Tescan at M&M 2026 | Microscopy & Microanalysis Conference

Microscopy & Microanalysis (M&M) is a leading conference on advanced imaging and analytical technologies. Explore advanced electron microscopy technologies, scientific presentations, and live instrument demos designed to advance your research.

Booth #430
August 3 - 6, 2026
Milwaukee, Wisconsin


Your Tescan Experience

at M&M 2026
Group 601

Demos

Sample to insight—experience the power of Tescan workflows live. 

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Presentations

From breakthrough research to transformative technologies. 

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Meet and Greet 

Your challenges. Our expertise. Let's connect. 

Book your instrument demo

Tescan FemtoChisel (2)
Laser

New: Tescan FemtoChisel™ 

Femtosecond Precision. Analysis-Ready Results. 

Demo at Tescan Booth 430 

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Tescan FemtoChisel Laser

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Demo description 

Experience how FemtoChisel™ bridges the gap between sample localization and high-resolution analysis. Learn how femtosecond laser processing prepares samples for downstream FIB-SEM, TEM, and analytical microscopy workflows. 

Located at TESCAN's Booth 430

AMBER-X 2
PLASMA FIB-SEM

Tescan AMBER X™ 2 Plasma FIB-SEM

Powered by MISTRAL™, designed for clean, fast, precise prep

Demo at Tescan Booth 430 

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Tescan AMBER X™ 2 Plasma FIB-SEM

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Demo description 

See how Tescan AMBER X™ 2 combines high-throughput Xe Plasma FIB milling with ultra-high-resolution SEM imaging to accelerate materials characterization, semiconductor failure analysis, and TEM sample preparation.

Discover:

  • Large-volume 3D characterization
  • Ga⁺-free TEM lamella preparation
  • High-resolution imaging of challenging materials
  • Correlative analysis with structural, chemical, and crystallographic insights

Join the live demo and explore faster pathways to nanoscale discovery.

Located at TESCAN's Booth 430

CLARA GM Mat. Science
UHR SEM

Tescan CLARA™ UHR-SEM 

Field-free UHR SEM for high-contrast imaging of sensitive materials.

Demo at Tescan Booth 430 

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Tescan CLARA™ 3 UHR-SEM

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Demo description 

Unlock new insights with Tescan CLARA.
Join our experts for a live demonstration of Tescan CLARA and learn how researchers are using ultra-high-resolution FE-SEM imaging to characterize materials, investigate biological structures, and analyze advanced devices. See real-world applications, explore key workflows, and discover how CLARA transforms complex scientific questions into actionable answers. 

Located at Tescan's Booth 430

UniTOM HR2_left_shad kopie 33
MICRO-CT

New: Tescan UniTOM™ HR 2 micro-CT  

Uncompromised Discovery in Dynamic Micro-CT.

Demo at Tescan Booth 430

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New: Tescan UniTOM™ HR 2 micro-CT

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Demo description 

Discover Tescan UniTOM HR 2, the dynamic micro-CT system combining sub-micron resolution and 4D imaging for non-destructive characterization across life sciences, materials science, geoscience, and semiconductor research. 

Located at TESCAN's Booth 430

TENSOR_1-1
STEM

Tescan TENSOR™ STEM

Novel Automated Platform for Analytical STEM and 4D-STEM Characterization  

Visit the expert at Tescan Booth 430

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Tescan TENSOR™ STEM

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Discuss your application with a TENSOR expert and discover new approaches to semiconductor characterization, failure analysis, and materials research.

Located at TESCAN's Booth 430

EXLO product pic
DEMO/COMPETITION

Tescan EXLO™ Lift-Out 

Competition: Open to all skill levels. 

Tescan EXLO™ makes lift-out accessible, repeatable, and fun. 

Visit Booth 430 to participate.

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Tescan

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Tescan EXLO is not simply a sample preparation tool—it is a workflow optimization platform that unlocks greater productivity, throughput, and return on investment from existing FIB-SEM infrastructure while improving specimen quality and accelerating scientific and industrial outcomes. 

Visit Us at Booth #430

Meet Tescan at M&M 2026

Booth #430
August 3 - 6, 2026

Milwaukee, Wisconsin

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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Frequently asked questions

What is the Microscopy & Microanalysis conference?

The Microscopy & Microanalysis (M&M) conference is widely recognized as the world’s leading annual forum for the science and technology of microscopy and microanalysis, bringing together experts from academia, industry, and research institutions.  

It is the largest global gathering of professionals in this field, where scientists, engineers, and students come to present their latest research, exchange ideas, and explore cutting edge techniques across both the biological and physical sciences. 

Often described by the scientific community as a premier meeting point for microscopy, M&M offers a unique combination of high level scientific presentations, practical workshops, and one of the world’s largest exhibitions of advanced instrumentation and analytical technologies.  

Attendees value the opportunity to stay up to date with the latest methodologies, discover new applications from nano to macro scale, and connect with peers and technology providers in a highly collaborative environment. 

For Tescan, M&M is not just an event but a long standing tradition. As a regular exhibitor, we have been part of this global community for years, consistently engaging with scientists, sharing expertise, and presenting solutions that support increasingly complex research challenges.

What can attendees expect from visiting Tescan at M&M 2026?

Visitors to Tescan at M&M 2026 can expect a highly interactive experience focused on solving real scientific challenges.

Our expert application specialists will be available to discuss your specific research questions and help identify practical solutions tailored to your needs.

Through live online demos running at the booth, you will also gain hands on insight into how our instruments perform in real workflows, giving you a full solution experience in one place.

Product specialists will be present to dive into technical details and explore configurations best suited to your applications, while our sales team will be ready to support any purchasing related discussions.

Simply stop by Booth 430 to share the challenges you are facing and discover why Tescan is a partner worth considering for your research.

What are Tescan integrated workflow solutions?

Tescan integrated workflow solutions connect multiple analytical techniques into a single, coordinated process that guides users from initial, non‑destructive insight to precise nanoscale analysis.

In practice, this means combining Micro‑CT for 3D localization of hidden structures, ultrafast laser processing for fast and clean access to regions of interest, and FIB‑SEM for final high‑resolution imaging and advanced characterization.

By linking these steps with shared spatial context, the workflow reduces trial‑and‑error, minimizes preparation‑induced damage, and accelerates time to reliable results.

What technologies will Tescan showcase at Booth 430?

At Booth 430, Tescan will present a connected workflow that spans from large‑volume imaging down to precise nanoscale analysis and sample preparation.

Visitors can explore how individual technologies come together to streamline complex experiments, improve data quality, and accelerate time to insight. Our team will be available to discuss real use cases, from advanced materials research to semiconductor failure analysis, and to help identify the right configuration for specific applications.


You can expect practical conversations around topics such as high resolution surface imaging, large volume 3D characterization, site specific sample preparation, and efficient transfer from bulk analysis to TEM.

 

We will also share best practices for automating workflows, improving reproducibility, and handling challenging samples.

 

In addition, we will introduce and discuss complementary developments including Gentle Ion Beam (GIB), a Cryo Holder for Tescan TENSOR, the new Orage 2 column, and TOF-SIMS capabilities.

At the booth, we will showcase:

  • Tescan FemtoChisel™ femtosecond laser solution

  • Tescan CLARA™ 3 UHR-SEM

  • Tescan AMBER X™ 2 Plasma FIB-SEM

  • UniTOM™ HR 2 micro-CT

  • Tescan TENSOR™ STEM

  • Tescan EXLO™ Lift-out System

Stop by to see how these technologies can be combined into efficient, end to end workflows tailored to your research or industrial challenges.

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