Tescan Failure Analysis Solutions for Advanced Semiconductor Packaging at SEMICON China 2026  

Integrated Workflow Highlights for Semiconductor Failure Analysis

Highlights of the workflow solution:

•  In the Defect Discovery step, Tescan UniTOM^®HR 2 not only supports mm-scale inspection but also enables sub-µm scale high resolution analysis. It brings Dynamic-to-Detail imaging and Panthera AI denoising into one continuous micro-CT workflow. In FIB-SEM, the Tescan GM Chamber is a market-verified solution enabling non-destructive inspection of up to 12-inch (300 mm) wafers.  
  
  
• In the Defect Exposure step, Tescan FemtoChisel™ brings you a system where speed, quality, and correlation converge. It delivers up to 5x faster prep with debris-free, pristine cross-sections, no heat damage, and no FIB rework.
  
  
• Our Ga⁺ FIB has been upgraded to a second-generation ion column, Orage 2, enabling up to 40% faster automated TEM lamella preparation.  
  
  
• Tescan SOLARIS X™ 2 Plasma FIB-SEM gives you reliable results for advanced IC packages, MEMS, and display devices alongside high speed and hands-free during TEM Lamella Preparation, Cross-Sectioning and Delayering, plus in situ Nanoprobing.
  
  
• In the Verification & Correlation step, STEM imaging, EDS elemental mapping, and 4D-STEM structural and functional analysis for a complete understanding and validation of process development and failure analysis results. Tescan TENSOR™ is a highly automated analytical STEM platform, optimized for 4D-STEM measurements with fast and fully integrated beam control.   

In the meantime, we also co-exhibit in Productronica China, booth no. E4 - 4590. We will have live booth presentations covering the mentioned highlights on the afternoon of March 25-26, giving you the chance to meet our experts and discuss your case. We offer free ice cream at the booth. Talk with our team and pick up a cool giveaway. Don’t forget to check activity details when visiting our SEMICON China booth.  

Schedule a meeting to learn how Tescan’s micro-CT, FIB-SEM, laser preparation, and 4D-STEM solutions support faster, more reliable packaging failure analysis.