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Novel Automated Platform for Analytical STEM and 4D-STEM Characterization 

Tescan TENSOR

TENSOR-2
TENSOR-2

Tescan TENSOR™ delivers fast, multimodal characterization of nanoscale morphological, chemical, and structural properties. It uses STEM imaging, EDS analysis, and advanced 4D-STEM as well as 3D-ED and STEM/EDS tomography workflows. Fully integrated beam precession provides enhanced quality of diffraction data that results in higher accuracy and precision of strain analysis and phase-orientation mapping measurements. With Tescan TENSOR™ you can make confident decisions with data you can trust.

  • Characterize samples by multiple modalities using BF/DF STEM imaging, EDS analysis, 3D STEM/EDS tomography, and advanced 4D-STEM and/or 3D-ED workflows.

  • Increase yield and reproducibility with automatic microscope alignments that are done in the background with no user intervention.

  • Boost productivity with high-speed, high-sensitivity detectors that maintain fast acquisition across all modalities.

  • Speed up 4D-STEM workflows with fast beam precession and on-the-fly data processing and analysis.

  • Improve diffraction data quality through fully integrated and synchronized beam precession.

  • Minimize sample contamination to preserve data quality in the near-UHV vacuum environment of the microscope.

  • Support users at every experience level with automation and guided workflows that assure optimal conditions for data acquisition.

How TENSOR™

Accelerates Productivity and Scientific Output

Navigate Samples Easily with the Specimen Overview Map

Begin every session with a clear view of your specimen. The overview map helps you locate regions of interest quickly and intuitively, so you can move across complex samples with confidence.

Work Seamlessly with Automatic Background Alignments

Maintain stable microscope conditions at all analytical modes without interruption. TENSOR™ performs alignments in the background, allowing you to focus on your analysis rather than manual setup.

Enhance Diffraction Data with One-Click Beam Precession

Improve diffraction pattern quality instantly. Beam precession is fully integrated and activated in a single click, including very robust automatic alignments, giving you cleaner, richer, and more interpretable data.

Streamline Experiments with Guided Measurement Workflows

Use predefined optical settings, automated alignments, and simple parameter controls to keep your workflow consistent. On-the-fly processing and analysis help you reach results faster.

Increase Throughput with High-Speed Acquisition

Collect data up to ten times faster and shorten your time to multimodal results by a factor of four. TENSOR™ helps you progress through demanding studies without delay.

Train New Users Quickly with Sample-Analysis Oriented Workflows

Support new researchers with intuitive and sample-analysis oriented workflows with microscope setting presets, while microscope alignments and tuning are done automatically in the background. TENSOR™ reduces the learning curve so your team can become productive much sooner.

Bringing added value across industries

with Electron Microscopy Solutions
_ Application area icon
Tensor in MS

Tescan TENSOR analytical STEM diffraction microscope transforms nanoscale characterization of material structure and composition with much higher productivity compared to the traditional TEM/STEM systems on the market.

Fast, multimodal characterization of nanoscale morphological, chemical, and structural properties of functional materials, thin films, synthetic particles, and other samples is achieved flawlessly due to high levels of automation. For conventional STEM imaging and EDS compositional analysis, or advanced 4D-STEM and 3D-ED workflows, diffraction data quality is enhanced by fully integrated and synchronized beam precession.

  • Characterize samples by multiple modalities using BF/DF STEM imaging, EDS analysis, STEM/EDS tomography, and advanced 4D-STEM and 3D-ED workflows.

  • Increase yield and reproducibility with automatic microscope alignments that are done in the background with no user intervention.

  • Boost productivity with high-speed, high-sensitivity detectors that maintain fast acquisition across all modalities.

  • Speed up 4D-STEM workflows with fast beam precession and on-the-fly data processing and analysis.

  • Improve diffraction data quality through fully integrated and synchronized beam precession.

  • Minimize contamination and preserve signal integrity in the near-UHV vacuum environment of the microscope.

  • Support users at every level of experience with automation and guided workflows that optimize key parameters.

TENSOR gives you the clarity needed to understand the underlying structural and compositional characteristics of materials and relate them to their physical and functional properties. Its multimodal analytical STEM workflows help you bring structure, chemistry, and crystallography together in one sample analysis session.

tensor_MS

TESCAN TENSOR™ APPLICATIONS

_ Application area icon Frame 903
Tescan TENSOR™ in Materials Science
Transforming TEM/STEM characterization of materials 

Tescan TENSOR analytical STEM diffraction microscope transforms nanoscale characterization of material structure and composition with much higher productivity compared to the traditional TEM/STEM systems on the market.

Fast, multimodal characterization of nanoscale morphological, chemical, and structural properties of functional materials, thin films, synthetic particles, and other samples is achieved flawlessly due to high levels of automation. For conventional STEM imaging and EDS compositional analysis, or advanced 4D-STEM and 3D-ED workflows, diffraction data quality is enhanced by fully integrated and synchronized beam precession.

  • Characterize samples by multiple modalities using BF/DF STEM imaging, EDS analysis, STEM/EDS tomography, and advanced 4D-STEM and 3D-ED workflows.

  • Increase yield and reproducibility with automatic microscope alignments that are done in the background with no user intervention.

  • Boost productivity with high-speed, high-sensitivity detectors that maintain fast acquisition across all modalities.

  • Speed up 4D-STEM workflows with fast beam precession and on-the-fly data processing and analysis.

  • Improve diffraction data quality through fully integrated and synchronized beam precession.

  • Minimize contamination and preserve signal integrity in the near-UHV vacuum environment of the microscope.

  • Support users at every level of experience with automation and guided workflows that optimize key parameters.

TENSOR gives you the clarity needed to understand the underlying structural and compositional characteristics of materials and relate them to their physical and functional properties. Its multimodal analytical STEM workflows help you bring structure, chemistry, and crystallography together in one sample analysis session.

TENSOR-app-MS

TENSOR Applications

for Characterization of Nanoparticles
TENSOR Applications for Characterization of Nanoparticles

Accurate structural and chemical insight at the nanoscale

  • Identify nanoscale structure and chemistry with combined STEM imaging, 4D-STEM mapping, and EDS elemental analysis
  • Resolve crystallographic grains and their orientation using nanobeam diffraction and precession-assisted 4D-STEM
  • Map elemental distributions within complex materials and nanoparticle systems using high-sensitivity EDX
  • Support advanced materials research across academic and industrial environments

TENSOR gives you the clarity needed to understand the underlying structural and compositional characteristics of materials and relate them to their physical and functional properties. Its multimodal analytical STEM workflows help you bring structure, chemistry, and crystallography together in one sample analysis session.

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Tescan TENSOR™

Technical specification

Electron Source 

Source type 

Shottky Field Emission Gun 

Acceleration voltage  

100 kV 

Beam current @ 1-nm probe size 

2.5 nA 

Electron Optics 

Condenser system 

3-lens condenser 

Electrostatic Beam blanker 

up to 1 MHz blanking rate 

Beam Precession 

  - precession rate 

  - precession semiangle 

  - alignments 

Fully integrated (on/off) 

 72,000 Hz 

 0.1-3.0° 

 fast and fully automated 

Diffraction size (radius) 

10-400 mrad (user tunable) 

STEM Resolution 

>2.8 Å 

BF/DF STEM Detectors 

Detector type 

Scintilator-based STEM detectors 

ADF/HAADF collection semiangle 

from 2-20 mrad to 80-800 mrad (user tunable) 

EDX Detectors 

Detector type 

SDD 

Sensor size 

2x 100 mm^2 

Total collection solid angle 

1.6 srad 

Diffraction Detector 

Detector type 

Dectris Quadro 

Sensor technology 

hybrid-pixed direct detector 

Sensor size 

512 x 512 pixels 

Physical pixel size 

75x75 µm^2 

Max readout speed (frame rate) 

4,500 fps (full sensor resolution) 

Maximum count rate 

> 10^7 electrons/pixel/s 

DQE(0) 

>0.9 @100kV 

Specimen Stage 

Vacuum at specimen 

< 0.5 x 10^6 Pa (near-UHV) 

Single tilt tomography holder 

up to ±87° 

Double tilt holder 

alpha = up to ±30°

beta = up to ±20°

Electron Source 

Source type 

Shottky Field Emission Gun 

Acceleration voltage  

100 kV 

Beam current @ 1-nm probe size 

2.5 nA 

Electron Optics 

Condenser system 

3-lens condenser 

Electrostatic Beam blanker 

up to 1 MHz blanking rate 

Beam Precession 

  - precession rate 

  - precession semiangle 

  - alignments 

Fully integrated (on/off) 

 72,000 Hz 

 0.1-3.0° 

 fast and fully automated 

Diffraction size (radius) 

10-400 mrad (user tunable) 

STEM Resolution 

>2.8 Å 

BF/DF STEM Detectors 

Detector type 

Scintilator-based STEM detectors 

ADF/HAADF collection semiangle 

from 2-20 mrad to 80-800 mrad (user tunable) 

EDX Detectors 

Detector type 

SDD 

Sensor size 

2x 100 mm^2 

Total collection solid angle 

1.6 srad 

Diffraction Detector 

Detector type 

Dectris Quadro 

Sensor technology 

hybrid-pixed direct detector 

Sensor size 

512 x 512 pixels 

Physical pixel size 

75x75 µm^2 

Max readout speed (frame rate) 

4,500 fps (full sensor resolution) 

Maximum count rate 

> 10^7 electrons/pixel/s 

DQE(0) 

>0.9 @100kV 

Specimen Stage 

Vacuum at specimen 

< 0.5 x 10^6 Pa (near-UHV) 

Single tilt tomography holder 

up to ±87° 

Double tilt holder 

alpha = up to ±30°

beta = up to ±20°

TENSOR 2

GET IN Touch

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Where can you find us: 

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 30.052597 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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