Non-destructive spectral imaging for material verification and internal inspection of advanced electronic assemblies.
TrueContrast™ multi-energy imaging for differentiating polymers, metals, and encapsulants
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K-edge detection for accurate identification of high-Z elements
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Non-destructive visualization of interfaces and buried defects in electronic packages
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Spectrum comparison tools for verifying material uniformity and contamination sources
Tescan Spectral CT delivers compositional insight where conventional micro-CT cannot. Engineers can distinguish packaging materials, solder alloys, and internal structures without sectioning or coating—supporting reliable failure analysis, design validation, and quality assurance across next-generation electronic devices.
