High-Precision, Large-Area Cross Sections
Generate high-quality cross sections at high milling currents with Mistral™ Plasma FIB, combining rapid material removal with nanometer-scale accuracy for both large-volume and fine-detail workflows.
The Most Universal FIB-SEM: High-Throughput 3D Characterization and Ga+-Free high Quality Sample Preparation in the single Plasma FIB-SEM Platform
Tescan AMBER X 2
TESCAN AMBER X 2 combines Mistral™ Plasma FIB and the field-free BrightBeam™ UHR SEM so you can achieve Ga+-free, low-damage, fully automated TEM lamella preparation using TEM AutoPrep Pro™ while maintain large 2D/3D multimodal characterization sample throughput.
- A unified platform for both precision TEM prep and large-volume 3D characterization
- Ga+-free TEM lamella preparation with minimal amorphization damage
- Fully automated (TEM AutoPrep Pro™) workflow for consistent and accessible sample preparation
- High-throughput 3D analysis with stable beam performance at all FIB and SEM currents
- Field-free BrightBeam™ UHR SEM for magnetic, non-conductive, and sensitive materials
- Energy-filtered electron signals for enhanced surface and phase contrast of the samples
Tescan AMBER X2 in Materials Science
Gain the detail you need to understand how materials behave, from nanoscale structures to millimeter-scale volumes.
- Comprehensive 3D characterization for microstructural studies
- Automated TEM lamella preparation with TEM AutoPrep Pro™
- Correlative multimodal analysis combining EDS, EBSD and ToF-SIMS
- Large-volume milling for full-field reconstruction and structural insight
AMBER X2 gives materials scientists a reliable way to study metals, ceramics, polymers and composites with both precision and scale. Its Xe plasma FIB and field-free SEM architecture support high-resolution imaging without unnecessary beam damage. This helpa you explore structure–property relationships and track material changes under load, heat or environmental exposure.
Tescan AMBER X2 in Energy and Batteries
Get a clearer view of electrode architecture, interface behavior, and the mechanisms that drive degradation.
- Damage-free plasma FIB-SEM workflows for electrodes and interfaces
- Cross-sectioning and 3D reconstruction of electrodes and solid-state architectures
- Correlative EDS and ToF-SIMS for chemical and structural gradients
- Safe, contamination-free milling of lithium-containing and beam-sensitive materials
AMBER X2 helps battery researchers examine internal structures with clarity, from active material morphology to subtle interface changes. Its high-throughput plasma FIB and multimodal analysis tools reveal degradation pathways, lithium distribution patterns, and stability issues. This gives you the insight needed to refine materials and design more reliable energy-storage systems.
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Tescan AMBER X2 in Semiconductors
Uncover the electrical and structural details of today’s most advanced devices
Uncover the electrical and structural details of today’s most advanced devices with Tescan AMBER X 2 Plasma FIB-SEM. Purpose-built for semiconductor applications, AMBER X 2 combines Xe plasma FIB with proprietary Nanoflat, Chase, and C-Maze chemistries to deliver uniform, artifact-free delayering at sub-10 nm nodes.
The system ensures you have reproducible workflows across logic, memory, and I/O regions, supporting electrical fault isolation, failure analysis, and transistor-level probing.
- Perform artifact-free delayering with Nanoflat, Chase, and C-Maze chemistries
- Protect device integrity using low-kV Xe Plasma FIB milling
- Control every step with end-point detection and live monitoring
- Integrate delayering with in situ nanoprobing in a single workflow
- Deprocess I/O and thick metal layers using low angle polishing
Resolve critical details with BrightBeam™ UHR SEM imaging at sub-500 eV
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Tescan AMBER X2 in Life Sciences
Work confidently across cryogenic and room-temperature workflows, whether you're studying ultrastructure or preparing samples for high-resolution imaging.
- Large-volume 3D FIB-SEM tomography of hard biological materials, including bone, shell and dental tissue
- High-quality cryo lamella preparation with MISTRAL™ Plasma FIB for fast rough milling and precise low-energy polishing
- Integrated CLEM workflows with METEOR 2.0 for accurate ROI targeting
- Built-in cryo nanomanipulator for temperature-controlled, reliable lift-out
- Advanced analytical options including EDS, ToF-SIMS and EBSD
AMBER X2 brings plasma FIB speed to demanding life science studies, from large-volume 3D analysis to delicate cryo sample preparation. Its stable beam performance helps you obtain clean, artifact-free results across biological interfaces, mineralized tissues and complex structural hierarchies.
Technical specification
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