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ICEPT 2026: FIB-SEM and Femtosecond Laser Solutions for Advanced Packaging

Tescan will participate in ICEPT 2026, taking place from 5–7 August 2026 in Xi'an, China. The event brings together researchers, engineers, and industry professionals working across electronic packaging, semiconductor manufacturing, and microelectronics.

At Booth A20–21, Tescan and our partner ExTripod Electronics Technology Limited will present FIB-SEM and femtosecond laser processing solutions for advanced packaging and failure analysis. Featured technologies include the Tescan AMBER, SOLARIS, and FemtoChisel platforms, supporting efficient sample preparation, delayering, and high-quality cross-sectional analysis for semiconductor applications.

August 05-07, 2026

About the Event

Established in 1994, ICEPT is one of the longest-running conferences in China focused on electronic packaging technologies. Organized by leading academic and industry organizations, the event serves as a platform for collaboration between researchers, engineers, and technology developers working across the semiconductor ecosystem.

Each year, the conference attracts more than 800 participants from nearly 20 countries and regions, creating opportunities to exchange knowledge and discuss developments in advanced packaging, manufacturing, testing, and integration.

Key topics include:

Electronic packaging design, manufacturing, and testing
Optoelectronic packaging
MEMS packaging and integration
System-in-Package (SiP) technologies
Advanced packaging research and development

Tescan at the Event

Technologies on Display

Application Areas

Advanced packaging
Semiconductor failure analysis
Delayering
Cross-sectional sample preparation
Process development and materials characterization

Key Capabilities

Tescan solutions support efficient sample preparation and analysis for advanced semiconductor applications. FIB-SEM systems provide precise site-specific processing and characterization, while FemtoChisel enables rapid material removal and near damage-free cross-section preparation, helping streamline failure analysis and advanced packaging workflows.

Who Should Attend

Semiconductor researchers
Advanced packaging engineers
Failure analysis specialists
Process development engineers
Materials characterization professionals
Academic researchers and students working in microelectronics

Why Visit the Tescan Booth

Meet with Tescan specialists to discuss challenges in advanced packaging, failure analysis, and semiconductor sample preparation. Learn how integrated FIB-SEM and femtosecond laser workflows can improve efficiency while maintaining high-quality analytical results.

Meet the Team

If you are attending ICEPT 2026, visit Tescan at Booth A20–21 to learn more about our FIB-SEM and femtosecond laser processing solutions for advanced packaging and semiconductor applications.

To schedule a meeting with the Tescan team during the event, please contact us in advance