Semiconductor Failure Analysis Workflows
Explore how Tescan connects non-destructive inspection, targeted access, sample preparation and high-resolution analysis for advanced packaging and failure analysis challenges.
From Buried Defect to Clear Answer
See the Workflow in Action
Discover application images, videos and real examples showing what Tescan technologies can reveal, access and prepare, including deeply buried regions and complex material stacks.
What’s New at Tescan
Learn about the latest developments across Tescan’s semiconductor workflow, from defect localisation and laser-enabled access to FIB-SEM preparation and downstream analysis.
Discuss Your Real Challenge
Bring your failure-analysis or packaging question to the booth. Our semiconductor application experts are ready to discuss your sample, workflow bottlenecks and possible next steps.
Hands-on Microscopy Workshops
Join focused sessions led by TESCAN experts and explore advanced imaging techniques in depth.
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
M&M Scientific Program
Join focused sessions led by TESCAN experts and explore advanced imaging techniques in depth.
From Routine to Remarkable: MIRA XR – Analytical UHR-SEM Built for Throughput at Any Scale
12:45 PM - 01:45 PM
February 27, 2023
Application Specialist for FIB-SEM, TESCAN
Limited seats available
x
From Routine to Remarkable: MIRA XR – Analytical UHR-SEM Built for Throughput at Any Scale
February 27, 12:45 PM - 01:45 PM, booth 123
Fill the form to register for a workshop
Workshop details
Introducing MIRA XR – the analytical SEM reimagined for speed, usability, and ultra-high-resolution imaging. Perfect for analytical workflows across materials science disciplines. Designed to deliver high throughput without compromising on resolution or automation. A productivity platform for every user, from QA labs to advanced research teams.
Located at TESCAN's Booth 1324
Get a Quick Look at FemtoChisel™
Register for a short in-booth session.
Laser Solution
New: Tescan FemtoChisel™
Femtosecond Precision. Analysis-Ready Results.
You can Book a Demo directly at Tescan Booth N. 605
Hear from Tescan Experts
Attend Scientific Presentations
From Access to Insight An AI-Based End-to-End Failure Analysis Pipeline Combining Laser Sample Prep, Correlative Navigation, and Automated Image Analytics
15:20 - 15:40
October 6, 2026
Head of AI and Advanced Solutions - Laser Technology
Enabling Efficient Strain Analysis of Advanced Nodes with STEM Nanobeam Diffraction Enhanced by Beam Precession at Sub-2nm Spatial Resolution
15:00 - 16:00
October 7, 2026
Product Sales Lead - STEM
High-Throughput Laser Sample Preparation and Device De-processing with LPL and Intelligent Multigas Processing, Reserving FIB for Final High-Resolution Steps
15:00 - 16:00
October 7, 2026
Head of AI and Advanced Solutions - Laser Technology
x
From Access to Insight An AI-Based End-to-End Failure Analysis Pipeline Combining Laser Sample Prep, Correlative Navigation, and Automated Image Analytics
October 6, 15:20 - 15:40, Bridge Hall
Fill the form to register for a workshop
x
Enabling Efficient Strain Analysis of Advanced Nodes with STEM Nanobeam Diffraction Enhanced by Beam Precession at Sub-2nm Spatial Resolution
October 7, 15:00 - 16:00, Exhibit Hall
Fill the form to register for a workshop
x
High-Throughput Laser Sample Preparation and Device De-processing with LPL and Intelligent Multigas Processing, Reserving FIB for Final High-Resolution Steps
October 7, 15:00 - 16:00, Exhibit Hall
Fill the form to register for a workshop
Discuss your failure analysis and advanced packaging challenges with Tescan application experts
Hervé Macé
Semiconductor Business Development (Global)
Lukáš Hladík
Semiconductor Product Marketing
Michael Gray
Semiconductor Business Development (North America)
Trevan Landin
FIB-SEM Business Development (North America)
Sina Shahbazmohamadi, Ph.D.
Head of Technology - Laser Solutions
Dave Zapotok
Product Sales Lead - Laser Solutions
Daniel Nemecek, Ph.D.
Product Sales Lead - STEM Solutions
Malcolm Warrand
Vice-President of Sales (Americas)
Scott Fuller, Ph.D.
Sales Manager (US Northwest)
Jane Kim
Sales Manager (US Southwest)
Sam Habib
Area Sales Director (Singapore)
