WEBINAR | Up to 40% Faster Automated TEM Lamella Preparation with new Ga⁺ FIB Column

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Advanced FIB-SEM
for Insight and Impact

TescanFIB-SEM systems give you precise control for cutting, shaping, and analyzing structures at the nanoscale. You can choose between focused Ga⁺ beams for fine detail or Xe plasma beams for fast volume processing, supported by high-resolution SEM imaging and flexible analytical workflows.

Use modular platforms, intuitive software, and expert guidance to move confidently from question to insight.

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Tescan-AMBER-2
Tescan AMBER 2

Automated Ga⁺ FIB-SEM for high-precision TEM sample prep and nanoscale prototyping

Tescan AMBER 2 gives you BrightBeam™ field-free SEM optics, the Orage™ Ga⁺ FIB, and fully automated lamella workflows for consistent, high-quality TEM sample preparation. Perform inverted and planar sample prep, nanoprocessing, and gentle final polishing across a wide range of materials.

Key benefits

  • Automated TEM lamella prep: Guided workflows support consistent, reproducible preparation—including lift-out—across skill levels.
  • Lower-damage polishing: The optional Argonne Gentle Ion Beam™ (<200 eV) protects sensitive materials during final polishing.
  • Nanoscale fabrication capability: Integrated FIB milling, e-beam lithography, and material deposition give you flexible prototyping options.
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Tescan-AMBER-X-2
Tescan AMBER X 2

Plasma FIB-SEM for fast, low-damage sample prep and 3D multimodal analysis

AMBER X 2 gives you Mistral™ Xe Plasma FIB and BrightBeam™ UHR SEM to handle both large-volume sectioning and delicate TEM lamella prep. Support multimodal workflows—including EDS, EBSD, ToF-SIMS, and Raman—across hard, soft, or beam-sensitive materials.

Key benefits

  • High-throughput milling: Xe ions provide curtaining-free large-volume milling and support precise TEM lamella prep.
  • Streamlined 3D workflows: Integrated hardware and automation accelerate correlative SEM, FIB, and mass-spectrometry analysis.
  • Reduced system overhead: A single platform combines 3D tomography, TEM prep, and multimodal analytics to simplify your workflow.
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Tescan-SOLARIS-2
Tescan SOLARIS 2

Dedicated Ga⁺ FIB-SEM for automated, high-precision TEM sample prep in semiconductor workflows

Tescan SOLARIS 2 gives you a fully automated sample prep platform optimized for advanced devices with sub-10 nm features. Integrate the Triglav™ SEM, AutoTEM Pro™ software, and the OptiLift™ nanomanipulator to enable hands-free, repeatable lamella prep in planar, inverted, or top-down geometries.

Key benefits

  • Higher repeatability: AI-driven, automated lamella prep workflows increase throughput with minimal operator input.
  • More precise end-pointing: Triglav™ SEM and in-column detectors let you target nanoscale defects at beam coincidence.
  • Less downtime: Overnight auto-alignments and unattended batch processing keep your tool productive.
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Tescan-SOLARIS-X-2
Tescan SOLARIS X 2

Plasma FIB-SEM for high-throughput semiconductor failure analysis and Ga-free sample prep

SOLARIS X 2 gives you Mistral™ Xe Plasma FIB, UHR SEM imaging, and artifact-free Rocking Stage cross-sectioning for modern failure-analysis workflows. Support fast defect localization, Xe-based TEM prep, and processing of complex stacks and packaging.

Key benefits

  • Curtaining-free cross-sections: TRUE X-sectioning delivers deep, high-current cross-sections in heterogeneous stacks and polymers.
  • Ga-free TEM prep: A fast, inert Xe plasma FIB system offloads high-volume TEM prep and frees capacity on conventional Ga FIBs.
  • Standardized FA workflows: Intuitive end-pointing, automated alignment, and guided wizards improve speed and repeatability. 
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Explore the system that moves your research forward

Tescan instruments are designed to help you get answers. Fast and precisely. Talk to our experts and see the solution in action.

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Where can
you find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic

info@tescan.com

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