Fully automated TEM sample preparation for fast, consistent lamella production 

AI-Driven TEM Sample Preparation -

Tescan TEM AutoPrep™ Pro 

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Prepare high-quality TEM samples with guided automation, AI-assisted workflows, and reliable, repeatable results across materials and users, and FIB-SEM experience levels.

Tescan TEM AutoPrep™ Pro brings automation and consistency to TEM sample preparation by guiding users through every critical step of the workflow, from site selection and trench milling to lift-out, thinning, and final low-keV cleaning.  By reducing manual intervention and operator-dependent variability, it helps laboratories achieve reproducible lamella quality while making advanced FIB-SEM preparation workflows more accessible.

Fully integrated within Tescan Gallium and Plasma FIB-SEM platforms, TEM AutoPrep™ Pro enables both experienced users and newer operators to prepare high-quality TEM samples with greater confidence and efficiency. Advanced automation routines, supported by machine learning techniques and locally trained AI models, help streamline complex preparation tasks that traditionally required significant FIB-SEM expertise and training.

The latest TEM AutoPrep™ Pro capabilities now include automated preparation of inverted and plan-view TEM lamella geometries, expanding the range of accessible workflows for advanced materials characterization.

With support for unattended and overnight operation, the system helps increase microscope utilization, improve sample throughput, and reduce cost per sample.

In one glance

  • End-to-end TEM preparation workflow: Automates key steps including trenching, lift-out, thinning, and final polishing.


  • Automated advanced lamella geometries: Supports automated preparation of standard, inverted, and plan-view TEM lamellae.

  • Consistent, reproducible results: Guided workflows help deliver uniform sample quality across users and experience levels.

  • Reduced operator dependency: AI-assisted automation minimizes manual intervention and makes complex FIB-SEM workflows more accessible.

  • Higher microscope utilization: Enables unattended or overnight preparation to increase throughput during nights and weekends.

  • Integrated for Gallium and Plasma FIB-SEM platforms: Designed to support efficient sample preparation across TESCAN FIB-SEM systems.

WHERE Tescan TEM AutoPrep™ Pro

makes the difference

Faster TEM Sample Preparation 

Automate trenching, lift-out, polishing, and cleaning to prepare high-quality lamellae in significantly less time. 

Consistent and Repeatable Results 

Predefined workflows and guided steps ensure uniform sample quality across users and sessions. 

Automated Workflow Control 

Minimize manual intervention with automated navigation, alignment, and process execution. 

Accurate Defect Targeting 

Align samples precisely to device structures for reliable failure analysis and materials characterization. 

High Throughput Operation 

Prepare multiple samples in batch mode, including unattended and overnight runs. 

Flexible Sample Preparation 

Support different lamella geometries and materials without additional hardware changes. 

Tescan Spectral CT Applications

_ Application area icon (3)
Tescan Spectral CT in Electronics and Semiconductors

Non-destructive spectral imaging for material verification and internal inspection of advanced electronic assemblies.

TrueContrast™ multi-energy imaging for differentiating polymers, metals, and encapsulants

  • K-edge detection for accurate identification of high-Z elements

  • Non-destructive visualization of interfaces and buried defects in electronic packages

  • Spectrum comparison tools for verifying material uniformity and contamination sources

Tescan Spectral CT delivers compositional insight where conventional micro-CT cannot. Engineers can distinguish packaging materials, solder alloys, and internal structures without sectioning or coating—supporting reliable failure analysis, design validation, and quality assurance across next-generation electronic devices.

_ Application area icon
Tescan Spectral CT in Materials Science

Multi-energy micro-CT for elemental and structural differentiation in complex, multi-phase materials.

  • Elemental mapping for identifying fillers, dopants, or additives in polymer composites

  • Spectral contrast for distinguishing polymers, ceramics, and metals with similar densities

  • Non-destructive 3D analysis of internal interfaces and phase boundaries

  • Integrated Spectral Suite for correlating elemental and structural data in one workflow

In materials research, Spectral CT enables scientists to explore the relationship between structure and composition without destroying samples. Researchers can visualize distribution of additives, analyze composite uniformity, and study degradation pathways—supporting more reliable material design and performance assessment.

Application area=GS
Tescan Spectral CT in Geoscience and Mining

Full-spectrum micro-CT for 3D elemental and structural insight into geological samples.

  • Non-destructive 3D elemental mapping of rocks, ores, and mineral inclusions

  • K-edge detection for locating and identifying high-value or trace elements like gold or rare earth elements

  • Enhanced contrast for complex mineral assemblages and pore networks

  • Large-volume spectral scanning for full-core or fragment-scale analysis

For geoscientists and mining professionals, Spectral CT provides simultaneous elemental and structural data from intact samples. It supports mineral identification, ore classification, and recovery assessment—reducing dependency on destructive assays while preserving geological material for further study.

TESCAN SPECTRAL SUITE

INTEGRATION THAT DRIVES INSIGHT

Tescan Spectral CT works seamlessly with SPECTRAL Suite and Acquila™ micro-CT control software to streamline spectral imaging from acquisition to analysis. Used as an add-on with the UniTOM XL platform, users can target volumes of interest, capture full-spectrum data, and visualize structural and elemental information in one workflow.

Researchers benefit from intuitive controls, guided reconstruction, and automated spectral processing. Spectral Suite handles spectrum matching, K-edge detection, and compositional mapping with minimal setup. This delivers consistent, reproducible results across samples and accelerates multi-energy micro-CT analysis.

UniTOM® HR 2

Technical specification

X-ray source 

 Source type

Open type transmission source 

Voltage 

30-160kV 

Power

 Up to 50W

 X-ray detectors 

Detector 

High-speed, medium field of view with multiple detector options (up to three) 

Resolution

Spatial resolution

500 nm (2D line pair resolution) 

Temporal resolution

<5 seconds 

Sample size and weight 

Maximum sample size (H x Ø) 

700 mm x 500 mm 

Weight 

45 kg 

Maximum imaging envelope (H x Ø)

400 mm x 300 mm 

System weight and dimensions 

Installed (L x W x H) 

2.06 m x 0.97 m x 1.9 m 

Installed weight

2750 kg

Rotation stage 

Stage

Continuous rotation with slip-ring technology for uninterrupted dynamic imaging 

Software and In Situ connectivity 

Imaging modes 

Continuous Dynamic CT, standard static CT, tiling, offset, stacked and merged integrated acquisition (STAMINA), multi-scale Volume of Interest Scanning (VOIS) 

In situ interface 

Optional connection panel for in situ testing stages and environmental experiments with radiation-safe feedthroughs 

Integrated workflow control and data reconstruction through Acquila and Panthera™ software 

X-ray source 

 Source type

Open type transmission source 

Voltage 

30-160kV 

Power

 Up to 50W

 X-ray detectors 

Detector 

High-speed, medium field of view with multiple detector options (up to three) 

Resolution

Spatial resolution

500 nm (2D line pair resolution) 

Temporal resolution

<5 seconds 

Sample size and weight 

Maximum sample size (H x Ø) 

700 mm x 500 mm 

Weight 

45 kg 

Maximum imaging envelope (H x Ø)

400 mm x 300 mm 

System weight and dimensions 

Installed (L x W x H) 

2.06 m x 0.97 m x 1.9 m 

Installed weight

2750 kg

Rotation stage 

Stage

Continuous rotation with slip-ring technology for uninterrupted dynamic imaging 

Software and In Situ connectivity 

Imaging modes 

Continuous Dynamic CT, standard static CT, tiling, offset, stacked and merged integrated acquisition (STAMINA), multi-scale Volume of Interest Scanning (VOIS) 

In situ interface 

Optional connection panel for in situ testing stages and environmental experiments with radiation-safe feedthroughs 

Integrated workflow control and data reconstruction through Acquila and Panthera™ software 

UniTOM-HR2-wood-laminate

GET IN Touch

with specialist

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Where you can find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic



info@Tescan.com 

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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