Tescan AMBER X 2
Designed for high-throughput nanoscale imaging, AMBER X combines field-free ultra-high-resolution SEM with fast, precise plasma FIB milling,ideal for materials science imaging workflows.
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Enables large-volume sample prep with high-resolution FIB-SEM imaging to reveal interface detail
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Field-free SEM provides excellent contrast at ceramic fiber boundaries, even in beam-sensitive materials
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Seamlessly integrates into multiscale 3D tomography workflows for advanced materials analysis





