Explore the latest press releases, media coverage, and company updates. Stay informed on how Tescan is advancing science, partnering across industries, and shaping the future of imaging and analysis.
Tescan expands its semaiconductor portfolio with FemtoChisel, a next-generation femtosecond laser platform designed to enhance semiconductor sample preparation workflows with exceptional speed, precision, reproducibility, and quality. The instrument will be officially unveiled at ISTFA 2025 in Pasadena, CA.
Discover how Tescan is shaping the future of semiconductor analysis through smarter workflows, automation, and closer regional collaboration. Hear insights from Hervé Macé and Sean Lee in their exclusive DIGITIMES interview. Learn how Tescan’s integrated solutions help engineers move from insight to decision faster.
Tescan Group today announced the acquisition of FemtoInnovations, a leading innovator in ultrafast laser technologies, and the creation of a dedicated Laser Technology Business Unit (LT BU) headquartered at the University of Connecticut (UConn) Tech Park.
The week at the 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2025) in Penang from August 5 to 8 delivered what the semiconductor industry needs most: education, practical discussion, and forward-looking solutions.
CEO Jean-Charles Chen shares how the rebrand goes beyond design, marking Tescan’s evolution from product maker to solutions partner — committed to “Accelerating the Art of Discovery.”
Tescan has received a 2025 R&D 100 Award in the Analytical/Test category for its TESCAN AMBER X 2, Powered by Mistral™ Plasma FIB column. The recognition highlights how this platform reshapes nanoscale research workflows by combining large-scale 3D materials characterization with precise TEM specimen preparation in a single system.
Tescan proudly introduces its new global brand platform The Art of Discovery at this year’s Microscopy Conference (MC) in Karlsruhe, Germany. Built on the belief that beauty lies in what is yet to be discovered, it reflects Tescan’s ambition to be a trusted growth partner in science.
Tescan will co-host a collaborative webinar with the University of Leeds, presenting a low-dose 4D-STEM methodology for characterising beam-sensitive polymers and soft matter.
Tescan is proud to unveil two software innovations at this year’s prestigious Microscopy & Microanalysis (M&M) conference in Salt Lake City, USA. These launches reflect TESCAN’s ongoing shift toward a more integrated approach, combining advanced technology, workflow-driven solutions, expert support, and a community built on shared insight.
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