Tescan SOLARIS X^™ 2 for Semiconductors

Solve package-level failure challenges with Tescan SOLARIS X^™ 2 Plasma FIB-SEM. Designed for today’s complex IC packaging, SOLARIS X^™ 2 combines the Mistral™ Xe Plasma FIB column with Rocking Stage^™, TRUE X-sectioning, and the Triglav™ UHR SEM to deliver deep, clean cross-sections and precise end-pointing.

Eliminate curtaining and ripple artifacts for reliable root-cause analysis

Locate subsurface cracks, voids, and delaminations with high-resolution SEM end-pointing

Prepare Ga⁺-free TEM lamellae efficiently, without contamination or loss of protection layers

Achieve consistent results across SiC, polyimide, glass, and advanced packaging materials

Boost productivity with automated alignments and high-current Xe⁺ beam milling

HOW Tescan SOLARIS X™ 2 SUPPORTS YOUR SEMICONDUCTOR ANALYSIS

Deliver Deep, Artifact-Free Cross Sections

Achieve clean, reliable results on complex IC packages using Rocking Stage^™ and TRUE X-sectioning.

Pinpoint Subsurface Defects with Precision

Detect cracks, voids, and delaminations using Triglav™ UHR SEM end-pointing at the FIB-SEM coincidence point.

Prepare Ga⁺-Free TEM Lamellae Efficiently

Protect device integrity while producing high-quality, contamination-free lamellae with the Mistral™ Xe Plasma FIB column.

Cross-Section the Toughest Materials

Section SiC, polyimide, glass, and ceramics with uniform surfaces, free of curtaining and terrace artifacts.

Boost Throughput Across Workflows

Leverage 3.3 µA Xe+ beam currents and automated column alignments for faster, more consistent sample preparation.

Maintain Clarity at Every Scale

Resolve fine package details with Triglav™ UHR SEM imaging at accelerating voltages down to 500 eV.

SOLARIS X™ 2

FOR SEMICONDUCTOR RESEARCH APPLICATIONS

2_Laser milling through entire stack of memory dies_1x-2-1

Accelerate Failure Analysis with Hybrid Laser and Plasma FIB Workflow

Achieve accurate, geometry-true cross-sections with the Hybrid Laser and Plasma FIB Workflow using CAD/GDS overlay navigation.

See application

Reveal Bonding Layers Clearly During Physical Failure Analysis of MEMS Motion Sensors

Perform physical failure analysis of MEMS motion sensors using Tescan SOLARIS X^™ 2 with artifact-free cross-sectioning that protects bonding layers and eliminates delamination risks.

See application

01_Several hundred um deep cross-section of the OLED display_1x-1-1

Prepare 1 mm OLED Display Cross Sections Without Delamination

Create a reliable OLED display cross section using Tescan SOLARIS X^™ 2 with precise layer control that preserves structure and avoids sample damage.

See application

6_Copper-pillar-Plasma-FIB-cross-sectioning 1_1x-1-1

Enhance SEM Observation During FIB Cross-Sectioning

Apply Tescan SOLARIS X^™ 2 with Rocking Stage^™ to achieve smooth, artifact-free plasma FIB cross sections for TSVs, solder bumps, and MEMS packaging structures.

See application

1_Delayering of 7nm FinFET CPU using Nanoflat chemistry_1x-1-1

Streamline TEM Lamella Preparation from 7nm Devices

Perform TEM lamella preparation on 7nm node transistors using Tescan SOLARIS X^™ 2 with in-situ delayering and thinning that maintain structural fidelity and eliminate air exposure.

See application

Achieve Consistent 80 nm Lamella for DRAM Failure Analysis

Use Tescan SOLARIS X™ 2 with Mistral™ Xe plasma FIB for TEM sample preparation of SDRAM devices. Produce thin, Ga⁺-free lamellae that preserve interface quality and elemental contrast at the 66 nm node.

See application

Tescan TRUE X-SECTIONING™

CROSS SECTIONS WITHOUT COMPROMISE

Tescan TRUE X-sectioning™ gives you clean, reliable cross sections for package-level failure analysis. Precut silicon masks combined with optimized plasma FIB milling suppress ripple artifacts that would otherwise obscure critical features. When paired with Rocking Stage^™, you also eliminate curtaining, achieving smooth, uniform surfaces, even in challenging materials like SiC, polyimide, and glass.

With TRUE X-sectioning™, you get cross sections you can trust for defect detection and high-resolution imaging. It streamlines your workflows and improves the consistency of your results.

05_SiC Plasma FIB cross-sectioning comparison_1x-1-1

Unlocked content

Output Examples

Tescan SOLARIS X™ 2 Plasma FIB-SEM 4 mm package-level cross-section prepared by laser for semiconductor failure analysis

Tescan SOLARIS X™ 2 solder bump cross-section with Pt protection layer prepared using Plasma FIB-SEM for package inspection

Tescan SOLARIS X™ 2 500 µm wide cross section of solder bump, including under-bump metallurgy and IC circuits, imaged with LE-BSE detector at 5 keV

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TESCAN SOLARIS X™ 2 for Semiconductors

Technical specification

SOLARIS X^™ 2	Electron column: Triglav™ UHR SEM with immersion optics
	Ion column: Mistral™ Xe Plasma FIB, 500 eV–30 keV, probe current <1 pA–3.3 µA, resolution <10 nm @ 30 keV
	Stage: Motorized 5-axis Compucentric Stage with Tescan Rocking Stage^™
	Lift-out compatibility: in situ with TEM AutoPrep™ Pro or ex situ with Tescan EXLO™
	Optical microscope: Tescan ONCam™ Navigation Camera
	Nanomanipulator: Tescan OptiLift™
	Grid compatibility: NCD slotted grids, EXpressLO PGrids™ (Cu, Ni); for standard and inverted TEM samples
	Detectors: In-beam SE and BSE detectors; STEM imaging at 0.5 nm resolution @ 30 keV
	Automation: Scheduled electron/ion column alignments for continuous system readiness

SOLARIS X^™ 2

Electron column: Triglav™ UHR SEM with immersion optics

Ion column: Mistral™ Xe Plasma FIB, 500 eV–30 keV, probe current <1 pA–3.3 µA, resolution <10 nm @ 30 keV

Stage: Motorized 5-axis Compucentric Stage with Tescan Rocking Stage^™

Lift-out compatibility: in situ with TEM AutoPrep™ Pro or ex situ with Tescan EXLO™

Optical microscope: Tescan ONCam™ Navigation Camera

Nanomanipulator: Tescan OptiLift™

Grid compatibility: NCD slotted grids, EXpressLO PGrids™ (Cu, Ni); for standard and inverted TEM samples

Detectors: In-beam SE and BSE detectors; STEM imaging at 0.5 nm resolution @ 30 keV

Automation: Scheduled electron/ion column alignments for continuous system readiness

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Tescan
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623 00 Brno
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130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 30.052597 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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Tescan SOLARIS X™ 2 for Semiconductors

HOW Tescan SOLARIS X™ 2 SUPPORTS YOUR SEMICONDUCTOR ANALYSIS

SOLARIS X™ 2

Accelerate Failure Analysis with Hybrid Laser and Plasma FIB Workflow

Reveal Bonding Layers Clearly During Physical Failure Analysis of MEMS Motion Sensors

Prepare 1 mm OLED Display Cross Sections Without Delamination

Enhance SEM Observation During FIB Cross-Sectioning

Streamline TEM Lamella Preparation from 7nm Devices

Achieve Consistent 80 nm Lamella for DRAM Failure Analysis

Tescan TRUE X-SECTIONING™

Output Examples

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TESCAN SOLARIS X™ 2 for Semiconductors

GET IN Touch

Where can you find us:

Tescan SOLARIS X^™ 2 for Semiconductors

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