High-resolution 3D insight for complex materials

Tescan FIB-SEM Tomography

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Guided, automated, and multi-modal 3D acquisition you can trust

FIB-SEM tomography gives you a clear view of microstructure, but producing stable, high-quality 3D datasets often requires significant effort. Tescan FIB-SEM Tomography simplifies the process with guided workflows, automated preparation, and precise multimodal acquisition, all fully integrated into the FIB-SEM control environment.

Step-by-step acquisition setup designed for consistent, high-quality data.
Automated volume preparation for unattended sample processing.
Stable, high-resolution datasets supported by automatic adjustment procedures and drift correction.
Multi-scale, multi-modal 3D acquisition with up to eight detectors, 3D EDS, and 3D EBSD.

WHERE FIB-SEM Tomography MAKES THE DIFFERENCE

Build complete, reliable 3D volumes with less manual effort

Easy setup

Pre-cut monocrystalline Si masks provide a rigid, uniform protective cap that eliminates ion-beam–induced ripples on surface finishes of hard, composite, or resin-embedded samples—even when cross-sections reach 1 mm and Pt deposition would require excessive time and thickness.

Integrated automation

Automatic protection layer deposition, trench sizing, slice alignment, drift correction, autofocus, and Ga+ source heating ensure stable long-run performance.

Multi-modal capability

Acquire up to eight imaging channels plus 3D EDS and 3D EBSD for a richer, more complete dataset.

Faster high-quality slicing

Plasma FIB-SEM with the Rocking Stage reduces curtaining and improves slice planarity, even at high beam currents.

Advanced Performance

AI-powered automated workflow

The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.

Ultimate quality of TEM lamellae

A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga⁺ contamination.

This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials.

Unlocked content

Tescan FIB-SEM TOMOGRAPHY OUTPUT EXAMPLES

Mouse brain tissue: 5 nm voxel size, 700 slices; high-resolution dataset with stable low-keV imaging.

Li-ion battery anode: Curtaining-free polishing using Rocking Stage; 3D visualization and segmentation of porous carbon structure.

Get the most out of Tescan

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Tescan TRUE X-Sectioning

Technical specification

Acquisition capabilities
	Automated serial sectioning and imaging Step-by-step workflow integrated in FIB-SEM control software Automatic protection layer, trench size calculation, cross-section polishing, alignment markers Automatic drift correction, autofocus, image shift, and ion source heating procedures Support for up to 8 imaging detectors Support for 3D EDS and 3D EBSD, with synchronized, static acquisition geometry (no slice-to-slice misalignment)
Volume preparation and slicing
	Automated volume preparation for unattended processing Rocking Stage support for curtaining suppression and improved planarity (±5 to ±10 degrees depending on system)
Voxel resolutions demonstrated
	5 nm (mouse brain, integrated circuits) 10 nm, 20 nm depending on detector configuration and acquisition conditions
3D Visualization
	Direct link to Tescan 3D Volume Analysis software Multi-channel visualization, EDS/EBSD integration, cropping, alignment, shading correction, noise reduction, advanced LUT tools, and high-resolution animation export.

Acquisition capabilities

Automated serial sectioning and imaging
Step-by-step workflow integrated in FIB-SEM control software
Automatic protection layer, trench size calculation, cross-section polishing, alignment markers
Automatic drift correction, autofocus, image shift, and ion source heating procedures
Support for up to 8 imaging detectors
Support for 3D EDS and 3D EBSD, with synchronized, static acquisition geometry (no slice-to-slice misalignment)

Volume preparation and slicing

Automated volume preparation for unattended processing
Rocking Stage support for curtaining suppression and improved planarity (±5 to ±10 degrees depending on system)

Voxel resolutions demonstrated

5 nm (mouse brain, integrated circuits)
10 nm, 20 nm depending on detector configuration and acquisition conditions

3D Visualization

Direct link to Tescan 3D Volume Analysis software
Multi-channel visualization, EDS/EBSD integration, cropping, alignment, shading correction, noise reduction, advanced LUT tools, and high-resolution animation export.

GET IN Touch

with specialist

Where you can find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic 

info@Tescan.com

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