CMC 2026 – China Materials Conference 2026
July 13–15 | Wuhan, China | Organized by Chinese Materials Research Society
CMC 2026 is a combined trade show and conference focused on materials science research and technology development. Tescan will participate as an exhibitor and conference speaker, presenting integrated workflows for multi-scale materials characterization, from structure to functional insights. #Booth A4-023
About the Event
From Structure to Functional Insights – Explore Materials at Every Scale
What We Offer
Tescan supports both academic and industrial researchers with integrated workflows for materials characterization across multiple length scales:
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Non-destructive 3D/4D imaging
Tescan Micro-CT enables internal structure visualization with resolution down to 500 nm. -
Correlative 4D imaging and targeted exposure
Tescan UniTOM HR 2 provides non-destructive 4D micro-CT imaging, combined with FemtoChisel to precisely expose internal regions of interest for subsequent SEM/FIB analysis. -
Multi-scale sample preparation from macro to nano
Tescan FemtoChisel enables rapid, near-damage-free bulk material removal, followed by Tescan AMBER X 2 or AMBER 2 for high-precision FIB milling and polishing. -
High-speed, large-volume 2D/3D nanoscale characterization
Tescan AMBER X 2 with plasma FIB supports artifact-free, high-throughput analysis. - Advanced analytical STEM
Tescan TENSOR supports 4D-STEM and 3D electron diffraction (3D-ED) workflows for detailed structural and functional analysis.
Improved Experience
Recent technology updates focus on improving throughput, precision, and automation across workflows:
- The latest UniTOM HR 2 introduces enhanced automation and advanced denoising capabilities for more reliable 4D micro-CT imaging.
- New femtosecond laser solution FemtoChisel increases material removal rates by up to 5× compared to conventional laser systems, while producing clean, debris-free cross-sections without thermal damage, eliminating the need for subsequent FIB rework.
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The AMBER X 2 platform delivers improved usability, higher efficiency, and greater precision in large-volume FIB-SEM analysis
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The second-generation gallium FIB column Orage 2 (integrated in Tescan AMBER 2) enables up to 40% faster automated TEM sample preparation, supporting more consistent and efficient lamella production.

Registration
For event details and registration, refer to the official CMC2026 website. 
Visitors are welcome to meet Tescan at Booth A4-023 and attend the conference sessions for technical presentations.
Agenda / Programme
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Redefining Laser Machining Technology: High Efficiency, Clean Processing and Minimal Sample Damage
Venue: Session E01 – Advanced Material Preparation & Processing Technology
Time: To be announced by conference organizer
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Latest Advances of Tescan FIB-SEM in Materials Characterization
Venue: Session E10 – Advanced Characterization Technologies of Material Structure and Properties
Time: To be announced by conference organizer
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Multi-Modal FIB-ToF Workflow for Nanoscale Characterization Challenges in Microelectronics
Venue: Flash Talk Zone B
Time: To be announced by conference organizer
Report Registration
