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Tescan at SEMICON Taiwan 2026

Organized by SEMI Taiwan, SEMICON Taiwan 2026 will take place from 2-4 September at TaiNEX 1 and 2 in Taipei, with a focus on inspection, metrology, failure analysis, and advanced packaging. 

September 02-04, 2026

Tescan’s participation will feature three highlights: its integrated semiconductor failure analysis workflow, a technical forum presentation on gas-assisted femtosecond laser sample preparation, and the interactive SPIN. MATCH. ENJOY. booth activity. 

Integrrated workflow-1


Tescan at the Event

  • Exhibition 

September 2–4, 2026 | Booth R8201, 4F, TaiNEX 2

Explore a correlative workflow that connects non-destructive micro-CT inspection, femtosecond laser access, plasma FIB-SEM sample preparation, and 4D-STEM analysis. The workflow follows four stages - Inspect, Access, Prepare, and Analyze - to support defect localization and reliable downstream characterization across multiple scales. 

  • SPIN. MATCH. ENJOY. 

September 2-3, 2026 | From 10:00 | Booth R8201

Spin the wheel, match each Tescan technology with its signature drink, and discover its role in the semiconductor workflow. The activity provides a concise introduction to non-destructive inspection, laser access, and FIB-SEM sample preparation, with Tescan specialists available to discuss each stage.

  • Semiconductor Advanced Inspection and Metrology Forum

September 4, 2026 | 15:05–15:30 | Room 402, 4F, TaiNEX 1

Presentation: Tescan FemtoChisel™: From Hours to Minutes: High-Throughput Gas-Assisted Femtosecond Laser Workflows for Advanced Semiconductor Analysis and Characterization

Speaker: Dr. Herve Mace, Semiconductor Solution Sales Development Director 

Register for the Metrology Forum

What You Will Learn 

  • Where micro-CT, femtosecond laser processing, plasma FIB-SEM, and 4D-STEM fit within the Inspect → Access → Prepare → Analyze workflow.
  • How in-situ micro-CT supports non-destructive internal inspection and warpage analysis before physical sample preparation.
  • How gas-assisted femtosecond laser processing supports cross-sectioning, decapsulation, delayering, cavity preparation, and large-volume material removal.
  • How real-time SEM-guided FIB-SEM preparation and 4D-STEM analysis support site-specific preparation and downstream characterization. 

Why Attend 

The exhibition and forum provide complementary perspectives on semiconductor failure analysis: an integrated workflow across multiple length scales and a focused technical session on femtosecond laser sample preparation.

Visit Tescan to compare approaches, ask application-specific questions, and discuss how these methods could fit into your current laboratory workflow. 

Our Speaker

Quote-Herve-Mace
Dr. Herve Mace
Global Business Development Director, Tescan

Dr. Hervé Macé is Global Business Development Director for Semiconductors at Tescan and Deputy General Manager of the Laser Technologies BU (Storrs/CT/USA), focusing on advanced workflows for semiconductor applications. At IPFA 2026, he contributes to discussions on microscopy and sample preparation, supporting integrated approaches to failure analysis and advanced packaging. His work focuses on aligning analytical technologies with practical challenges in semiconductor manufacturing and diagnostics.

Book a Meeting

FAQs

Where is the Tescan booth?
Booth R8201 on the 4th floor of TaiNEX 2. 
When and where is the Tescan forum presentation?
Friday, 4 September 2026, from 15:05 to 15:30 in Room 402 on the 4th floor of TaiNEX 1. 
Which technologies will Tescan present?
The programme covers micro-CT, gas-assisted femtosecond laser processing, plasma FIB-SEM, Ga⁺ FIB-SEM, 4D-STEM, tomography, and correlative semiconductor sample preparation workflows. 
How can I register for the Forum?

Tescan at SEMICON Korea 2026

Booth D904

COEX Convention & Exhibition Center
513 Yeongdong-daero,
Gangnam-gu, Seoul 06164,
South Korea

semicon-korea-floor-plan