WEBINAR | Up to 40% Faster Automated TEM Lamella Preparation with new Ga⁺ FIB Column

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ON-DEMAND WEBINAR | Precision Redefined: Enhancing APT Workflows with Next-Generation Plasma FIB-SEM Tescan AMBER X 2 

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Modern materials research demands a multiscale understanding of materials from the large-scale datasets to the 3D nanoscale resolution enabled by the Atom Probe Tomography method. Plasma FIB-SEM technology is essential for achieving both high-throughput 3D characterization and damage-minimized APT sample preparation with high reproducibility. The Tescan AMBER X 2, equipped with Mistral™ plasma FIB technology, addresses both requirements in one universal system. 

In this webinar, Felix Theska from the University of Sydney and Martin Slama from Tescan showcase how plasma FIB-SEM provides artifact-free APT samples. The new generation plasma FIB enables high-quality results, opening the nanoscale 3D realm to researchers. 

What You’ll Learn:

  • Real-world case studies from the University of Sydney workflows 

  • Role of optimized plasma FIB profiles for artifact-free APT sample preparation 

  • High precision and versatility of AMBER X 2 for demanding applications 

Who Should Watch:

Researchers and professionals in materials science, nanotechnology, and electron microscopy looking to improve APT sample preparation and 3D characterization efficiency. 

Watch the Recording:

Access the webinar now and discover how plasma FIB-SEM is redefining materials science workflows.

Meet the speaker

University of sydney Professor
Felix Theska

Senior Technical Officer at Sydney Microscopy & Microanalysis, University of Sydney, supports researchers in specimen preparation for atom probe tomography and transmission electron microscopy using Ga+, Xe+, and Ar+ FIB-SEM systems.

Martin Sláma
Martin Sláma

Product Marketing Manager for FIB-SEM 3D characterization and TEM lamella preparation at Tescan, brings eight years of experience with plasma FIB and Ga+ FIB-SEM solutions for materials characterization.

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Precision Redefined: Enhancing APT Workflows with Next-Generation Plasma FIB-SEM Tescan AMBER X 2

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