About the Event
From Structure to Functional Insights – Explore Materials at Every Scale
What We Offer
Tescan supports both academic and industrial researchers with integrated workflows for materials characterization across multiple length scales:
-
Multi-scale sample preparation from macro to nano
Tescan FemtoChisel enables rapid, near-damage-free bulk material removal, followed by Tescan AMBER X 2 or AMBER 2 for high-precision FIB milling and polishing. -
Correlative 4D imaging and targeted exposure
Tescan UniTOM HR 2 provides non-destructive 4D micro-CT imaging, combined with FemtoChisel to precisely expose internal regions of interest for subsequent SEM/FIB analysis. -
High-speed, large-volume 2D/3D nanoscale characterization
Tescan AMBER X 2 with plasma FIB supports artifact-free, high-throughput analysis. - Advanced analytical STEM
Tescan TENSOR supports 4D-STEM and 3D electron diffraction (3D-ED) workflows for detailed structural and functional analysis. - Non-destructive 3D/4D imaging
Tescan Micro-CT enables internal structure visualization with resolution down to 500 nm.
Improved Experience
Recent technology updates focus on improving throughput, precision, and automation across workflows:
-
New femtosecond laser solution FemtoChisel increases material removal rates by up to 5× compared to conventional laser systems, while producing clean, debris-free cross-sections without thermal damage, eliminating the need for subsequent FIB rework.
-
The second-generation gallium FIB column Orage 2 (integrated in Tescan AMBER 2) enables up to 40% faster automated TEM sample preparation, supporting more consistent and efficient lamella production.
-
The latest UniTOM HR 2 introduces enhanced automation and advanced denoising capabilities for more reliable 4D micro-CT imaging.
-
The AMBER X 2 platform delivers improved usability, higher efficiency, and greater precision in large-volume FIB-SEM analysis.
Registration
For event details and registration, refer to the official CMC2026 website. 
Visitors are welcome to meet Tescan at Booth A4-023 and attend the conference sessions for technical presentations.
