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CMC 2026 – China Materials Conference 2026        

July 13–15 | Wuhan, China | Organized by Chinese Materials Research Society

CMC 2026 is a combined trade show and conference focused on materials science research and technology development. Tescan will participate as an exhibitor and conference speaker, presenting integrated workflows for multi-scale materials characterization, from structure to functional insights. #Booth A4-023 

July 13-15, 2026

About the Event

From Structure to Functional Insights – Explore Materials at Every Scale 

What We Offer

Tescan supports both academic and industrial researchers with integrated workflows for materials characterization across multiple length scales:

  • Non-destructive 3D/4D imaging
    Tescan Micro-CT enables internal structure visualization with resolution down to 500 nm.
     

  • Correlative 4D imaging and targeted exposure
    Tescan UniTOM HR 2 provides non-destructive 4D micro-CT imaging, combined with FemtoChisel to precisely expose internal regions of interest for subsequent SEM/FIB analysis.

  • Multi-scale sample preparation from macro to nano
    Tescan FemtoChisel enables rapid, near-damage-free bulk material removal, followed by Tescan AMBER X 2 or AMBER 2 for high-precision FIB milling and polishing.

  • High-speed, large-volume 2D/3D nanoscale characterization
    Tescan AMBER X 2 with plasma FIB supports artifact-free, high-throughput analysis.

  • Advanced analytical STEM
    Tescan TENSOR supports 4D-STEM and 3D electron diffraction (3D-ED) workflows for detailed structural and functional analysis.  

Improved Experience  

Recent technology updates focus on improving throughput, precision, and automation across workflows:

  • The latest UniTOM HR 2 introduces enhanced automation and advanced denoising capabilities for more reliable 4D micro-CT imaging.

  • New femtosecond laser solution FemtoChisel increases material removal rates by up to 5× compared to conventional laser systems, while producing clean, debris-free cross-sections without thermal damage, eliminating the need for subsequent FIB rework.

  • The AMBER X 2 platform delivers improved usability, higher efficiency, and greater precision in large-volume FIB-SEM analysis

  • The second-generation gallium FIB column Orage 2 (integrated in Tescan AMBER 2) enables up to 40% faster automated TEM sample preparation, supporting more consistent and efficient lamella production.

CMC 2026

Registration

For event details and registration, refer to the official CMC2026 website. 

Register Now for the Event

Visitors are welcome to meet Tescan at Booth A4-023 and attend the conference sessions for technical presentations. 

Agenda / Programme

  • Redefining Laser Machining Technology: High Efficiency, Clean Processing and Minimal Sample Damage

    Venue: Session E01 – Advanced Material Preparation & Processing Technology

    Time: To be announced by conference organizer

  • Latest Advances of Tescan FIB-SEM in Materials Characterization

    Venue: Session E10 – Advanced Characterization Technologies of Material Structure and Properties

    Time: To be announced by conference organizer

  • Multi-Modal FIB-ToF Workflow for Nanoscale Characterization Challenges in Microelectronics

    Venue: Flash Talk Zone B

    Time: To be announced by conference organizer

Report Registration

CMC2026 _ Tescan 分会报告注册表_800

 

Book a Meeting

Tescan at SEMICON Korea 2026

Booth D904

COEX Convention & Exhibition Center
513 Yeongdong-daero,
Gangnam-gu, Seoul 06164,
South Korea

semicon-korea-floor-plan