Prepare deformation-free, large-area surfaces for reliable EBSD analysis, even in complex, multi-phase materials.
Electron Backscatter Diffraction (EBSD) requires sample surfaces that are free of deformation and preparation-induced artifacts. Conventional polishing techniques, including mechanical and electrochemical methods, often fall short, especially when working with materials that contain multiple phases.
This application note presents an alternative approach using TESCAN’s Low Angle Polishing method on a plasma FIB-SEM platform. By minimizing surface damage and supporting large-area preparation, this workflow provides consistent, high-quality EBSD results across challenging materials like duplex steel and WC-Co composites.
A unique plasma FIB-SEM combining a Xenon plasma FIB with a field-free UHR SEM column, enabling high-throughput milling and high-resolution imaging in one system.
Correlative nanoscale analysis uncovers lithium distribution and chemical pathways that drive cathode performance loss.
Accelerate your time-to-data with optimized plasma FIB milling, demonstrated on silicon carbide cross-sectioning.
Combined 3D imaging techniques reveal multiscale porosity patterns and their structural impact in HA-ZrO₂ fiber-reinforced ceramics.
Use Tescan TENSOR with integrated beam precession to perform analytical STEM measurements either with existing automated workflows or develop new workflows with own advanced methods.
Targeted oxygen injection enhances surface contrast and reduces curtaining during high-resolution cross-sectioning of carbon materials.
