Deliver Deep, Artifact-Free Cross Sections
Achieve clean, reliable results on complex IC packages using Rocking Stage™ and TRUE X-sectioning.
Tescan SOLARIS X™ 2 for Semiconductors
Solve package-level failure challenges with Tescan SOLARIS X™ 2 Plasma FIB-SEM. Designed for today’s complex IC packaging, SOLARIS X™ 2 combines the Mistral™ Xe Plasma FIB column with Rocking Stage™, TRUE X-sectioning, and the Triglav™ UHR SEM to deliver deep, clean cross-sections and precise end-pointing.
- Eliminate curtaining and ripple artifacts for reliable root-cause analysis
- Locate subsurface cracks, voids, and delaminations with high-resolution SEM end-pointing
- Prepare Ga+-free TEM lamellae efficiently, without contamination or loss of protection layers
- Achieve consistent results across SiC, polyimide, glass, and advanced packaging materials
- Boost productivity with automated alignments and high-current Xe+ beam milling
FOR SEMICONDUCTOR RESEARCH APPLICATIONS
Accelerate Failure Analysis with Hybrid Laser and Plasma FIB Workflow
Achieve accurate, geometry-true cross-sections with the Hybrid Laser and Plasma FIB Workflow using CAD/GDS overlay navigation.
Reveal Bonding Layers Clearly During Physical Failure Analysis of MEMS Motion Sensors
Perform physical failure analysis of MEMS motion sensors using Tescan SOLARIS X™ 2 with artifact-free cross-sectioning that protects bonding layers and eliminates delamination risks.
Prepare 1 mm OLED Display Cross Sections Without Delamination
Create a reliable OLED display cross section using Tescan SOLARIS X™ 2 with precise layer control that preserves structure and avoids sample damage.
Enhance SEM Observation During FIB Cross-Sectioning
Apply Tescan SOLARIS X™ 2 with Rocking Stage™ to achieve smooth, artifact-free plasma FIB cross sections for TSVs, solder bumps, and MEMS packaging structures.
Streamline TEM Lamella Preparation from 7nm Devices
Perform TEM lamella preparation on 7nm node transistors using Tescan SOLARIS X™ 2 with in-situ delayering and thinning that maintain structural fidelity and eliminate air exposure.
Achieve Consistent 80 nm Lamella for DRAM Failure Analysis
Use Tescan SOLARIS X™ 2 with Mistral™ Xe plasma FIB for TEM sample preparation of SDRAM devices. Produce thin, Ga+-free lamellae that preserve interface quality and elemental contrast at the 66 nm node.
CROSS SECTIONS WITHOUT COMPROMISE
Tescan TRUE X-sectioning™ gives you clean, reliable cross sections for package-level failure analysis. Precut silicon masks combined with optimized plasma FIB milling suppress ripple artifacts that would otherwise obscure critical features. When paired with Rocking Stage™, you also eliminate curtaining, achieving smooth, uniform surfaces, even in challenging materials like SiC, polyimide, and glass.
With TRUE X-sectioning™, you get cross sections you can trust for defect detection and high-resolution imaging. It streamlines your workflows and improves the consistency of your results.
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