Cryo-EM solution for analytical 4D-STEM characterization of beam-sensitive samples
The Tescan TENSOR™ cryo-EM solution extends the unique and accessible analytical capabilities of TENSOR™ to cryo-STEM, cryo-EDS, cryo-3D ED, and cryo-4D STEM analysis of beam-sensitive materials by combining a cryo-transfer holder with low-dose procedures in Tescan Explore™ software.
Reduced Beam Damage for Advanced Materials Characterization
The single-tilt Gatan Elsa™ cryo-transfer holder, fully adapted for compatibility with Tescan TENSOR™, is designed for stable, high-resolution cryo imaging at liquid nitrogen temperature, with a hold time of more than 8 hours.
The cryo-transfer holder is part of the TENSOR™ cryo-EM solution, which combines cryogenic sample preservation with dedicated low-dose acquisition procedures implemented in Tescan Explore™ software and its measurement workflows. Cryogenic conditions help reduce beam-induced sample damage, while software-guided low-dose procedures further limit unnecessary beam exposure before data acquisition.
The Tescan TENSOR™ cryo-EM solution enables advanced characterization of beam-sensitive materials, including polymers, metal-organic frameworks (MOFs), covalent organic frameworks (COFs), energy functional materials, organic crystals, liposomes, and protein complexes, through analytical STEM and beam-precession-enhanced 4D-STEM.
Long-Duration Cryo Analysis with Minimal Ice Contamination
TENSOR™ also minimizes sample contamination and ice growth during cryo-EM measurements through near-UHV column conditions. Achieved without liquid nitrogen cooling of the column, the near-UHV conditions support long-duration cryo experiments and enable cryo-EDS analysis.
In addition,TENSOR™ features a unique sample-loading mechanism that prevents liquid nitrogen spillover from the cryo-transfer holder dewar during insertion into the microscope, reducing safety-related risks and increasing the success rate of cryogenic sample transfer.
The low-dose Tescan TENSOR™ cryo-EM solution supports routine cryo-analysis across all TENSOR™ modalities, including cryo-STEM imaging, cryo-EDS mapping, cryo-4D STEM, phase-orientation mapping and strain analysis, as well as cryo-3D ED with beam precession for crystal structure determination (cryo-PEDT), making advanced analytical cryo-STEM workflows accessible to users of all experience levels.
Low-dose cryo-STEM characterization of beam-sensitive samples
TENSOR™ enables advanced characterization of beam-sensitive materials by combining cryo-EM conditions with dedicated low-dose workflows in Tescan Explore™ software. The simple, intuitive guided setup helps reduce unnecessary beam exposure during sample navigation, region-of-interest identification, focusing, tracking, and microscope alignment to minimize beam-induced sample damage before data acquisition.
Minimal sample contamination and ice growth
TENSOR™ significantly reduces the risk of contamination and ice growth during cryo-EM sample transfer and analysis. A novel sample-loading mechanism prevents liquid nitrogen spillover during cryo-holder insertion into the microscope, while near-UHV column conditions assure minimal sample contamination and ice growth even without a cryo-box. With no liquid nitrogen column cooling required, cryo-STEM analyses can continue uninterrupted for up to 8 hours between liquid nitrogen refills of the cryo-holder.
Cryo-EDX compositional analysis and elemental mapping
TENSOR™ enables cryo-EDX analysis thanks to its near-UHV column conditions, unlike conventional TEM/STEM microscopes where cryo-boxes or cryo-shields block EDX signals from the cryo-sample. As a result, cryo-EDX elemental analysis and compositional mapping in TENSOR™ remain unobstructed and can be efficiently obtained using intuitive low-dose procedures and workflows in Tescan Explore™ software.
Cryo-3D ED with 4D-STEM mapping capability
TENSOR™ enables combination of cryo-3D ED and cryo-4D STEM measurements through a stepwise acquisition scheme, where small missing wedges between each tilt step are filled by fast beam precession. Diffraction data can be efficiently collected only from selected subregions of a crystal or lamella, distributing the electron dose over a larger area and prioritizing regions with high-quality diffraction signal while minimizing contributions from support films, thick areas, or other artifacts. The result is reduced beam-induced damage, cleaner data with improved signal-to-noise ratio, and more reliable structure determination of complex and beam-sensitive materials.
AI-powered automated workflow
The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.
Ultimate quality of TEM lamellae
A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga+ contamination.
This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials.
