Universal Plasma FIB-SEM platform for fast, damage-free sample preparation and 3D multimodal analysis.

AMBER X 2 combines Mistral™ Xe Plasma FIB with BrightBeam™ UHR SEM to handle both large-volume sectioning and delicate TEM lamella prep. It supports multimodal workflows, including EDS, EBSD, ToF-SIMS, and Raman, across hard, soft, or beam-sensitive materials.

Key benefits

• Delivers curtaining-free, high-throughput milling with Xe ions, while enabling Ga-like precision for TEM prep—ideal for cross-domain labs.
• Accelerates complex 3D analytical workflows with integrated hardware and automation for correlative SEM, FIB, and mass spectrometry.
• Reduces system overhead by consolidating multiple capabilities—3D tomography, TEM prep, and multimodal analytics—into one platform.

Dedicated Ga⁺ FIB-SEM for automated, high-precision TEM sample prep in semiconductor applications.

TESCAN SOLARIS is a fully automated sample prep platform optimized for advanced devices with sub-10 nm features. It integrates the Triglav™ SEM, AutoTEM Pro™ software, and OptiLift™ nanomanipulator to enable hands-free, repeatable lamella prep in planar, inverted, or top-down geometries.

Key benefits

• Increases repeatability and throughput with AI-driven, fully automated lamella prep workflows requiring minimal operator input.
• Targets nanoscale defects with precise end-pointing using Triglav™ SEM and in-column detectors at beam coincidence.
• Reduces tool downtime with overnight auto-alignments and unattended batch processing.

Plasma FIB-SEM platform for high-throughput semiconductor failure analysis and Ga-free sample prep.

SOLARIS X 2 combines Mistral™ Xe Plasma FIB and UHR SEM imaging with artifact-free Rocking Stage cross-sectioning and SEM-guided targeting. Designed for modern failure analysis labs, it supports fast defect localization, Xe-based TEM prep, and processing of complex stacks and packaging.

Key benefits

• Delivers deep, curtaining-free cross-sections at high current in heterogeneous stacks and polymers using TRUE X-sectioning.
• Offloads high-volume TEM prep to a fast, inert Xe plasma FIB system—freeing capacity from conventional Ga FIBs.
• Standardizes FA workflows with intuitive end-pointing, automated alignment, and guided wizards—improving speed and repeatability.