Designed for Precise Lamella Quality Assessment
The fully retractable, SEM chamber-integrated 4D-STEM detector enables direct sample and material characterization at ultra-high resolution, as well as fast and precise sample quality pre-screening for materials science applications.
By capturing a diffraction pattern at every scan point, the 4D-STEM detector generates a comprehensive dataset that serves as a rich source of information. Subsequent data processing enables extraction of precise nanoscale crystallographic information, such as crystal orientation, grain structure, and phase transformation. This approach makes material characterization faster and more accessible.
The acquired 4D datasets can be reprocessed multiple times without remeasuring the sample and are fully compatible with open-source software, enabling the development of new, user-defined analysis methodologies.
The 4D-STEM detector also allows for immediate evaluation of lamella quality directly inside the FIB-SEM after final FIB polishing, thereby reducing the risk of sample reworking and repeated TEM analysis.
With an integrated 4D-STEM detector, Tescan AMBER™ 2 and Tescan AMBER X™ 2 are robust, high-performance FIB-SEM platforms for advanced materials science workflows. Both systems feature the BrightBeam™ SEM column for ultra-high-resolution imaging and support a full suite of multimodal characterization techniques, including EDS, EBSD, ToF-SIMS, and Raman.
For streamlined and reliable TEM lamella preparation, the platforms leverage advanced automation through TEM AutoPrep™ Pro, while the fully integrated Aura™ Gentle Ion Beam enables final argon polishing for the excellent lamella quality.
AMBER X™ 2 is a versatile solution for fast, Ga+-free, and low-damage specimen preparation. Its Mistral™ xenon plasma FIB source is specifically designed for both precise and routine high-quality sample preparation, along with high-speed milling of large volumes, enabling large-scale 3D multimodal characterization across hard, soft, and beam-sensitive materials.
AMBER™ 2 is designed for high-precision TEM lamella preparation and nanoprototyping. Utilizing the Orage™ 2 Ga⁺ FIB column, it delivers the accuracy and surface quality required for the most delicate nanostructuring tasks.
Direct TEM lamella quality control
Direct verification of TEM lamella thickness and crystallinity in the FIB-SEM through well-defined diffraction patterns ensures samples are ready for subsequent TEM analysis after final FIB polishing. This significantly reduces failure rates, minimizes rework, and improves overall FIB-SEM-to-TEM workflow efficiency.
Extended analytical capabilities
Direct acquisition of 4D-STEM data within the FIB-SEM enables advanced nanoscale characterization, with post-processing allowing identification of phase composition and crystal orientation, eliminating the need for sample transfer to a dedicated TEM.
Acquired 4D-STEM datasets are fully compatible with open-source analysis applications such as LiberTEM, py4DSTEM, and pixStem and can be reprocessed multiple times. Combined with Expert PI, a scripting and automation environment for FIB-SEM, this approach provides the flexibility to develop new analysis methodologies and create custom data-processing workflows tailored to specific applications.
Flexible imaging contrast selection
Virtual apertures enable live-view acquisition, allowing users to define custom bright-field and dark-field regions by selecting arbitrary angular ranges directly in Tescan Essence™ software for flexible, application-specific contrast optimization and extended imaging capabilities.
Seamless integration
Full hardware and software integration of the retractable 4D-STEM detector in AMBER™ 2 and AMBER X™ 2 platforms ensures intuitive, safe operation and seamless workflow control. The detector can be inserted or retracted with a single click in Tescan Essence™ software.
