Throughput without Compromise
Increase the number of TEM lamellae per shift by decoupling milling from manipulation.
Ex Situ Lift-Out for Scalable, High-Throughput TEM Specimen Preparation
Tescan EXLO
Tescan EXLO is designed for laboratories where TEM throughput, reproducibility, and cost efficiency matter. By moving specimen lift-out outside the FIB-SEM, EXLO keeps valuable beam time focused on milling, while parallelizing lamella transfer and grid mounting. The result: higher output, lower cost per specimen, and a more efficient workflow.
- High-throughput TEM sample preparation with parallel milling and transfer
- Lower cost per specimen through optimized FIB-SEM utilization
- Secure and reproducible lamella mounting with EXpressLO™ PGrids
- Seamless integration with TEM AutoPrep™, cryo transfer, and multi-system workflows
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Tescan EXLO in Semiconductors
High-throughput TEM sample preparation for process control and failure analysis
- Parallel lift-out enables continuous FIB milling while lamella transfer happens externally
- Scalable solution allows one EXLO to serve multiple FIB-SEMs, reducing per-specimen cost
- Compatible with inert gas and cryo transfer to preserve delicate semiconductor structures
Tescan EXLO accelerates semiconductor workflows where specimen demand is high. By decoupling manipulation from FIB usage, engineers can prepare more lamellae per shift without expanding instrument capacity. The system ensures reproducibility across large batches, enabling confident analysis in process development, yield monitoring, and failure diagnostics.
Tescan EXLO in Materials Science
Reliable lift-out for diverse materials and nanostructures
- Supports a wide range of grids including copper, nickel, and nanocrystalline diamond formats
- Secure lamella mounting in both top-down and inverted configurations for flexible thinning
- Reduces risk of FIB-induced damage to beam-sensitive materials by externalizing transfer
For materials scientists, EXLO simplifies the preparation of specimens ranging from thin films to fragile nanostructures. Its precision handling ensures stable transfer and mounting, minimizing artifacts that can affect downstream TEM analysis. With reproducible workflows and optimized grids, EXLO enables consistent results for both fundamental research and applied studies.
Tescan EXLO in Nanotechnology
Precise transfer for delicate specimens
- Enables lift-out of nanoparticles, nanowires, and thin films without prolonged FIB exposure
- Minimizes structural damage by handling transfers outside the ion beam environment
- Preserves cryo and air-sensitive specimens with vacuum or inert gas transfer options
EXLO provides a controlled environment for preparing specimens that are especially vulnerable to beam damage or contamination. By externalizing the transfer step, researchers can protect the integrity of delicate nanostructures and sensitive materials. This extends the lab’s capabilities into advanced nanotechnology research, ensuring high-quality TEM analysis of even the most delicate specimens.
Unlocked content
Tescan AMBER X with iFIB+™ control and real-time SE signal end pointing delivers precise Sub-20 nm node delayering. Achieve planar surfaces below 5 nm RMS roughness, maintain dielectric compatibility, and prepare contamination-free structures ready for in-situ nanoprobing and electrical failure analysis.
Tescan TEM AutoPrep™
AUTOMATION THAT INCREASES OUTPUT
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