Reproducible Nanometer-Scale Imaging
Achieve consistent, ultra-high-resolution results across users and sessions with BrightBeam™ technology and In-Flight Beam Tracing™, ensuring stable beam conditions and repeatable imaging quality.
Tescan MIRA XR
Tescan MIRA XR accelerates data acquisition and processing with fully integrated Dual Essence™ EDS, Wide Field Optics™, and In-Flight™ Automation. It reduces time to ultra-high-resolution SEM data by at least 30% compared to conventional systems.
Automated alignment and calibration routines ensure repeatable results with minimal user input, optimizing efficiency for both routine and advanced research applications.
- Ultra-high resolution capabilities by MIRA optimized BrightBeam™ technology
- Accelerate time to data with In-Flight Beam Tracing™ and In-Flight Automatics for fast and repeatable imaging and analytical performance, even for the SEM novice users
- Effortlessly navigate samples and identify regions of interest with Wide Field Optics™, enabling magnification from 1x
- Achieve up to twice faster EDS data acquisition with reduced shading enabled by Dual Essence™ EDS
- Analyze even higly charging, beam sensitive, or outgassing samples efficiently and without any interuptions with MultiVac™ and Auto LowVac Aperture
Tescan Essence™
Unified Control for SEM Imaging and Microanalysis
Tescan Essence™ brings imaging, navigation and analytical tools into one environment, supporting clear, consistent SEM workflows for materials scientists and inspection teams. Its streamlined layout and automation features help users move efficiently from first navigation to final verification.
- Access spectra, elemental maps, and imaging data within a single integrated Essence™ SW control interface
- Maintain consistent beam performance with In-Flight Beam Tracing™
- Navigate confidently using the real-time Essence™ 3D Collision Model to protect detectors and samples
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Tescan MIRA XR in Materials Science
High-resolution SEM imaging across diverse material classes
- Examine surface morphology using stable SE imaging at low landing energies
- Differentiate phases and structures with Axial and retractable BSE detection
- Correlate composition with integrated Essence™ EDS
- Navigate large or multi-angle specimens with Wide Field Optics™
Researchers rely on MIRA XR for precise imaging of microstructures, interfaces and defects in metals, ceramics, polymers and composites. The system maintains consistent beam performance and integrates SEM–EDS in one workspace, helping you move efficiently from first inspection to clear insight.
Tescan MIRA XR in in Industrial Inspection & Quality Control
Fast, confident surface and compositional assessment
- Identify surface features and defects with high-contrast SE and BSE imaging
- Assess coatings, fractures and interfaces with stable low-keV performance
- Carry out quick composition checks using Essence™ EDS
- Work with larger parts using the spacious chamber and flexible stage travel
Inspection teams use MIRA XR to verify components, monitor manufacturing variation and identify failure modes. Reliable variable pressure imaging and short transitions between imaging and EDS support faster, more consistent evaluations.
Tescan MIRA XR in Semiconductors
SEM accessibility for shared environments
- Begin with a clear overview using Wide Field Optics™
- Support different experience levels with customizable Essence™ layouts
- Protect detectors and samples using the Essence™ 3D Collision Model
- Expand capability with optional BSE or correlative modules
Universities and research centres choose MIRA XR for its balanced combination of usability, stability and analytical flexibility. It helps teams progress varied projects without compromising data quality or workflow efficiency.
Technical specification
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