for advanced materials research
Analytical (S)TEM & 4D-STEM Characterization
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FIB-SEM Cross-sectioning and 3D Characterization
Reveal internal features and interfaces with precision
Revealing internal microstructures in three dimensions is vital for understanding performance, diagnosing failures, and optimizing processes. Tescan FIB-SEM systems combine site-specific cross-sectioning and automated serial sectioning with multimodal nanoscale analysis—including ToF-SIMS for chemical mapping, EDS for elemental composition, EBSD for crystallography, and over six different SEM contrast methods. This integration allows the creation of 3D datasets where structural, chemical, and crystallographic information are all spatially correlated within the same reconstructed volume, providing a complete picture of complex materials.
Non-destructive 3D Characterization
Explore internal structures without damaging the sample
Many research and industrial challenges require internal visualization without altering the sample. Tescan micro-CT systems offer high-resolution, non-destructive 3D and 4D imaging across scales—from sub-micron features to large industrial parts. They reveal internal geometry, porosity, cracks, and inclusions, and can track changes in situ during thermal, mechanical, or flow experiments. When combined with FIB-SEM or other analytical techniques, micro-CT forms part of a correlative 3D workflow, bridging macro- and nano-scale insight in a single characterization strategy.
SEM Surface Analysis
Analyze surface morphology, defects, and chemistry with clarity
Surface morphology often determines functional performance, durability, and quality in engineered materials. Tescan SEMs, deliver detailed surface SEM-EDS characterization, from grain boundaries and fracture features to coatings and surface treatments, across a wide range of sample types. This ability to rapidly capture both large-area overviews and fine-scale details helps researchers and engineers understand wear mechanisms, optimize surface treatments, and link processing steps to final surface properties.
Nanoprototyping
Modify nanoscale features with focused ion beam accuracy
The ability to design, shape, and test structures at the micro- and nanoscale is key to accelerating innovation in electronics, photonics, sensors, and advanced materials. Tescan FIB-SEM nanoprototyping workflows combine precise milling, deposition, and patterning with the fully integrated Tescan Electron Beam Lithography (EBL) Kit for both SEM and FIB-SEM platforms. This integration enables seamless fabrication of complex nanostructures and device features directly within the microscope. Researchers can quickly iterate designs, fabricate test structures, and evaluate performance—shortening development cycles and enabling rapid translation from concept to functional device.
TEM and APT Sample Preparation
Prepare clean, site-specific samples for high-resolution nanoanalysis
Atomic-scale characterization by TEM or atom probe tomography depends on preparing thin, site-specific specimens that preserve target structures without introducing artifacts. Tescan FIB-SEM systems provide precise, repeatable, fully automated lamella preparation workflows optimized for both Ga⁺ and plasma FIB sources. These workflows ensure high-quality samples for downstream analysis, enabling accurate structural, chemical, and crystallographic characterization at the highest resolutions.
"Tescan AMBER X 2, our latest innovation in materials analysis technology. The AMBER X 2, with its advanced Plasma FIB-SEM capabilities, offers unmatched speed, precision, and versatility, setting a new standard in the field."
PETR KLIMEK
Product Marketing Director Material & Geo Science
Tescan
for every electron microscopy
workflow
TESCAN AMBER X 2
The most precise, high throughput plasma FIB-SEM for large-volume 3D analysis and automated TEM sample preparation.
TESCAN AMBER X 2 is a universal Xe plasma FIB-SEM that enables fast material removal, automated workflows, and high-resolution analysis of complex materials. With BrightBeam™ SEM, Mistral™ plasma FIB, and multimodal analytical readiness (ToF-SIMS, EDS, EBSD, Raman), AMBER X 2 supports true nanoscale characterization and high-precision lamella prep across a range of materials and user skill levels.
- Automates large-area 3D FIB-SEM tomography, cross-sectioning and TEM prep in one system—reducing tool switching and time to data.
- Handles hard, soft, and beam-sensitive materials with clean sectioning and high-contrast imaging using field-free SEM and high-current, precise Mistral™ Xe Plasma FIB.
- Scales across applications with support for multimodal workflows and standardized software automation.
TESCAN AMBER 2
Automated Ga⁺ FIB-SEM for nanofabrication, lamella prep, and low-damage sample analysis.
TESCAN AMBER 2 integrates a high-resolution BrightBeam™ SEM column with the Orage™ Ga FIB and Gentle Argonne Ion Beam™ technology, enabling repeatable artifact-free ultra thin (20 nm) TEM specimen prep and nanoscale fabrication. Designed for repeatable lamella prep, including various geometries- plannar and inverted- and nanodevice prototyping, it simplify even the most advanced sample workflows.
- Automates TEM lamella prep with TEM AutoPrep PRO software module and final polish using <200 eV Ar ions.
- Supports nanofabrication and prototyping via FIBID, FEBID, and e-beam lithography in a single platform.
- Reduces training time and user error with full automation, preconfigured workflows, and unique wide field navigation features.
TESCAN CLARA
UHR FEG-SEM for high surface sensitivity, low-voltage imaging of complex material surfaces.
TESCAN CLARA uses a BrightBeam™ field-free SEM column to deliver nanometer-scale contrast and detail, even from the most challenging nanomaterials. Its support for BSE filtering, integrated automation, and open scripting environment enables precise analysis of beam-sensitive, magnetic, or low-conductivity materials.
- Captures sub-nanometer surface details with advanced BSE/SE filtering and no magnetic sample interference.
- Accelerates high-resolution imaging across users and projects with fast, fully automated column and beam alignment.
- Streamlines advanced multimodal workflows with fully integrated in-situ testing hardware support and user friendly scripting for dynamic and automated experiments or data acquisition.
TESCAN MIRA XR
Field-free UHR SEM-EDS for fast and repeatable high-resolution materials analysis.
TESCAN MIRA XR combines BrightBeam™ optics, Wide Field Optics™, and dual Essence™ EDS for nanometer-resolution imaging and compositional mapping. Its automated beam optimization and vacuum modes support efficient analysis of non-conductive, beam-sensitive, and outgassing materials in high-throughput lab environments.
- Delivers ultra-high-resolution imaging and live EDS in one window to support rapid QA and analysis in shared lab environment.
- Simplifies macro-to-nano navigation with Wide Field Optics™ and automated column and beam alignment—minimizing user dependent data variability.
- Supports low-vacuum imaging of delicate samples with Auto LowVac Aperture and MultiVac™ modes.
TESCAN MIRA
Flexible FEG-SEM for modular detector integration and high-current analytical workflows.
TESCAN MIRA features a Schottky FEG source, high beam current stability, and In-Flight Beam Tracing™ for efficient EDS/EBSD mapping. Designed for labs performing failure analysis or multipurpose analytical research, MIRA supports detector expansion for STEM, Raman, CL, or lithography.
- Enables fast EDS/EBSD mapping with its high-current capability and automated beam trajectory optimization (inflight Beam Tracing).
- Increases time to data and throughput with live 2× SEM-based macro navigation—no optical camera needed.
- Grows with evolving needs via modular hardware enabling flexible upgrade paths.
TESCAN TENSOR
Analytical STEM platform combining fast multimodal analysis with fully integrated precession-assisted 4D-STEM workflows.
TENSOR streamlines high-precision structural, elemental, and diffraction-based characterization with automation and on-the-fly data processing. Integrated beam precession enhances diffraction accuracy, enabling precise strain mapping and phase/orientation analysis of advanced materials. Automated platform, optimized for productivity and reproducibility, TENSOR makes complex STEM measurements accessible to users at any experience level.
- Provides the Fastest time-to-STEM-results with automated alignments and live 4D-STEM data processing—no post-acquisition delays.
- Enables high-precision strain and phase mapping by build in precession-enhanced diffraction.
- Features Fully Automated and predefined workflows making advanced analytical STEM accessible and reproducible across users and sessions.