International Conference on Tomography of Materials and Structures (ICTMS 2026)  

Tescan at ICTMS 2026

Join Tescan at ICTMS 2026 to discover the latest advances in dynamic micro-CT, quantitative 4D analysis, spectral imaging, and in-situ experimentation. 

Our team will showcase how modern tomography workflows can connect real-time observation of evolving processes with detailed structural characterization and quantitative analysis. From Digital Volume Correlation and deformation analysis to pore-scale imaging, material characterization, and multi-scale investigations, Tescan solutions help researchers extract deeper insight from complex datasets.

Featured presentation:

Analysis of Warpage, Delamination, and Desoldering in Printed Circuit Boards

Presenter: Michiel Krols  | Date & Time: Tuesday 7th July at 11.40 am

Visit us at the booth to discuss your tomography challenges and explore recent developments in dynamic imaging, quantitative analysis, and advanced in-situ experimentation.

What you will learn

• Dynamic 4D Tomography: Capture evolving processes in materials and structures with time-resolved micro-CT imaging.
  
  
• Quantitative Digital Volume Correlation: Measure internal displacement and strain fields directly from 4D datasets to reveal deformation mechanisms and material behavior. 
  
  
• Dynamic-to-Detail Workflows: Move seamlessly from observation of dynamic events to high-resolution investigation of the features driving material performance and failure.
  
  
• Advanced In-Situ Experiments: Study materials under realistic thermal, mechanical, pressure, and fluid-flow conditions while maintaining full 3D visibility.
  
  
• Spectral Micro-CT: Differentiate phases and materials beyond conventional attenuation-based imaging.

Schedule a meeting with our Tescan representatives at ICTMS 2026 to discuss your specific tomography challenges, explore advanced micro-CT workflows, and discover how our solutions can support your research or application.