Demos
Sample to insight—experience the power of Tescan workflows live.
Microscopy & Microanalysis (M&M) is a leading conference on advanced imaging and analytical technologies. Explore advanced electron microscopy technologies, scientific presentations, and live instrument demos designed to advance your research.
Booth #430
August 3 - 6, 2026
Milwaukee, Wisconsin
Sample to insight—experience the power of Tescan workflows live.
From breakthrough research to transformative technologies.
Your challenges. Our expertise. Let's connect.
Femtosecond Precision. Analysis-Ready Results.
Demo at Tescan Booth 430
Experience how FemtoChisel™ bridges the gap between sample localization and high-resolution analysis. Learn how femtosecond laser processing prepares samples for downstream FIB-SEM, TEM, and analytical microscopy workflows.
Located at TESCAN's Booth 430
Powered by MISTRAL™, designed for clean, fast, precise prep
Demo at Tescan Booth 430
See how Tescan AMBER X™ 2 combines high-throughput Xe Plasma FIB milling with ultra-high-resolution SEM imaging to accelerate materials characterization, semiconductor failure analysis, and TEM sample preparation.
Discover:
Join the live demo and explore faster pathways to nanoscale discovery.
Located at TESCAN's Booth 430
Field-free UHR SEM for high-contrast imaging of sensitive materials.
Demo at Tescan Booth 430
Unlock new insights with Tescan CLARA.
Join our experts for a live demonstration of Tescan CLARA and learn how researchers are using ultra-high-resolution FE-SEM imaging to characterize materials, investigate biological structures, and analyze advanced devices. See real-world applications, explore key workflows, and discover how CLARA transforms complex scientific questions into actionable answers.
Located at Tescan's Booth 430
Uncompromised Discovery in Dynamic Micro-CT.
Demo at Tescan Booth 430
Discover Tescan UniTOM HR 2, the dynamic micro-CT system combining sub-micron resolution and 4D imaging for non-destructive characterization across life sciences, materials science, geoscience, and semiconductor research.
Located at TESCAN's Booth 430
Novel Automated Platform for Analytical STEM and 4D-STEM Characterization
Visit the expert at Tescan Booth 430
Discuss your application with a TENSOR expert and discover new approaches to semiconductor characterization, failure analysis, and materials research.
Located at TESCAN's Booth 430
Competition: Open to all skill levels.
Tescan EXLO™ makes lift-out accessible, repeatable, and fun.
Visit Booth 430 to participate.
February 27, 12:45 - 13:45, LL Copernicum, level 0
February 27, 12:45 - 13:45, LL Copernicum, level 0
February 27, 12:45 - 13:45, LL Copernicum, level 0
February 27, 12:45 - 13:45, LL Copernicum, level 0
February 27, 12:45 - 13:45, LL Copernicum, level 0
February 27, 12:45 - 13:45, LL Copernicum, level 0
12:45 PM - 01:45 PM
February 27, 2023
February 27, 12:45 PM - 01:45 PM, booth 123
Introducing MIRA XR – the analytical SEM reimagined for speed, usability, and ultra-high-resolution imaging. Perfect for analytical workflows across materials science disciplines. Designed to deliver high throughput without compromising on resolution or automation. A productivity platform for every user, from QA labs to advanced research teams.
Located at TESCAN's Booth 1324
03:00 PM - 05:30 PM
August 3, 2026
03:00 PM - 05:30 PM
August 3, 2026
11:00 AM - 11:15 AM
August 4, 2026
11:45 AM - 12:00 PM
August 4, 2026
02:15 PM - 02:30 PM
August 4, 2026
02:30 PM - 02:45 PM
August 4, 2026
03:00 PM - 05:30 PM
August 4, 2026
10:45 AM - 11:00 AM
August 5, 2026
11:00 AM - 11:15 AM
August 5, 2026
02:00 PM - 02:15 PM
August 5, 2026
02:15 PM - 02:30 PM
August 5, 2026
August 3, 03:00 PM - 05:30 PM, Exhibit Hall
August 3, 03:00 PM - 05:30 PM, Exhibit Hall
August 4, 11:00 AM - 11:15 AM
August 4, 11:45 AM - 12:00 PM
August 4, 02:15 PM - 02:30 PM
August 4, 02:30 PM - 02:45 PM
August 4, 03:00 PM - 05:30 PM, Exhibit Hall
August 5, 10:45 AM - 11:00 AM, Room: S102 E
August 5, 11:00 AM - 11:15 AM
August 5, 02:00 PM - 02:15 PM, Room: S101 D
August 5, 02:15 PM - 02:30 PM, Room: S102 E
VP of Sales, Americas
FIB-SEM Solutions
Life Science Solutions
Quantum Solutions
Semiconductor Solutions
Customer Service Director, Americas
No distributors found.
The Microscopy & Microanalysis (M&M) conference is widely recognized as the world’s leading annual forum for the science and technology of microscopy and microanalysis, bringing together experts from academia, industry, and research institutions.
It is the largest global gathering of professionals in this field, where scientists, engineers, and students come to present their latest research, exchange ideas, and explore cutting edge techniques across both the biological and physical sciences.
Often described by the scientific community as a premier meeting point for microscopy, M&M offers a unique combination of high level scientific presentations, practical workshops, and one of the world’s largest exhibitions of advanced instrumentation and analytical technologies.
Attendees value the opportunity to stay up to date with the latest methodologies, discover new applications from nano to macro scale, and connect with peers and technology providers in a highly collaborative environment.
For Tescan, M&M is not just an event but a long standing tradition. As a regular exhibitor, we have been part of this global community for years, consistently engaging with scientists, sharing expertise, and presenting solutions that support increasingly complex research challenges.
Visitors to Tescan at M&M 2026 can expect a highly interactive experience focused on solving real scientific challenges.
Our expert application specialists will be available to discuss your specific research questions and help identify practical solutions tailored to your needs.
Through live online demos running at the booth, you will also gain hands on insight into how our instruments perform in real workflows, giving you a full solution experience in one place.
Product specialists will be present to dive into technical details and explore configurations best suited to your applications, while our sales team will be ready to support any purchasing related discussions.
Simply stop by Booth 430 to share the challenges you are facing and discover why Tescan is a partner worth considering for your research.
Tescan integrated workflow solutions connect multiple analytical techniques into a single, coordinated process that guides users from initial, non‑destructive insight to precise nanoscale analysis.
In practice, this means combining Micro‑CT for 3D localization of hidden structures, ultrafast laser processing for fast and clean access to regions of interest, and FIB‑SEM for final high‑resolution imaging and advanced characterization.
By linking these steps with shared spatial context, the workflow reduces trial‑and‑error, minimizes preparation‑induced damage, and accelerates time to reliable results.
At Booth 430, Tescan will present a connected workflow that spans from large‑volume imaging down to precise nanoscale analysis and sample preparation.
Visitors can explore how individual technologies come together to streamline complex experiments, improve data quality, and accelerate time to insight. Our team will be available to discuss real use cases, from advanced materials research to semiconductor failure analysis, and to help identify the right configuration for specific applications.
You can expect practical conversations around topics such as high resolution surface imaging, large volume 3D characterization, site specific sample preparation, and efficient transfer from bulk analysis to TEM.
We will also share best practices for automating workflows, improving reproducibility, and handling challenging samples.
In addition, we will introduce and discuss complementary developments including Gentle Ion Beam (GIB), a Cryo Holder for Tescan TENSOR, the new Orage 2 column, and TOF-SIMS capabilities.
At the booth, we will showcase:
Tescan FemtoChisel™ femtosecond laser solution
Tescan CLARA™ 3 UHR-SEM
Tescan AMBER X™ 2 Plasma FIB-SEM
UniTOM™ HR 2 micro-CT
Tescan TENSOR™ STEM
Tescan EXLO™ Lift-out System
Stop by to see how these technologies can be combined into efficient, end to end workflows tailored to your research or industrial challenges.