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See Where Tescan Is Making Headlines

Get a closer look at what’s happening at Tescan through the latest news, media coverage, and stories from across our global community.

Press releases

January 5, 2026

Tescan Announces Carlyle Agreement with Shimadzu Corporation

Carlyle and other shareholders have entered into an agreement with Shimadzu Corporation that may result in a change in Tescan’s shareholding structure, subject to approvals.

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PRESS RELEASE
Tescan Shareholding Update Involving Shimadzu Corporation
November 18, 2025
PRESS RELEASE

Tescan Expands Semiconductor Workflows with FemtoChisel Laser Technology

Tescan introduces the FemtoChisel femtosecond laser platform, delivering faster, more precise semiconductor sample preparation and integrated workflow performance.

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September 16, 2025
PRESS RELEASE

Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery

Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery

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IN THE News

NEWS

Interview | Andy Brown - 4D-STEM for Beam-Sensitive Materials

Discover how 4D-STEM and TESCAN TENSOR enable dose-efficient analysis of beam-sensitive materials, advancing electron diffraction and structural research.

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NEWS

Call for Proposals | UniTOM XL Dynamic CT Beam Time

Submit your proposal for one week of dynamic X-ray CT beam time on Tescan UniTOM XL in Warrendale, PA. Deadline: 31 March 2026.

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NEWS

Micro-CT & Plasma FIB-SEM for Multiscale Characterization

Discover how integrating micro-CT and plasma FIB-SEM enables multiscale 3D characterization of heterogeneous materials, linking structure, and performance.

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NEWS

How to Reduce EBL Stitching on a Standard SEM

Learn how to reduce EBL stitching errors on a standard SEM using technological layers and smart write-field placement in a GDSII workflow.

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For media

Your contact

Jana Silarova

Marketing Director

+420 778 788 844

jana.silarova@tescan.com 

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you find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic

info@tescan.com

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