Where speed, quality, and correlation converge, Tescan FemtoChisel transforms semiconductor analysis.
Handle any material with precision and achieve flawless results every time.

Tescan FemtoChisel the first system where speed, quality, and correlation converge — accelerating inspection, failure analysis and targeted internal access, lowering cost-per-sample while handling the most heterogeneous materials in todays and tomorrow’s microelectronics. One platform, any sample, pristine results.

Key benefits

• Intelligent Multi-Gas Processing – Thermodynamically controlled gas delivery that tracks the laser in real time for optimal, debris-free ablation.
• Laser Protective Layer (LPL) – Applied and removed within seconds without moving the sample, protecting underlying structures from beam damage.
• Correlative Machine Vision & Targeting – Multi-resolution digital microscopy that learns from other imaging modes to automatically target regions of interest with sub-micron precision.
• Software-Selectable Laser Wavelength – Dual-laser performance in one system with instant, software-controlled wavelength switching for broader material compatibility and streamlined workflows.