committed to “Accelerating the Art of Discovery.”
Discover how Tescan is shaping the future of semiconductor analysis through smarter workflows, automation, and closer regional collaboration. Hear insights from Hervé Macé and Sean Lee in their exclusive DIGITIMES interview. Learn how Tescan’s integrated solutions help engineers move from insight to decision faster.
Follow Tescan on LinkedIn to get the latest updates on new solutions, webinars, application insights, expert content, and events. Right where you already are.
Tescan was proud to sponsor the 2025 CMC Workshop, a premier gathering of experts in materials characterization and electron microscopy. The event provided a dynamic platform to exchange insights, demonstrate new technologies, and strengthen partnerships within the research community.
Discover how Tescan is shaping the future of semiconductor analysis through smarter workflows, automation, and closer regional collaboration. Hear insights from Hervé Macé and Sean Lee in their exclusive DIGITIMES interview. Learn how Tescan’s integrated solutions help engineers move from insight to decision faster.
October brings two exciting opportunities to connect with TESCAN experts and explore our solutions for cutting-edge research. Whether you’re uncovering the molecular processes of life at the EMBO | EMBL Symposium in Heidelberg or advancing materials analysis at the Metallography Conference in Bochum, we’ll be there to share insights, demonstrate our innovations, and discuss how our technology can support your discoveries.
On September 16–17, 2025, the University of Leeds and the Royal Microscopy Society hosted a workshop on 4D-STEM and 3D-ED applications, featuring global experts and Tescan’s strategic partners. A major highlight was the focus on TENSOR, with live demonstrations and results from 3D PED experiments presented by leading researchers. The event was praised for its strong scientific content and organization, further strengthening TENSOR’s visibility in advanced materials research.
Linda Bilal
Senior Marketing Manager
+420 778 788 844
linda.bilal@tescan.com
