Ultra High-resolution imaging
Achieve 0.9 nm resolution at 15 keV and 1.0 nm at 1 keV with beam deceleration, enabling clear observation of nanoscale structures.
Tescan CLARA is an ultra high-resolution SEM built for advanced imaging and nanoprototyping. It combines ultra-stable optics, versatile detection, and integrated prototyping tools, supporting both analytical research and device fabrication inside a single instrument.
Ultra High-resolution imaging
Achieve 0.9 nm resolution at 15 keV and 1.0 nm at 1 keV with beam deceleration, enabling clear observation of nanoscale structures.
Analytical versatility
Combine SE, BSE, STEM, EDS, EBSD, and CL detection in one environment for comprehensive material characterization.
Nanoprototyping workflows
Prototype novel devices at the nanoscale directly inside the microscope using EBL kit, DrawBeam deposition, SEM Expert PI, and VisualCoder automation.
Stable platform
Rigid column design minimizes drift and ensures reproducible imaging during long acquisitions.
Efficient navigation
Wide Field Optics™ simplifies movement from overview scans to fine structural details.
Wide range of functional materials
Tescan OptiGIS enables a large variety of precursors for deposition or etching of materials at the nanoscale.
Safe and intuitive operation
Essence™ software with 3D collision protection supports multi-user environments and reduces training time.
Deposit complex 3D structures via standard FIB-SEM
Direct-write fabrication of silver nanoarrays using Tescan’s integrated EBL solution.
Nanoprototyping ToolboxTM enables precise prototyping at nanoscale combines with advanced automation via Python scripting and visual programing
Electron beam lithography via EBL kit
Python scripting for tailored imaging sequences through SEM Expert PI
No-code workflow builder for routine or repetitive tasks via VisualCoder
Precise deposition and etching via DrawBeam and OptiGIS
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Electron Optics & Imaging
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BrightBeam™ field-free UHR SEM column with beam deceleration |
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Schottky FEG electron source |
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Resolution: 0.9 nm @ 15 keV (SE), 1.2 nm @ 1 keV (with BDT) |
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Magnification range: 2× to 2,000,000× |
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Probe current: 2 pA – 400 nA |
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Vacuum System
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High and low vacuum modes with MultiVac™ |
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Beam Deceleration Technology for low-kV imaging |
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Stage & Chamber
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5-axis motorized Compucentric stage |
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Max sample size: 100 mm diameter |
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Integrated IR camera and live 3D collision model |
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Detection
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In-column SE and BSE detectors with energy filtering |
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E-T detector for surface topography |
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STEM and CL detector compatibility |
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EDS / EBSD support |
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Software & Automation
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Essence™ interface for control and workflow management |
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In-Flight™ automated beam alignment and parameter optimization |
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SEM Expert PI for scripted imaging routines |
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VisualCoder™ for no-code workflow automation |
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Electron Optics & Imaging
|
|---|
|
BrightBeam™ field-free UHR SEM column with beam deceleration |
|
Schottky FEG electron source |
|
Resolution: 0.9 nm @ 15 keV (SE), 1.2 nm @ 1 keV (with BDT) |
|
Magnification range: 2× to 2,000,000× |
|
Probe current: 2 pA – 400 nA |
|
Vacuum System
|
|---|
|
High and low vacuum modes with MultiVac™ |
|
Beam Deceleration Technology for low-kV imaging |
|
Stage & Chamber
|
|---|
|
5-axis motorized Compucentric stage |
|
Max sample size: 100 mm diameter |
|
Integrated IR camera and live 3D collision model |
|
Detection
|
|---|
|
In-column SE and BSE detectors with energy filtering |
|
E-T detector for surface topography |
|
STEM and CL detector compatibility |
|
EDS / EBSD support |
|
Software & Automation
|
|---|
|
Essence™ interface for control and workflow management |
|
In-Flight™ automated beam alignment and parameter optimization |
|
SEM Expert PI for scripted imaging routines |
|
VisualCoder™ for no-code workflow automation |
Tescan
Libušina třída 21
623 00 Brno
Czech Republic
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