WEBINAR | “4D-STEM in SEM” – an event-based approach to accessible nano-scale materials characterization

Enroll now for free

Applications
Products and technology
Events & Webinars
News
Contacts
- About
- Careers
- Services
- OEM
- Distributors

Applications
Products and technology
Events & Webinars
News
Contacts
- About
- Careers
- Services
- OEM
- Distributors

Your query

Home
Events & Webinars

Events & webinars

Connect with microscopy experts and advance your research through Tescan events and webinars. Join hands-on training sessions, application workshops, and networking opportunities worldwide.

Upcoming Events Upcoming Webinars Past webinars

Never miss a thing

Subscribe and get the news about all Tescan events.

Subscribe

Upcoming Events

SCANDem 2026 – Scandinavian Microscopy Conference

SCANDem 2026 focuses on advanced microscopy methods, including electron microscopy and materials characterization. The event gathers experts from academia and industry to share research and innovations.

Greenville, North Carolina

LPM 2026 - The 27th International Symposium on Laser Precision Microfabrication

Tescan will participate in LPM 2026, held June 9-12, 2026, in Greenville, North Carolina. The event is hosted by Clemson University and focuses on laser–matter interaction, laser materials processing, and future developments in precision microfabrication.

Microscopy Society of Thailand Conference 2026

MST43 highlights developments in microscopy techniques and applications across life sciences and materials science. It provides a platform for researchers and professionals to exchange knowledge and insights.

Jacksonville, Florida, USA

2026 Tescan SEM User Schools

Get more from your Tescan scanning electron microscope with our 2026 Tescan SEM User Schools - immersive, hands-on training programs led by Tescan application experts.

Castelldefels (Barcelona), Spain

Three-Dimensional Electron Microscopy Conference 2026 (GRC)

This conference explores advances in 3D electron microscopy and cryo-EM technologies. It focuses on new methods for structural biology and imaging deeper into cellular systems.

Hsinchu, Taiwan

Annual Conference of the Microscopy Society of Taiwan at NTHU

Tescan will participate in the Annual Conference of the Microscopy Society of Taiwan on 26 June 2026 at National Tsing Hua University in Hsinchu, Taiwan.

Singapore, Singapore

25th International Conference on Solid State Ionics

Explore developments in solid-state ionics, materials research, and advanced characterization techniques across energy and functional materials applications.

Manchester, United Kingdom

ICTMS 2026 – International Conference on Tomography of Materials

Focused on 3D imaging and tomography of materials, this conference highlights micro-CT, structural analysis, and advanced characterization workflows.

NAWA Spinaker Summer School

A training-focused program covering advanced microscopy techniques, materials analysis, and practical workflows for academic researchers.

CMC – China Materials Conference

A major materials science event covering multi-scale characterization, FIB-SEM, micro-CT, and structure-to-function analysis.

Singapore, Singapore

IPFA – IEEE Symposium on Physical & Failure Analysis

Focus on semiconductor failure analysis, reliability testing, and advanced diagnostics using FIB-SEM and analytical workflows.

Microscopy & Microanalysis (M&M)

A leading microscopy event covering SEM, TEM, FIB-SEM, and analytical techniques for materials and life sciences.

IMRC – International Materials Research Congress

Focus on materials science, nanotechnology, and advanced characterization including electron microscopy and imaging workflows.

Mexico City, Mexico

SCA Symposium

A regional meeting focused on microscopy, analytical techniques, and materials characterization across research applications.

Heidelberg, Germany

EMBO Course – Advances in Cryo-Electron Microscopy

Covers cryo-EM technologies, structural biology, and advanced imaging of biological systems.

Liverpool, United Kingdom

IMC21 – International Microscopy Congress

A global microscopy event covering electron microscopy, imaging technologies, and nanoscale analysis.

SEMICON Taiwan Exhibition and Forum

Focused on semiconductor manufacturing, failure analysis, and advanced inspection technologies.

Chiba (Makuhari Messe), Japan

JASIS – Japan Analytical & Scientific Instruments Show

Covers analytical instrumentation, surface analysis, and materials characterization technologies.

Thessaloniki, Greece

TOSCA Conference

Focus on surface analysis, spectroscopy, and materials characterization techniques.

Belgrade, Serbia

ELMINA Conference

Covers electron microscopy applications in materials science and nanotechnology.

Marseille, France

European FIB Network (EU-F-N)

Focused on FIB-SEM technologies, sample preparation, and nanoscale fabrication workflows.

Krynica-Zdrój, Poland

Polish-Japanese Microscopy Seminar

A joint academic event focused on microscopy, imaging techniques, and materials analysis.

Osijek, Croatia

Croatian Microscopy Congress

Regional microscopy conference covering SEM, TEM, and materials characterization.

Chorzów, Poland

Uni-Export Microscopy Event

Focused on electron microscopy solutions and applications for industrial and research users.

Warrendale, Pennsylvania, USA

2026 Tescan SEM User Schools

Get more from your Tescan scanning electron microscope with our 2026 Tescan SEM User Schools - immersive, hands-on training programs led by Tescan application experts.

Leoben, Austria

Metallography Conference Leoben

Focused on metallography, materials analysis, and microstructure characterization techniques.

EMSI Conference – Electron Microscope Society of India

A key microscopy event focused on electron microscopy techniques, materials characterization, and imaging workflows across academic and industrial research.

Chemnitz, Germany

13th Saxon TEM Preparation Meeting

Focused on TEM sample preparation techniques, workflows, and practical approaches for high-quality electron microscopy analysis.

IC User Symposium

A technical symposium for users working with microscopy and analytical systems, covering workflows, applications, and practical use cases in research and industry.

SIMS China Conference

Dedicated to secondary ion mass spectrometry (SIMS), surface analysis, and materials characterization, with applications in semiconductors and advanced materials.

Nano-BW Symposium – Nanotechnology Conference

Focus on nanotechnology research, nanoscale fabrication, and advanced materials, bringing together academia and industry experts.

Warrendale, USA

TUSA SEM User School – G4

A hands-on training focused on SEM operation, imaging techniques, and practical workflows for materials characterization and microscopy users.

GnMEBA Pédagogique Workshop

A workshop focused on electron microscopy education, sample preparation, and analytical techniques for academic and research environments.

SEMT – Society of Electron Microscopy Technology

A microscopy-focused event covering electron microscopy techniques, imaging workflows, and applications in materials and life sciences.

Discover more events

Upcoming Webinars

WEBINAR | “4D-STEM in SEM” – an event-based approach to accessible nano-scale materials characterization

Discover how integrated 4D-STEM brings diffraction-based analysis directly into a standard SEM workflow. In this webinar, Dr. Ben Britton explores how a TimePix3-based detector enables low-dose, information-rich data acquisition for advanced nanoscale characterization.

Discover more

Past Webinars

Correlated Microanalytical Workflows for Particle Analysis Using Automated Mineralogy, FIB-SEM and SIMS

In this on-demand webinar, Professor William Rickard presents correlated microanalytical workflows combining Automated Mineralogy, TIMA, FIB-SEM and SIMS for comprehensive particle characterization and isotopic analysis.

FemtoChisel™: Redefining Ultrafast Laser Processing

In the fast-paced semiconductor industry, the "time-to-data" bottleneck often lies in the transition from defect localization to high-resolution analysis. Traditional sample preparation can be slow, messy, and prone to heat damage - until now.

Improved TEM Specimen Quality and Lab Throughput with New AMBER 2 Ga⁺ FIB-SEM

Watch the recording to learn how improved beam performance, automation, and integrated gentle ion beam polishing support more consistent TEM specimen preparation, lower damage, and higher lab throughput.

Tailored Cryo-EM and Correlative Workflows for Challenging Biological Projects

In this on-demand webinar, the team from the Electron Microscopy Core Facility at IMG (Institute of Molecular Genetics of the Academy of Sciences) Prague shows how they approach technically demanding projects that require more than routine sample preparation and imaging.

Dynamic-to-Detail Micro-CT with Tescan UniTOM® HR 2

Tescan specialists show how Tescan UniTOM® HR 2 enables Dynamic-to-Detail micro-CT, allowing you to capture fast structural evolution and then investigate the same region in higher resolution without removing the sample.

Engineering Diamond Material with Focused Ion Beam Implantation for Quantum Technologies

Diamond is rapidly emerging as a key material for quantum technologies, driven by nitrogen-vacancy (NV) centers that enable optical readout and spin control with long coherence times at room temperature.

Sample Preparation Perfected: Reproducible Ultra-Thin TEM Lamellae with AMBER 2 and fully FIB-SEM integrated Aura™ Gentle Ion Beam

This webinar demonstrates how Tescan AMBERTM 2 FIB-SEM, combined with the fully integrated Aura™ Gentle Ion Beam, enables automated, high-quality TEM lamella preparation with reduced amorphization and improved consistency.

From Infrastructure to Impact: The Full Potential of Electron Microscopy and Micro-CT Solutions in Core Facilities in Materials

Core facilities support many departments on the same instruments, often without growing staff or budgets. This session brings together SpinLab Katowice and TU Graz to share practical approaches to running multi-user microscopy and micro-CT environments with faster time to data, efficient training, and consistent performance.

Up to 40% Faster Automated TEM Lamella Preparation with the Orage™ 2 Gallium FIB Column

Advanced semiconductor nodes demand ultra-thin, site-specific TEM samples. Manual preparation is slow, complex, and highly dependent on expert operators.

Precision Redefined: Enhancing APT Workflows with Next-Generation Plasma FIB-SEM Tescan AMBER X 2

Modern materials research demands a multiscale understanding of materials from the large-scale datasets to the 3D nanoscale resolution enabled by the Atom Probe Tomography method.

Nanoscale Prototyping with Advanced SEM Capabilities

Turn your SEM into a nanofabrication powerhouse. Learn how researchers are patterning, depositing, and etching at the nanoscale–fast–using Tescan’s Nanoprototyping Toolbox and advanced SEM workflows.Shape

EXLO in Action: Fast, Reliable and Scalable TEM Specimen Preparation

Remove bottlenecks in TEM workflows by taking lift-out outside the FIB-SEM and into a dedicated EXLO station

Proven to Lead: Advancing TEM Sample Preparation with Tescan AMBER X 2 Plasma FIB-SEM

University of Sydney and Tescan demonstrate how plasma FIB-SEM delivers both high-volume 3D characterization and precise TEM specimen preparation in a single universal system.

TESCAN TIMA Integration with Geometallurgy Test Programs

Geometallurgy combines geological, mineralogical, and metallurgical data to predict how ore variability affects processing. This integrated approach improves resource modeling, reduces operational risk, and supports more efficient, sustainable, and profitable mining decisions.

From Routine to Remarkable: Meet TESCAN MIRA XR

Experience how MIRA XR's advanced capabilities transform your analysis workflows in real-time demonstrations. Connect with Tescan experts to discover practical applications that enhance your research and quality control processes.

Discover more webinars

Subscribe for our newsletter

Do you have a question?
Are you interested in our solutions?

Contact us

TESCAN GROUP, a.s.
+420 530 353 211
ID No.: 17774713
VAT No.: CZ17774713

Follow us

Applications

Product portfolio
- SEM
- FIB-SEM
- Micro-CT
- STEM
- Laser solutions
- Ex Situ Lift-Out

Quality & Compliance

About Tescan

© TESCAN GROUP a.s.

Terms & Conditions | Privacy policy | Cookie settings