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Tescan VEGA SEM 

VEGA
VEGA

Tescan  VEGA Scanning Electron Microscope (SEM) with tungsten filament electron source combines SEM imaging and elemental composition analysis in a single window of TESCAN’s Essence™ software. This significantly simplifies acquisition of both morphological and elemental data from the sample, making VEGA SEM an efficient analytical solution for routine materials inspection in quality control,
failure analysis and research labs.

With intuitive navigation, dependable beam performance, and flexible detector options, VEGA provides reliable, user-friendly SEM for routine analytical work.

  • Navigate large or complex samples effectively with Wide Field Optics™ providing a clear SEM overview at low magnification

  • Correlate morphology and elemental composition with integrated Essence™ EDS.

  • Maintain optimal imaging conditions automatically with In-Flight Beam Tracing™

  • Image non-conductive or beam-sensitive samples using SingleVac™ or MultiVac with gaseous SE detection

  • Protect detectors and samples with the Essence™ 3D Collision Model

HOW TESCAN VEGA ENHANCES SEM WORKFLOWS

FOR MATERIALS ANALYSIS AND INSPECTION

Navigate Samples Easily with Wide Field Optics™

Begin with a clear SEM overview at magnifications as low as 2×. Wide Field Optics™ supports fast, confident movement across large, complex, or tilted samples without switching to an optical camera.

Achieve Reliable Imaging and Analysis with In-Flight Beam Tracing™

Maintain optimal imaging and analytical conditions automatically and switch between them with a single click. No need for mechanical adjustments.

Analyze Composition Rapidly with Integrated Essence™ EDS

Correlate morphology and elemental data in the same live SEM window. Essence™ EDS streamlines setup and provides instant access to spectra, maps, and profiles.

Image Non-Conductive or Sensitive Samples with Low Vacuum modes Modes

Use SingleVac™ for quick charge reduction or MultiVac with gaseous SE detection to capture detailed topography on uncoated, beam-sensitive, or outgassing materials.

Protect Hardware with the Essence™ 3D Collision Model

Move with confidence during stage rotations or tilt. VEGA’s real-time 3D collision simulation models detectors, samples, and chamber geometry to prevent unwanted contact.

Expand Analytical Capability with Modular Detector Options

Adapt workflows with optional BSE detectors, CL, ONCam™ optical navigation or other detectors. VEGA supports scalable analytical configurations for evolving laboratory needs.

TESCAN VEGA APPLICATIONS

Application area=MS
Tescan VEGA in Materials Science

Reliable SEM imaging and microanalysis for diverse materials

  • Perform detailed topography and morphology analysis using stable SE and BSE imaging
  • Correlate morphology and composition instantly with fully integrated Essence™ EDS.
  • Handle non-conductive or beam-sensitive samples using SingleVac™ or MultiVac low vacuum modes
  • Support characterization across metals, ceramics, polymers, and composites with flexible detector configurations

Tescan VEGA enables researchers to investigate microstructures, defects, and composition efficiently across a wide range of materials. Consistent beam performance, intuitive navigation, and integrated EDS help users generate repeatable, actionable data for research and routine laboratory workflows.

Tescan VEGA in Industrial Inspection & Quality Control

Fast, dependable SEM workflows for routine inspection tasks

  • Verify surface features and defects quickly with high-contrast SE/BSE imaging
  • Assess coatings, interfaces, and fractures with stable imaging
  • Perform rapid compositional checks using Essence™ EDS in the SEM window
  • Inspect large or bulky samples supported by VEGA’s spacious GM chamber and wide stage travel

Quality control teams benefit from VEGA’s streamlined operation, rapid transitions between imaging and EDS, and dependable low-vacuum options for unprepared samples. VEGA supports repeatable inspections that reduce time-to-decision across manufacturing and failure-prevention workflows.

Tescan VEGA in Research & Multi-User Facilities

User-friendly SEM operation for shared environments

  • Begin workflows easily with Wide Field Optics™ and low-magnification live navigation
  • Simplify operation for all experience levels using customizable Essence™ software layouts
  • Prevent hardware collisions with the real-time Essence™ 3D Collision Model
  • Expand capabilities as research evolves with optional CL, advanced BSE detectors, and other extensions

VEGA supports academic, government, and institutional labs that require a reliable, flexible SEM for diverse projects and multiple users. Its balance of usability, analytical capability, and robust hardware makes it an ideal platform for teaching, training, and collaborative research.

Tescan ESSENCE™

UNIFIED CONTROL FOR IMAGING AND ANALYSIS

ESSENCE™ is the unified control graphical user interface for Tescan VEGA, bringing SEM imaging, EDS analysis, navigation, and system protection tools into a single interface. It keeps routine workflows efficient and consistent, whether used in materials research, industrial inspection, or multi-user facilities.

  • Access spectra, elemental maps, and imaging data within a single integrated Essence™ contol interface
  • Maintain consistent beam performance with In-Flight Beam Tracing™
  • Navigate confidently using the real-time Essence™ 3D Collision Model to protect detectors and samples
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Tescan VEGA

Technical specifications

Tescan VEGA

Electron column 

Tungsten thermionic emitter with aperture-less optics and In-Flight Beam Tracing™ for stable beam performance

Resolution

3 nm @ 30 kV (high vacuum); 3.4 nm @ 30 kV in low vacuum with GSD detector; 8 nm @ 3 kV;,

Vacuum modes

Standard SingleVac™ for charge reduction; MultiVac low-vacuum mode with gaseous SE detector (GSD) for imaging non-conductive and outgassing samples

Stage

5-axis motorized compucentric stage; supports specimens up to 180 mm diameter with full XY movement and rotation (larger samples possible with limited travel and rotation). 

Detectors 

SE and BSE detectors (optional); optional advanced BSE detectors, CL, and ONCam optical navigation camera

Microanalysis

Integrated Essence™ EDS for SEM–EDS correlation, spectral mapping, and compositional profiling within a unified interface. 

Automation 

Automated beam optimization, and Essence™ 3D Collision Model for hardware protection 

Tescan VEGA

Electron column 

Tungsten thermionic emitter with aperture-less optics and In-Flight Beam Tracing™ for stable beam performance

Resolution

3 nm @ 30 kV (high vacuum); 3.4 nm @ 30 kV in low vacuum with GSD detector; 8 nm @ 3 kV;,

Vacuum modes

Standard SingleVac™ for charge reduction; MultiVac low-vacuum mode with gaseous SE detector (GSD) for imaging non-conductive and outgassing samples

Stage

5-axis motorized compucentric stage; supports specimens up to 180 mm diameter with full XY movement and rotation (larger samples possible with limited travel and rotation). 

Detectors 

SE and BSE detectors (optional); optional advanced BSE detectors, CL, and ONCam optical navigation camera

Microanalysis

Integrated Essence™ EDS for SEM–EDS correlation, spectral mapping, and compositional profiling within a unified interface. 

Automation 

Automated beam optimization, and Essence™ 3D Collision Model for hardware protection 

VEGA 2

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Where can you find us: 

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.479653 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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