Automation Without Variability
Eliminate operator-dependent results with AI-driven TEM AutoPrepTM Pro automation. Every lamella is prepared with the same precision, from protection layer deposition to low keV polishing.
Automated TEM Lamella Preparation for Consistent, High-Throughput Results
Tescan SOLARIS 2 is designed for semiconductor laboratories where precision, reproducibility, and throughput are essential. With fully automated TEM lamella preparation powered by TEM AutoPrepTM Pro , SOLARIS 2 minimizes operator dependency and ensures consistent, high-quality samples. Intelligent automation and overnight alignments keep the system ready, maximizing uptime and data confidence for every analysis.
Automation Without Variability
Eliminate operator-dependent results with AI-driven TEM AutoPrepTM Pro automation. Every lamella is prepared with the same precision, from protection layer deposition to low keV polishing.
Reproducible Quality Across All Geometries
Whether top-down, inverted, or plan-view, SOLARIS 2 ensures consistent results through optimized single-step, in situlift-out workflows.
Higher Throughput, Less Downtime
Automated electron and ion column alignments keep the system ready at all times—reducing setup time and enabling continuous, unattended operation.
Minimal Beam Damage, Maximum Precision
The OrageTM 2 Ga FIB column and Triglav™ SEM optics deliver high-resolution milling and end-pointing with minimal amorphization or surface alteration.
Customizable Workflows for Every Device
Easily adapt processes for logic, memory, power, or display technologies. Switch between semi-automated and fully automated modes as your workflow demands.
Always Ready for Next-Shift Performance
With self-checking routines and overnight alignment, SOLARIS 2 maintains stable performance and reproducible precision—day after day.
Automated precision for process development and failure analysis
Fully automated TEM lamella preparation for logic, memory, and 3D NAND devices
AI-driven TEM AutoPrepTM Pro ensures consistent targeting and thickness across various samples
OptiLift™ nanomanipulator supports top-down, inverted, and plan-viewlift-out geometries
Integrated Triglav™ SEM column provides high-contrast end-point detection for advanced node structures
TescanSOLARIS 2 streamlines semiconductor workflows where reproducibility and throughput are critical. Automated routines and overnight alignments keep the system ready, enabling engineers to produce high-quality lamellae for yield analysis, process optimization, and failure diagnostics—without compromising device integrity or throughput.
Reliable automation for complex materials and device structures
High-precision Ga FIB-SEM milling for metals, ceramics, and composite interfaces
Customizable workflows for site-specific cross-sections and plan-viewlamella preparation
Stable, automated beam alignment maintains consistent quality across long sessions
Compatible with semi-automated or fully automated operation for flexible research demands
In materials science, SOLARIS 2 brings consistency to demanding sample preparation. Its intelligent automation minimizes user variability while maintaining surface integrity and structural fidelity—ideal for analyzing multi-phase materials, thin films, or nanoscale defects with reproducible accuracy.
Precision control for beam-sensitive and delicate nanostructures
Low-damage ion milling and optimized end-pointing preserve fragile nanostructures
Accurate preparation of nanowires, quantum dots, and thin-film interfaces
Supports cryo and low-voltage workflows for sensitive materials
Enables repeatable, artifact-free lamellae suitable for high-resolution TEM and STEM analysis
TescanSOLARIS 2 extends the laboratory’s capabilities into advanced nanotechnology research. Its combination of gentle milling, stable automation, and high-contrast imaging ensures the structural and chemical integrity of even the most beam-sensitive specimens—ready for nanoscale investigation with confidence.
Advanced analytical tool for 2D and 3D characterization of your biological and beam sensitive samples.
Low-keV, high-contrast BSE imaging – Reveal resin-embedded biological structures in 2D and 3D with exceptional clarity.
UHR-SEM Immersion Optics – Provides detailed imaging of delicate structural details, and thanks to the specific SE contrast also useful for volume imaging of frozen hydrated samples.
Best resolution Ga+ FIB column (< 2.5 nm resolution) with optimized ion optics for excellent performance and reproducibility
Robust Cryo and Ambient Performance
Elemental and chemical analysis – Perform FIB-SEM/EDX and TOF-SIMS on beam-sensitive biological specimens.
Tescan Essence™ Software: Designed for multi-user environments, ensuring effortless operation regardless of experience level.
Designed for precision and flexibility, SOLARIS 2 brings together low-keV, high-contrast imaging with advanced analytical and correlative workflow to clearly visualize biological ultrastructure in 2D and 3D.
TescanSOLARIS 2 integrates seamlessly with TescanTEM AutoPrep™ Pro, delivering a fully automated workflow for TEM lamella preparation inside the FIB-SEM. From trench milling to final polishing, every step is automated to ensure consistent, repeatable results with minimal operator input.
AI-driven pattern recognition and automated beam alignment streamline targeting and setup, while overnight calibration keeps the system ready for continuous operation. Integrated OptiLift™ nanomanipulator control supports top-down, inverted, and plan-viewgeometries without manual repositioning.
Combined with the Triglav™ SEM column’s high-contrast imaging for precise end-point detection, SOLARIS 2 with TEM AutoPrep™ Pro delivers reproducible, high-quality TEM samples for logic, memory, and advanced 3D device analysis.
This is more than information; it's an advantage. We've compiled our technical whitepapers, detailed product flyers, and on-demand webinars to provide you with the knowledge that makes a real difference. Sign up now to access the insights you need to make an impact.
|
Tescan SOLARIS 2 |
|
|
FIB source
|
Gallium liquid metal ion source
|
|
SEM column
|
Triglav™ UHR SEM with SE and BSE detectors
|
|
Automation
|
TEM AutoPrep™ Pro for fully automated lamella preparation Automated e-/i-beam alignments
|
|
Nanomanipulator
|
OptiLift™ below-FIB design for top-down, inverted, and planar lift-out
|
|
Sample geometries
|
Standard, inverted, plan-viewand double-cross lamella
|
|
Stage
|
5-axis motorized stage
|
|
Imaging resolution
|
< 1.0 nm @ 15 kV (SE), < 1.2nm @ 1 kV (UHR mode)
|
|
Workflow modes
|
Semi-automated and fully automated operation
|
|
Transfer compatibility
|
Cryo, vacuum, and inert-gas workflows
|
|
Workstation
|
Integrated control computer with joystick and live optical imaging
|
|
Tescan SOLARIS 2 | |
|
FIB source
|
Gallium liquid metal ion source
|
|
SEM column
|
Triglav™ UHR SEM with SE and BSE detectors
|
|
Automation
|
TEM AutoPrep™ Pro for fully automated lamella preparation Automated e-/i-beam alignments
|
|
Nanomanipulator
|
OptiLift™ below-FIB design for top-down, inverted, and planar lift-out
|
|
Sample geometries
|
Standard, inverted, plan-viewand double-cross lamella
|
|
Stage
|
5-axis motorized stage
|
|
Imaging resolution
|
< 1.0 nm @ 15 kV (SE), < 1.2nm @ 1 kV (UHR mode)
|
|
Workflow modes
|
Semi-automated and fully automated operation
|
|
Transfer compatibility
|
Cryo, vacuum, and inert-gas workflows
|
|
Workstation
|
Integrated control computer with joystick and live optical imaging
|