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On-Demand Webinar | Sample Preparation Perfected: Reproducible Ultra-Thin TEM Lamellae with AMBER 2 and fully FIB-SEM integrated Aura™ Gentle Ion Beam

Achieving electron-transparent TEM lamellae below 20 nm with minimal damage is a key requirement for advanced materials characterization and high-resolution S/TEM analysis. As workflows become more complex, ensuring reproducibility, throughput, and structural integrity remains a major challenge.

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This webinar demonstrates how Tescan AMBER^TM 2 FIB-SEM, combined with the fully integrated Aura™ Gentle Ion Beam, enables automated, high-quality TEM lamella preparation with reduced amorphization and improved consistency. In collaboration with Technoorg Linda, this webinar brings together expertise in ion beam preparation and advanced FIB-SEM workflows to address key challenges in TEM lamella preparation.

The Challenge in TEM Lamella Preparation

Producing ultra-thin, high-quality TEM specimens requires:

Precise control of lamella thickness
Minimization of FIB-induced damage
Consistent preparation across multiple samples
Reduced operator dependency

Traditional workflows often struggle to meet these requirements, especially in high-throughput environments.

Integrated FIB-SEM Workflow with AMBER 2

The Tescan solution combines:

AMBER 2 FIB-SEM platform for automated lamella preparation
Aura™ Gentle Ion Beam for low-keV argon polishing
AI-driven workflow optimization for repeatability

This integrated approach enables:

Artifact-free lamella preparation
Improved structural fidelity
Higher throughput with reduced manual intervention

What You Will Learn

How to achieve sub-20 nm TEM lamellae with minimal damage
Benefits of low-keV argon ion polishing
How automation improves reproducibility and throughput
Real-world workflow examples for advanced TEM preparation

Who Should Watch

This session is designed for TEM specialists, FIB-SEM users, materials scientists, and electron microscopy professionals involved in TEM specimen preparation who are looking to improve reproducibility, throughput, and overall sample quality in their workflows.

Related Resources: Lamella Preparation: Precise Thickness Estimation

Watch the Webinar Recording
Explore how integrated FIB-SEM and low-keV polishing workflows improve TEM specimen quality and consistency.

Speakers

András Szigethy

CEO, Technoorg Linda

András Szigethy is CEO of Technoorg Linda, where he leads the development and application of advanced ion beam technologies for materials research and sample preparation. With extensive experience in ion beam systems and workflow integration, he focuses on enabling high-quality, reproducible results in electron microscopy and nanofabrication.

Márton Iritz

Application Specialist, Technoorg Linda

Márton Iritz is an Application Specialist at Technoorg Linda, focusing on ion beam-based sample preparation and workflow optimization for electron microscopy. He supports users in achieving reliable and reproducible results across a range of materials science and nanotechnology applications.

Petr Klímek, Ph.D.

Product Marketing Director, Tescan

Petr Klímek is Product Marketing Director at Tescan, specializing in FIB-SEM technologies and advanced microscopy workflows. With a background in materials science, he works closely with customers and research teams to translate complex analytical challenges into practical, high-performance solutions.

Unlocked content

Sample Preparation Perfected: Reproducible Ultra-Thin TEM Lamellae with AMBER 2 and fully FIB-SEM integrated Aura™ Gentle Ion Beam

WEBINAR RECORDING

Sample Preparation Perfected: Reproducible Ultra-Thin TEM Lamellae with AMBER 2 and fully FIB-SEM integrated Aura™ Gentle Ion Beam

Optimize TEM Lamella Preparation

Access the on-demand webinar to learn how integrated FIB-SEM and low-keV polishing workflows improve sample quality, reproducibility, and throughput.