Enable reproducible results and protect fragile devices for reliable outcomes that advance semiconductor failure analysis. Tescan FIB-SEM, laser, and micro-CT deliver repeatable, non-destructive results so you can isolate faults, prepare TEM lamellae, and validate advanced packaging.
Achieve precise fault isolation in semiconductor failure analysis without damaging fragile device layers. Tescan FIB-SEM workflows deliver smooth delayering with plasma milling and CAD-assisted navigation.
Endpoint detection ensures you reach the circuit of interest without artifacts, while in situ imaging and probing streamline fault localization.
Enable reliable results that strengthen device performance and accelerate decision-making in semiconductor development.
Resolve complex structural variations that impact device performance.
Tescan TENSOR with 4D-STEM delivers fast, accurate phase mapping and EBSD analysis, revealing crystallization, grain boundaries, and segregation that imaging alone cannot capture.
Beam precession and direct detection ensure high-quality diffraction data without artifacts, while automated workflows provide consistency across samples.
Deliver clear insights that speed process development and support the reliable performance of next-generation semiconductor devices.
Visualize complex semiconductor packages without destructive preparation. Tescan UniTOM micro-CT systems provide full-device 3D imaging and targeted zooms, letting you inspect solder joints, interconnects, and batteries in their true state.
Dynamic CT enables you to visualize devices under load, pressure, or temperature, while spectral CT adds material-specific contrast that reveals hidden defects.
Preserve device integrity while uncovering the root causes of failure, empowering faster, more confident decisions in semiconductor development.
Prepare clean, artifact-free cross sections in complex packages, from bond wire cross sectioning to failure analysis of BGA packaging. Tescan plasma FIB-SEM with TRUE X-sectioning and the Rocking Stage delivers large, smooth surfaces across BGAs, TSVs, MEMS, and OLEDs while preserving device integrity.
Reveal root causes with clarity so you can accelerate corrective action in advanced semiconductor packaging.
Achieve ultra-thin TEM lamella for advanced TEM sample preparation without damaging delicate device structures. Tescan FIB-SEM workflows integrate in-situ lift-out, inverted geometry, and low-keV final polishing to deliver site-specific samples with nanometer-level precision.
With Xe plasma or Ga FIB, you can prepare lamella free of artifacts, with stable transfer and preserved structural fidelity across FinFET, DRAM, and logic devices.
Produce TEM-ready samples that reveal interfaces and architectures with clarity, giving you confidence in nanoscale failure analysis and semiconductor development.
Achieve precise circuit targeting with CAD alignment and endpoint detection. Reach regions of interest without overshooting or damaging fragile device layers.
See inside complete semiconductor packages without cutting or disassembly. Reveal interconnects, solder joints, and hidden defects while preserving device integrity.
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Prepare large, artifact-free cross sections across heterogeneous materials. Maintain smooth surfaces from BGAs and TSVs to MEMS and OLED stacks for confident.
Combine structural, electrical, and elemental insights in one workflow. Capture the data you need at multiple scales without interrupting or moving your sample.
"In the semiconductor industry, we’re not just providing equipment; we’re offering complete solutions and workflows that integrate seamlessly into our customers' processes. For example, we’ve developed a large-volume ablation workflow that combines X-ray micro-CT for non-destructive analysis, femtoseconds laser combined with plasma FIB for both fast localization and detailed failure analysis. This combination allows our customers to move from a high-level, non-invasive scan to targeted, detailed investigations, optimizing both speed and accuracy. Given the high sample throughput requirements in this industry, our customers need workflows that are not only efficient but scalable. With Tescan, we offer connected systems that can handle the complexity and volume of today’s semiconductor research demands."
Built for semiconductor failure analysis, AMBER X 2 lets you perform fast, large-area delayering and cross-sectioning while protecting device integrity.
With SOLARIS X 2, you prepare high-quality TEM lamellae from the most advanced nodes while preserving structural fidelity.
UniTOM gives you non-destructive 3D imaging of entire semiconductor packages, revealing hidden defects without cutting or disassembly.
TENSOR provides fast, reliable phase and orientation mapping, helping you understand complex crystallographic behavior in next-generation devices.
The Rocking Stage lets you polish smooth, high-quality cross sections in heterogeneous materials where conventional approaches fall short.
TRUE X-sectioning enables you to prepare extra-large-area cross sections with exceptional surface quality for package-level failure analysis.
