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UHR SEM with TriLens™ immersion optics for the ultimate characterization of nanomaterials

Tescan MAGNA

MAGNA
MAGNA

Tescan MAGNA is designed for high-performance surface characterization of nanomaterials. Its Triglav™ SEM column delivers ultra-high-resolution imaging, particularly at low beam energies, and the integrated In-Beam detection system enables energy-filtered and angle-resolved backscattered electron contrast.

The TESCAN Essence™ interface offers a customizable, intuitive environment with dedicated modules for streamlined operation.

  • Ultra-high resolution and high-contrast imaging of next-gen materials

  • Unique TriBE™ and TriSE™ detection for advanced nano characterization

  • Optimal imaging and analytical conditions guaranteed by TESCAN In-Flight Beam Tracing™

Where Tescan MAGNA

makes the difference

Sub-nanometer Resolution Across All Voltages

The Triglav™ SEM column delivers crisp, ultra-high-resolution imaging down to 0.5nm at 30 keV, ensuring accurate visualization of even the finest nanostructures.

Flexible SEM and STEM Imaging in One Platform

Observe surface topography and internal features with SEM and STEM, enabling comprehensive characterization of nanoparticles, nanotubes, and porous frameworks.

High-Contrast Detection for Complex Materials

The TriSE and TriBSE detection system provides selective energy and angular filtering, revealing structural and compositional details in black silicon, catalytic materials, and other challenging samples.

Effortless Imaging Setup and Switching

With In-Flight Beam Tracing™ and automated beam alignment, researchers can rapidly establish optimal conditions and transition between imaging and analytical modes without workflow interruptions.

Safe, Multi-User SEM Operation

Essence™ software with a live 3D collision model ensures straightforward operation, making MAGNA safe to operate instrument.

Automation and Scripting for Advanced Workflows

Use VisualCoder SEM automation or the SEM Expert PI to standardize workflows, automate repetitive tasks, and or prototype new experiments.

Tescan MAGNA Applications

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Tescan MAGNA in Materials Science

Tescan MAGNA is designed for researchers pushing the boundaries of science. Whether it’s imaging delicate porous frameworks, analyzing nanoparticle dispersions, or resolving complex nanostructures, MAGNA delivers clarity and precision at the sub-nanometer scale.

  • High-contrast nanoparticle imaging with TriSE and TriBSE detection systems
  • In-Flight Beam Tracing™ for effortless, repeatable imaging and rapid condition switching
  • Safe, multi-user operation enabled by Essence™ software and live 3D collision modeling
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Tescan MAGNA

Technical specification

Tescan MAGNA

Electron source
High-brightness Schottky field electron emitter
Resolution
0.5 nm at 30 keV (STEM*), 0.6 nm at 15 keV; 0.9 nm at 1 keV (BDT*)
Electron beam landing energy
200 eV – 30 keV (<50 eV with BDT*)
Magnification range
Up to 2,000,000×
Standard detectors and accessories
In-Beam SE, In-Beam BSE (energy filtered), Mid-angle BSE, Everhart–Thornley SE detector, IR camera, Integrated plasma cleaner, pA meter
Optional detectors and accessories
Chamber BSE detectors, HADF R-STEM, CL, GSD, 3rd party detectors and analyzers, Electrostatic Beam Blanker, etc.
System options
Beam Deceleration Technology (BDT), ONCam (Optical Navigation and Correlation Camera), Load locks, Electron Beam Lithography (EBL), etc
Analytical integration
Compatible with 3rd party EDS, EBSD, WDS, and Raman spectroscopy (RISE™)
Stage movement
Motorized 5-axis stage (X, Y, Z, R, T)
Chamber
Large analytical chamber supporting multiple detectors and accessories
Vacuum modes
High-vacuum mode, MultiVac™ mode (N₂ or H₂O)
Automation
SEM Expert PI and VisualCoder™ for workflow automation, Essence™ Image Snapper for batch imaging and panorama creation
User interface
Essence™ GUI with intuitive control environment for imaging and analysis including live 3D collision model

Tescan MAGNA

Electron source
High-brightness Schottky field electron emitter
Resolution
0.5 nm at 30 keV (STEM*), 0.6 nm at 15 keV; 0.9 nm at 1 keV (BDT*)
Electron beam landing energy
200 eV – 30 keV (<50 eV with BDT*)
Magnification range
Up to 2,000,000×
Standard detectors and accessories
In-Beam SE, In-Beam BSE (energy filtered), Mid-angle BSE, Everhart–Thornley SE detector, IR camera, Integrated plasma cleaner, pA meter
Optional detectors and accessories
Chamber BSE detectors, HADF R-STEM, CL, GSD, 3rd party detectors and analyzers, Electrostatic Beam Blanker, etc.
System options
Beam Deceleration Technology (BDT), ONCam (Optical Navigation and Correlation Camera), Load locks, Electron Beam Lithography (EBL), etc
Analytical integration
Compatible with 3rd party EDS, EBSD, WDS, and Raman spectroscopy (RISE™)
Stage movement
Motorized 5-axis stage (X, Y, Z, R, T)
Chamber
Large analytical chamber supporting multiple detectors and accessories
Vacuum modes
High-vacuum mode, MultiVac™ mode (N₂ or H₂O)
Automation
SEM Expert PI and VisualCoder™ for workflow automation, Essence™ Image Snapper for batch imaging and panorama creation
User interface
Essence™ GUI with intuitive control environment for imaging and analysis including live 3D collision model
MAGNA 2

GET IN Touch

Contact us

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Where you can find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic



info@Tescan.com