Streamline Large-Area 2D and 3D Characterization
Use high-current Xe plasma FIB for efficient analysis of large regions with precision polishing, even in challenging materials.
Tescan AMBER X 2 is designed to keep pace with the realities of modern materials research. Whether you’re characterizing large volumes of steel and alloys, fragile interfaces, or beam-sensitive materials, AMBER X 2 enables you to go further, faster, and with precision that scales across sample types.
Built around the high-performance Mistral™ plasma FIB and BrightBeam™ field-free SEM, this platform delivers high-resolution insights at every step of your workflow.
Streamline Large-Area 2D and 3D Characterization
Use high-current Xe plasma FIB for efficient analysis of large regions with precision polishing, even in challenging materials.
Acquire Multiple Data Layers in One Run
Combine EBSD or 3D EDS with ToF-SIMS during automated serial sectioning to generate complementary structural, chemical, and isotopic insights across full volumes.
No Compromises for Magnetic or Delicate Samples
The field-free BrightBeam™ SEM column ensures consistent, high-resolution imaging of magnetic, porous, or beam-sensitive materials.
Keep the Pace on Difficult Materials
Use the Rocking Stage, TRUE-X-Sectioning, and Oxygen DIM to improve cut quality, reduce polishing time, and better accommodate complex materials.
Efficiency at Scale, Even for Routine Workflows
Standardize high-throughput analysis across users and samples with optimized beam parameters and repeatable workflows built into Essence™ interface.
Smart Automation for Confident Operation
From alignment to slicing, automation routines support both expert and occasional users, accelerating productivity without sacrificing precision.
Accelerate your time-to-data with optimized plasma FIB milling, demonstrated on silicon carbide cross-sectioning.
Prepare deformation-free, large-area surfaces for reliable EBSD analysis, even in complex, multi-phase materials.
Combined 3D imaging techniques reveal multiscale porosity patterns and their structural impact in HA-ZrO₂ fiber-reinforced ceramics.
Ga+-free large-area sample preparation enables dynamic examination of precipitation expansion in Al-Mn-Cr-Zr alloys during material heat treatment
Targeted oxygen injection enhances surface contrast and reduces curtaining during high-resolution cross-sectioning of carbon materials.
Essence™ 3D FIB-SEM Multimodal Tomography
This module synchronizes SEM, EDS, EBSD, and ToF-SIMS into a single acquisition routine, making full-volume, multi-channel analysis easier and more consistent.
TESCAN AutoSection™
Automate cross-sectioning workflows with precise control over milling depth, geometry, and sequence. Ideal for routine or multi-sample throughput.
Essence™ Low-Angle Polishing
Preserve structural integrity while polishing samples with fine features or sensitive interfaces. Designed to reduce curtaining and improve surface flatness for EBSD and STEM.
Each software module is fully integrated into the Essence™ environment, ensuring a smooth learning curve and reproducibility across users and applications.
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BrightBeam™ Field-Free UHR-SEM Column |
Electron beam energy: 50 eV–30 keV (down to <50 eV with sample bias) |
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Resolution: 1.4 nm @ 1 keV | 0.9 nm @ 15 keV |
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Mistral™ Plasma FIB Column |
Energy range: 500 eV–30 keV |
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Beam current: 1 pA–3.3 μA |
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Resolution: 10 nm @ 30 keV |
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Max FOV: 1 mm |
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Included & Optional Accessories |
Rocking Stage |
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TRUE-X-Sectioning |
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OptiLift sample lift-out |
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Oxygen DIM |
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Gas Injection System (Pt, W, C…) |
|
BrightBeam™ Field-Free UHR-SEM Column |
|---|
|
Electron beam energy: 50 eV–30 keV (down to <50 eV with sample bias) |
|
Resolution: 1.4 nm @ 1 keV | 0.9 nm @ 15 keV |
|
Mistral™ Plasma FIB Column |
|---|
|
Energy range: 500 eV–30 keV |
|
Beam current: 1 pA–3.3 μA |
|
Resolution: 10 nm @ 30 keV |
|
Max FOV: 1 mm |
|
Included & Optional Accessories |
|---|
|
Rocking Stage |
|
TRUE-X-Sectioning |
|
OptiLift sample lift-out |
|
Oxygen DIM |
|
Gas Injection System (Pt, W, C…) |
Tescan
Libušina třída 21
623 00 Brno
Czech Republic
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