Tescan SOLARIS 2 | Automated FIB-SEM for TEM Lamella Preparation
Automated TEM Lamella Preparation for Consistent, High-Throughput Results
Fully automated TEM sample preparation for fast, consistent lamella production
Prepare high-quality TEM samples with guided automation, AI-assisted workflows, and reliable, repeatable results across materials and users, and FIB-SEM experience levels.
Tescan TEM AutoPrep™ Pro brings automation and consistency to TEM sample preparation by guiding users through every critical step of the workflow, from site selection and trench milling to lift-out, thinning, and final low-keV cleaning. By reducing manual intervention and operator-dependent variability, it helps laboratories achieve reproducible lamella quality while making advanced FIB-SEM preparation workflows more accessible.
Fully integrated within Tescan Gallium and Plasma FIB-SEM platforms, TEM AutoPrep™ Pro enables both experienced users and newer operators to prepare high-quality TEM samples with greater confidence and efficiency. Advanced automation routines, supported by machine learning techniques and locally trained AI models, help streamline complex preparation tasks that traditionally required significant FIB-SEM expertise and training.
The latest TEM AutoPrep™ Pro capabilities now include automated preparation of inverted and plan-view TEM lamella geometries, expanding the range of accessible workflows for advanced materials characterization.
With support for unattended and overnight operation, the system helps increase microscope utilization, improve sample throughput, and reduce cost per sample.
In one glance
End-to-end TEM preparation workflow: Automates key steps including trenching, lift-out, thinning, and final polishing.
Automated TEM Lamella Preparation for Consistent, High-Throughput Results
Advanced FIB-SEM for Automated Sample Preparation, Nanoscale Characterization and Nanoprototyping
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Faster TEM Sample Preparation
Automate trenching, lift-out, polishing, and cleaning to prepare high-quality lamellae in significantly less time.
Consistent and Repeatable Results
Predefined workflows and guided steps ensure uniform sample quality across users and sessions.
Automated Workflow Control
Minimize manual intervention with automated navigation, alignment, and process execution.
Accurate Defect Targeting
Align samples precisely to device structures for reliable failure analysis and materials characterization.
High Throughput Operation
Prepare multiple samples in batch mode, including unattended and overnight runs.
Flexible Sample Preparation
Support different lamella geometries and materials without additional hardware changes.
Automated, high-quality TEM sample preparation for advanced materials research.
Reliable and precise TEM preparation for semiconductor failure analysis and R&D.
Evaluate whether Aura™ GIB and TEM AutoPrep Pro can be added to your current system.
Non-destructive spectral imaging for material verification and internal inspection of advanced electronic assemblies.
TrueContrast™ multi-energy imaging for differentiating polymers, metals, and encapsulants
K-edge detection for accurate identification of high-Z elements
Non-destructive visualization of interfaces and buried defects in electronic packages
Spectrum comparison tools for verifying material uniformity and contamination sources
Tescan Spectral CT delivers compositional insight where conventional micro-CT cannot. Engineers can distinguish packaging materials, solder alloys, and internal structures without sectioning or coating—supporting reliable failure analysis, design validation, and quality assurance across next-generation electronic devices.
Multi-energy micro-CT for elemental and structural differentiation in complex, multi-phase materials.
Elemental mapping for identifying fillers, dopants, or additives in polymer composites
Spectral contrast for distinguishing polymers, ceramics, and metals with similar densities
Non-destructive 3D analysis of internal interfaces and phase boundaries
Integrated Spectral Suite for correlating elemental and structural data in one workflow
In materials research, Spectral CT enables scientists to explore the relationship between structure and composition without destroying samples. Researchers can visualize distribution of additives, analyze composite uniformity, and study degradation pathways—supporting more reliable material design and performance assessment.
Full-spectrum micro-CT for 3D elemental and structural insight into geological samples.
Non-destructive 3D elemental mapping of rocks, ores, and mineral inclusions
K-edge detection for locating and identifying high-value or trace elements like gold or rare earth elements
Enhanced contrast for complex mineral assemblages and pore networks
Large-volume spectral scanning for full-core or fragment-scale analysis
For geoscientists and mining professionals, Spectral CT provides simultaneous elemental and structural data from intact samples. It supports mineral identification, ore classification, and recovery assessment—reducing dependency on destructive assays while preserving geological material for further study.
Tescan Spectral CT works seamlessly with SPECTRAL Suite and Acquila™ micro-CT control software to streamline spectral imaging from acquisition to analysis. Used as an add-on with the UniTOM XL platform, users can target volumes of interest, capture full-spectrum data, and visualize structural and elemental information in one workflow.
Researchers benefit from intuitive controls, guided reconstruction, and automated spectral processing. Spectral Suite handles spectrum matching, K-edge detection, and compositional mapping with minimal setup. This delivers consistent, reproducible results across samples and accelerates multi-energy micro-CT analysis.
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X-ray source |
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Source type
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Open type transmission source |
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Voltage
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30-160kV |
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Power
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Up to 50W |
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X-ray detectors |
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Detector |
High-speed, medium field of view with multiple detector options (up to three) |
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Resolution
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Spatial resolution |
500 nm (2D line pair resolution) |
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Temporal resolution |
<5 seconds |
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Sample size and weight |
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Maximum sample size (H x Ø) |
700 mm x 500 mm |
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Weight |
45 kg |
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Maximum imaging envelope (H x Ø) |
400 mm x 300 mm |
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System weight and dimensions |
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Installed (L x W x H) |
2.06 m x 0.97 m x 1.9 m |
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Installed weight |
2750 kg |
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Rotation stage
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Stage |
Continuous rotation with slip-ring technology for uninterrupted dynamic imaging |
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Software and In Situ connectivity |
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Imaging modes |
Continuous Dynamic CT, standard static CT, tiling, offset, stacked and merged integrated acquisition (STAMINA), multi-scale Volume of Interest Scanning (VOIS) |
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In situ interface |
Optional connection panel for in situ testing stages and environmental experiments with radiation-safe feedthroughs |
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Integrated workflow control and data reconstruction through Acquila™ and Panthera™ software |
|
X-ray source | |
|
Source type
|
Open type transmission source |
|
Voltage
|
30-160kV |
|
Power
|
Up to 50W |
|
X-ray detectors | |
|
Detector |
High-speed, medium field of view with multiple detector options (up to three) |
|
Resolution
| |
|
Spatial resolution |
500 nm (2D line pair resolution) |
|
Temporal resolution |
<5 seconds |
|
Sample size and weight | |
|
Maximum sample size (H x Ø) |
700 mm x 500 mm |
|
Weight |
45 kg |
|
Maximum imaging envelope (H x Ø) |
400 mm x 300 mm |
|
System weight and dimensions | |
|
Installed (L x W x H) |
2.06 m x 0.97 m x 1.9 m |
|
Installed weight |
2750 kg |
|
Rotation stage
| |
|
Stage |
Continuous rotation with slip-ring technology for uninterrupted dynamic imaging |
|
Software and In Situ connectivity | |
|
Imaging modes |
Continuous Dynamic CT, standard static CT, tiling, offset, stacked and merged integrated acquisition (STAMINA), multi-scale Volume of Interest Scanning (VOIS) |
|
In situ interface |
Optional connection panel for in situ testing stages and environmental experiments with radiation-safe feedthroughs |
|
Integrated workflow control and data reconstruction through Acquila™ and Panthera™ software |
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