Tescan at SEMICON China 2026 Highlights Connected Workflows for Advanced Packaging and Failure Analysis

Integrated Workflow Highlights for Semiconductor Failure Analysis

The market explains why these topics are gaining urgency. AI infrastructure spending is forecast to reach $450 billion in 2026, the HBM market is projected to grow 58% to $54.6 billion, and the cost of a 2 nm fab has exceeded $25 billion. As device architectures become more complex and investment at the leading edge continues to rise, semiconductor teams are under growing pressure to improve process control, defect localization, and workflow efficiency.  

Against that backdrop, Tescan used SEMICON China 2026 to highlight workflows that connect non-destructive inspection,laser-based sample preparation, and FIB-SEM analysis. The aim is to help semiconductor teams localize defects more quickly, preserve device integrity, and move from observation to root-cause understanding with greater confidence across advanced materials and 3D package structures. 

“The most critical pain point our customers are facing for advanced packaging is the complexity of the materials,” said Herve Mace, Senior Director for Business Development at Tescan. “They are not using monolithic integration anymore, but heterogeneous integration with many different materials.”  

Mace said the response must be workflow-driven. “What we need to do as a company is correlate the information, navigate, analyze the issues, and provide enough results so users can make well-informed decisions.”  

At the show, Tescan highlighted Tescan FemtoChisel™, which Mace described as fundamental for advanced industrial packaging and HBM technologies because it bridges centimeter and millimeter scales with nanometer and micrometer scales. He also pointed to Tescan SOLARIS X™ 2 and Tescan SOLARIS™ 2, updated with the latest ion column generation, alongside Tescan UniTOM® HR 2, a new generation of micro-CT focused on resolution and throughput in context. 

AI was another central theme throughout SEMICON China, and Tescan’s position focused on practical value inside real workflows. “AI is very important for Tescan,” Mace said. “A lot of our workflows, a lot of our technology, are AI-based for object detection.” He added that AI will continue to support metrology, detection, and automation, especially where efficient performance is needed from low data sets.  

Tescan also addressed growing requirements in SiC, GaN, HBM, and FOPLP, where defectivity, materials behavior, and larger sample formats are increasing the demands on inspection and metrology. Mace said the company is developing in-situ analysis and analytics to help users detect defects, read photon and electrical information, navigate to the right location, and determine whether an issue stems from implementation, process integration, or systematic yield loss. He also noted that the industry is moving from silicon wafers toward glass wafers and glass interposers, increasing sample size and workflow complexity.  

Looking ahead, Tescan sees China as a market where deeper local engagement will matter even more. “The focus of the company is definitely to grow expertise, to grow our demonstration capabilities, and to make the experience of our customers much better working with Tescan in China,” Mace said. 


SEMICON China 2026 reinforced a clear market reality: semiconductor progress now depends not only on scaling, but also on how effectively teams can understand increasingly complex materials, architectures, and failure mechanisms. Tescan’s focus remains on helping semiconductor users move from observation to decision with greater confidence through connected workflows, advanced analysis, and practical automation.