WEBINAR | Up to 40% Faster Automated TEM Lamella Preparation with new Ga⁺ FIB Column

Discover TESCAN’s

FemtoChisel
for high-precision semiconductor sample prep

FemtoChisel gives you nanometer-level precision and high-throughput intelligent laser processing for semiconductor research and failure analysis. It delivers pristine surfaces while significantly reducing the need for subsequent FIB polishing. Accelerate turnaround in device analysis and failure investigation for current and next-generation semiconductor materials. 
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Tescan FemtoChisel

Achieve Pristine Laser Surfaces for Faster Semiconductor Analysis 

Tescan FemtoChisel is the first system where speed, quality, and correlation come together to accelerate inspection, failure analysis, and targeted internal access. It lowers cost-per-sample while giving you reliable performance on today’s and tomorrow’s most heterogeneous semiconductor materials. Deliver repeatable, high-quality outcomes across every workflow. 

Key benefits  

  • Intelligent Multi-Gas Processing: Real-time gas control tracks the laser for optimal, debris-free ablation.

  • Laser Protective Layer (LPL): Apply and remove protection within seconds to prevent beam damage without moving the sample.

  • Correlative Machine Vision & Targeting: Multi-resolution imaging automatically identifies and targets regions of interest with sub-micron precision.

  • Software-Selectable Laser Wavelength: Switch wavelengths instantly for broader material compatibility and smoother workflows.

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Explore the system that moves your research forward

Tescan instruments are designed to help you get answers. Fast and precisely. Talk to our experts and see the solution in action.

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Where can
you find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic

info@tescan.com

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