WEBINAR | Up to 40% Faster Automated TEM Lamella Preparation with new Ga⁺ FIB Column

Discover TESCAN’s

Achieve Fast, Precise Ex Situ Lift-Out
with Tescan EXLO

Tescan EXLO is a high-precision ex situ lift-out system that increases throughput and reduces both TEM costs and FIB-SEM load. External specimen handling enables parallel processing and higher prep efficiency. Its motorized, semi-automated design ensures fast, reproducible lift-outs while freeing the FIB-SEM for priority tasks. Improve TEM prep efficiency with consistent, reliable lift-outs.

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Tescan EXLO

Scale your semiconductor workflows with fast, dependable ex situ lift-out

Tescan EXLO streamlines ex situ lift-out with a motorized XYZR manipulator, parfocal zoom optics, and intuitive software. It supports samples up to 50 mm, coordinate import/export, and optional upgrades. Increase throughput and cut specimen costs with full compatibility across multiple FIBs and TEM AutoPrep Pro™.

Key benefits

  • Reduce the cost per TEM specimen 
  • Maximize FIB-SEM utilization
  • Increase lab efficiency
  • Ensure high-quality, reproducible TEM results across high specimen volumes
  • Assure specimen stability and attachment reliability
  • Ensure the integrity of air-sensitive and cryo-prepared specimens

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Explore the system that moves your research forward

Tescan instruments are designed to help you get answers. Fast and precisely. Talk to our experts and see the solution in action.

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Where can
you find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic

info@tescan.com

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