WEBINAR | Up to 40% Faster Automated TEM Lamella Preparation with new Ga⁺ FIB Column

Advanced FIB-SEM for Automated Sample Preparation, Nanoscale Characterization and Nanoprototyping

Tescan AMBER 2

AMBER-1
AMBER-1

Tescan AMBER 2 is designed for laboratories where precision, automation, and nanoscale characterization on a wide variety of samples are essential.

  • The highest detail and imaging contrast on any sample with field-free UHR-SEM column.

  • Ultimate resolution and optimized beam profile of Ga+ FIB ensures high-quality sample preparation and comprehensive prototyping application.

  • Fully Automated TEM sample preparation - including lift out and low keV polishing - using TEM AutoPrep Pro™ for consistent lamella quality and maximized FIB-SEM utilization in your lab.

  • Advanced nanoscale prototyping through integrated electron and ion beam patterning engine and dedicated Electron Beam Lithography and FIB-Draw Beam solutions.

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of Tescan AMBER 2

Nanocharacterization Across Broad Variety of Samples

The field-free UHR-SEM column ensures charge-free imaging and analysis optimized for different sample types, including non-conductive, ferromagnetic, or semiconductor devices.

Fully Automated TEM Specimen Preparation, even for inverted and planar TEM specimens

The integrated TEM AutoPrep Pro™ module enables unattended, multi-site batch TEM sample preparation on multiple samples and at different locations, supporting continuous processing even overnight. With the OptiLift™ nanomanipulator, users can prepare inverted or planar TEM samples and transfer them from material to grid in the required feature orientation, making it easier to characterize challenging materials.

Fully Integrated Argonne Beam Cleaning in the FIB-SEM chamber

Achieve ultra-thin specimen ( below 20 nm) with pristine quality from any materials with a controlled final polishing step down to 200 eV using the integrated Argonne Aura Gentle Ion Beam™ polisher within the FIB-SEM chamber.

Optimized Workflows for Multi-User Lab

The latest generation of the Tescan AMBER platform is designed to deliver peak levels of automation into everyday workflows. TESCAN Essence™ supports multi-user environments with guided or automated workflows, automatic SEM and FIB alignments, and smarttools such as 3D virtual collision protection and compucentric stage movements, enabling even non-expert users to operate the FIB-SEM with confidence.

Extending Scientific Insights from Multimodal Data in 2D and 3D

AMBER’s multimodal detection system captures multiple imaging signals at once or pairs them with analytical techniques such as EDS, EBSD, ToF-SIMS, cathodoluminescence, or Raman spectroscopy. Extend the row of modalities into 3D utilizing a fully integrated FIB-SEM Tomography featuring automated, acquisition from optimum acquisition angles.

Fabricate, Create or Modify Materials into Functional Devices

Tescan AMBER FIB-SEM provides the foundation for electron beam lithography, ion beam patterning, and FEBID or FIBID applications, supporting versatile and precise device-design prototyping. Additionalu, experiment with your own SEM and FIB patterning strategies by taking direct control of the patterning engine through the scripting interface.

Tescan AMBER 2 Applications

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Tescan AMBER 2 in Materials Science

Understand microstructure, surface detail, and nanoscale behavior with workflows built for precise TEM preparation and confident nanoscale analysis.

  • Automated FIB-SEM routines for consistent TEM lamella preparation
  • High-contrast, low-kV imaging with the BrightBeam™ field-free SEM column
  • Fully Integrated Argonne Beam Cleaning in the FIB-SEM chamber for pristine ultrathin TEM specimen prepCorrelative FIB, SEM, and analytical modes for 3D and multimodal studies
  • Controlled Ga⁺ polishing for reliable end-point quality across diverse materials

AMBER 2 gives materials scientists dependable preparation and clear nanoscale insight. Its field-free UHR-SEM reveals fine surface detail, while the Ga⁺ FIB enables pthe most precise and highest quality TEM specimen preparation. Whether you’re studying microstructure, defects, or preparing TEM samples, AMBER 2 supports efficient, confident workflows. 

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Tescan AMBER 2 in Life Sciences

Resolve cellular structures, delicate interfaces, and complex biological architecture with a platform built for both ambient and cryogenic workflows.

  • High-contrast, low-kV imaging of non-conductive and beam-sensitive samples with BrightBeam™ UHR optics
  • FIB-SEM tomography for ultra-high-resolution 3D reconstruction of cells and subcellular features
  • Seamless switching between ambient and cryogenic modes
  • Integrated Leica/Quorum cryo workflow for reliable sample handling
  • Correlative cryo-FIB-SEM workflows, including cryo-TEM lamella preparation and cryo-lift-out
  • Integrated CLEM with METEOR 2.0 for precise ROI targeting

AMBER 2 gives life scientists a unified platform for detailed biological imaging. You can move from low-kV surface analysis to correlative cryo-FIB-SEM or cryo-TEM lamella preparation without changing systems, preserving sample integrity while uncovering structure at the cellular and subcellular scale.

Tescan AMBER 2 in Nanotechnology

Precise fabrication and characterization for advanced nanostructures

  • Performs nanoscale milling, FIBID, and FEBID for custom device prototyping
  • Provides real-time high-resolution imaging during fabrication and modification
  • Supports correlative multimodal analysis combining SEM, EDS, and beam lithography

Tescan AMBER 2 extends nanoscale research capabilities with an integrated environment for fabrication and analysis. Researchers can design, prototype, and characterize nanostructures within one system, maintaining full control over resolution, geometry, and data correlation for advanced nanotechnology applications.

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Tescan AMBER 2 in Semiconductors
Prepare reliable TEM samples automatically from the most common devices and thin films—on one platform built for fast, predictable semiconductor Lab workflows.
  • Automated TEM AutoPrep Pro™ for consistent lamella preparation from the most common devices at defined thickness and specific geometry
  • BrightBeam™ field-free SEM for high-contrast imaging of interfaces, device layers, and sensitive materials
  • Controlled Ga⁺ polishing for repeatable end-point quality
AMBER 2 helps semiconductors labFA lab engineers work with confidence. Its fully automated TEM preparation and range of modalities helps R&D Laboratories to investigate new materials and defects in layers stacks with ease.

TESCAN TEM AutoPrep Pro™

AUTOMATION THAT DELIVERS CONSISTENT, HIGH-QUALITY RESULTS

Tescan AMBER 2 works seamlessly with Tescan TEM AutoPrep Pro™ to enable fully automated, reproducible TEM lamella preparation. The system manages site selection, trenching, thinning, and polishing with minimal operator input. It produces consistently thin samples while maximizing instrument time efficiency.

TEM AutoPrep Pro™ combines precision automation with real-time imaging through Tescan Essence™ software, ensuring accuracy and repeatability. Together with AMBER 2’s BrightBeam™ SEM and Orage™ FIB technologies, this workflow reduces beam exposure, shortens preparation time, and preserves sample integrity for reliable daily operation.

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Tescan AMBER 2

Technical specification

Tescan AMBER 2 FIB-SEM

SEM Column
BrightBeam™ field-free UHR-SEM (Schottky emitter)
  • Imaging Resolution: 0.9 keV @ 15keV, 1.4 nm @ 1keV
  • Beam Current Range: 2 pA – 400 nA
  • Energy Range: 50 eV – 30 keV
FIB Column
Orage™ FIB (Ga+ LMIS source )
  • FIB Current range: 1 pA – 100 nA
  • Energy Range: 500 eV – 30 keV
Vacuum modes
  • High-vacuum
  • Optional Low Vacuum / MultiVac™ mode (N₂ or H₂O up to 500 Pa)
Specimen Stage
  • Type: 5-axis motorized compucentric stage
  • XY travel range: 130 mm
  • Z range: 96 mm
  • Tilt range: -70° to +90°
  • Rotation: 360°
Detection System
Multiple detection modalities with up-to 8 simultaneous imaging channels

Tescan AMBER 2 FIB-SEM

SEM Column
BrightBeam™ field-free UHR-SEM (Schottky emitter)
  • Imaging Resolution: 0.9 keV @ 15keV, 1.4 nm @ 1keV
  • Beam Current Range: 2 pA – 400 nA
  • Energy Range: 50 eV – 30 keV
FIB Column
Orage™ FIB (Ga+ LMIS source )
  • FIB Current range: 1 pA – 100 nA
  • Energy Range: 500 eV – 30 keV
Vacuum modes
  • High-vacuum
  • Optional Low Vacuum / MultiVac™ mode (N₂ or H₂O up to 500 Pa)
Specimen Stage
  • Type: 5-axis motorized compucentric stage
  • XY travel range: 130 mm
  • Z range: 96 mm
  • Tilt range: -70° to +90°
  • Rotation: 360°
Detection System
Multiple detection modalities with up-to 8 simultaneous imaging channels
AMBER 2-1

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Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic



info@Tescan.com