Faster Large Area Study with Tescan AMBER X 2 for High-Throughput FIB-SEM cross-sectioning.

Accelerate your time-to-data with optimized plasma FIB milling, demonstrated on silicon carbide cross-sectioning.

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Why Faster Cross-Sectioning Enables Statistically Meaningful Material Analysis

In both materials research and industrial inspection, time-to-data is a critical factor. Whether characterizing failure sites or validating structural uniformity, slow sample preparation limits throughput and statistical confidence. This application note presents a comparative study of traditional Ga FIB, conventional plasma FIB, and Tescan AMBER X 2 with Mistral™ plasma FIB column.

Tested on silicon carbide material, the AMBER X 2 delivered the fastest preparation while keeping a very high standard of surface quality, making it a reliable option for users who need both speed and precision.

Why Large Area Study

for FIB-SEM Cross-Sectioning Makes Sense?

Comparative Throughput of FIB-SEM Platforms

Cross-Section Without Protective Coating

Stainless Steel Cross-Section

SiC Cross-Section by Conventional Plasma FIB

SiC Cross-Section with Tescan AMBER X 2

SiC Cross-Section by Ga FIB

01

Root of the Problem

Why Faster FIB-SEM Workflows Matter for High-Volume Characterization

In time-sensitive environments, long cross-sectioning cycles can delay decisions and limit not only the number of samples processed, but also overall insight into material performance.

Traditional FIB-SEM platforms, especially those based on gallium, struggle to meet the speed demands of high-throughput labs. As the demand for faster, more scalable material analysis grows, a new generation of FIB-SEM technology is required.

02

Materials and Methods

Benchmarking Three FIB-SEM Platforms for Speed and Sample Quality

Silicon carbide samples were cross-sectioned using three technologies: traditional Ga FIB-SEM, conventional plasma FIB-SEM, and the Tescan AMBER X 2 with Mistral™ plasma FIB.

Each cross-section measured 50 µm in width and was prepared under optimized milling and polishing conditions to reach a matching final surface quality. Timing was recorded from start to an artifact-free finish. Trenching was performed at high current, followed by final polishing at reduced current to minimize damage, artifacts from polishing, and to improve cross section quality.

03

Results and Discussion

Tescan AMBER X 2 Enables Faster Workflows Without Compromising Quality

The AMBER X 2 completed cross-section preparation in 40 minutes, cutting processing time by more than half compared to conventional plasma systems and reducing it by over 80% compared to Ga FIB. Image quality remained high, and no sample artifacts were observed.

This performance opens the door to broader cross-sectional studies, increasing statistical confidence and accelerating both discovery and diagnostics in demanding lab settings. The platform’s efficiency makes it ideal for both academic users and industrial teams seeking to improve productivity without altering analysis protocols.

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Tescan Instruments & Technology

Used in This Workflow

Tescan AMBER X 2

Built for fast, high-resolution cross-sectioning in demanding environments, the AMBER X 2 combines next-generation plasma FIB with a robust SEM column—ideal for large-area material analysis.

Mistral™ plasma FIB accelerates bulk material removal without gallium contamination
Optimized trenching and polishing routines support consistent sample quality at high throughput
Designed for cross-sectioning workflows in battery, semiconductor, and advanced materials research

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GET IN Touch

Where can you find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic

info@Tescan.com

Faster Large Area Study with Tescan AMBER X 2 for High-Throughput FIB-SEM cross-sectioning.

Why Faster Cross-Sectioning Enables Statistically Meaningful Material Analysis

Why Large Area Study

01 Root of the Problem

Why Faster FIB-SEM Workflows Matter for High-Volume Characterization

02 Materials and Methods

Benchmarking Three FIB-SEM Platforms for Speed and Sample Quality

03 Results and Discussion

Tescan AMBER X 2 Enables Faster Workflows Without Compromising Quality

GET IN Touch

Get the most out of Tescan

Tescan Instruments & Technology

Tescan AMBER X 2

Explore more solutions

Multimodal 3D FIB-SEM with ToF-SIMS Reveals Lithium-Ion Battery Electrode Degradation

Low-Damage EBSD Sample Preparation with Plasma FIB-SEM and Low Angle Polishing

Multiscale Porosity Mapping in Fiber-Reinforced Ceramics Using 3D Imaging

Plasma FIB Sample Preparation for In-Situ Synchrotron Studies of Additively Manufactured Alloys

Gas-Assisted Plasma FIB Milling for Improved Imaging of MXene–Polymer Nanocomposites

GET IN Touch

Where can you find us:

01

Root of the Problem

02

Materials and Methods

03

Results and Discussion