Tescan SOLARIS X 2 for Semiconductors

Solve package-level failure challenges with Tescan SOLARIS X 2 Plasma FIB-SEM. Designed for today’s complex IC packaging, SOLARIS X 2 combines the Mistral™ Xe Plasma FIB column with Rocking Stage, TRUE X-sectioning, and the Triglav™ UHR SEM to deliver deep, clean cross-sections and precise end-pointing.

Eliminate curtaining and ripple artifacts for reliable root-cause analysis

Locate subsurface cracks, voids, and delaminations with high-resolution SEM end-pointing

Prepare Ga+-free TEM lamellae efficiently, without contamination or loss of protection layers

Achieve consistent results across SiC, polyimide, glass, and advanced packaging materials

Boost productivity with automated alignments and high-current Xe+ beam milling

HOW Tescan SOLARIS X 2 SUPPORTS YOUR SEMICONDUCTOR ANALYSIS

Deliver Deep, Artifact-Free Cross Sections

Achieve clean, reliable results on complex IC packages using Rocking Stage and TRUE X-sectioning.

Pinpoint Subsurface Defects with Precision

Detect cracks, voids, and delaminations using Triglav™ UHR SEM end-pointing at the FIB-SEM coincidence point.

Prepare Ga⁺-Free TEM Lamellae Efficiently

Protect device integrity while producing high-quality, contamination-free lamellae with the Mistral™ Xe Plasma FIB column.

Cross-Section the Toughest Materials

Section SiC, polyimide, glass, and ceramics with uniform surfaces, free of curtaining and terrace artifacts.

Boost Throughput Across Workflows

Leverage 3.3 µA Xe+ beam currents and automated column alignments for faster, more consistent sample preparation.

Maintain Clarity at Every Scale

Resolve fine package details with Triglav™ UHR SEM imaging at accelerating voltages down to 500 eV.

SOLARIS X 2

FOR SEMICONDUCTOR RESEARCH APPLICATIONS

2_Laser milling through entire stack of memory dies_1x-2-1

Accelerate Failure Analysis with Hybrid Laser and Plasma FIB Workflow

Achieve accurate, geometry-true cross-sections with the Hybrid Laser and Plasma FIB Workflow using CAD/GDS overlay navigation.

See application

Reveal Bonding Layers Clearly During Physical Failure Analysis of MEMS Motion Sensors

Perform physical failure analysis of MEMS motion sensors using Tescan SOLARIS X 2 with artifact-free cross-sectioning that protects bonding layers and eliminates delamination risks.

See application

01_Several hundred um deep cross-section of the OLED display_1x-1-1

Prepare 1 mm OLED Display Cross Sections Without Delamination

Create a reliable OLED display cross section using Tescan SOLARIS X 2 with precise layer control that preserves structure and avoids sample damage.

See application

6_Copper-pillar-Plasma-FIB-cross-sectioning 1_1x-1-1

Enhance SEM Observation During FIB Cross-Sectioning

Apply Tescan SOLARIS X 2 with Rocking Stage to achieve smooth, artifact-free plasma FIB cross sections for TSVs, solder bumps, and MEMS packaging structures.

See application

1_Delayering of 7nm FinFET CPU using Nanoflat chemistry_1x-1-1

Streamline TEM Lamella Preparation from 7nm Devices

Perform TEM lamella preparation on 7nm node transistors using Tescan SOLARIS X 2 with in-situ delayering and thinning that maintain structural fidelity and eliminate air exposure.

See application

Achieve Consistent 80 nm Lamella for DRAM Failure Analysis

Use Tescan SOLARIS X 2 with Mistral™ Xe plasma FIB for TEM sample preparation of SDRAM devices. Produce thin, Ga-free lamellae that preserve interface quality and elemental contrast at the 66 nm node.

See application

Tescan TRUE X-SECTIONING™

CROSS SECTIONS WITHOUT COMPROMISE

Tescan TRUE X-sectioning™ gives you clean, reliable cross sections for package-level failure analysis. Precut silicon masks combined with optimized plasma FIB milling suppress ripple artifacts that would otherwise obscure critical features. When paired with Rocking Stage, you also eliminate curtaining, achieving smooth, uniform surfaces, even in challenging materials like SiC, polyimide, and glass.

With TRUE X-sectioning™, you get cross sections you can trust for defect detection and high-resolution imaging. It streamlines your workflows and improves the consistency of your results.

05_SiC Plasma FIB cross-sectioning comparison_1x-1-1

Unlocked content

Output Examples

Tescan SOLARIS X 2 Plasma FIB-SEM 4 mm package-level cross-section prepared by laser for semiconductor failure analysis

Tescan SOLARIS X 2 solder bump cross-section with Pt protection layer prepared using Plasma FIB-SEM for package inspection

Tescan SOLARIS X 2 500 µm wide cross section of solder bump, including under-bump metallurgy and IC circuits, imaged with LE-BSE detector at 5 keV

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TESCAN SOLARIS X 2 for Semiconductors

Technical specification

SOLARIS X 2	Electron column: Triglav™ UHR SEM with immersion optics
	Ion column: Mistral™ Xe Plasma FIB, 500 eV–30 keV, probe current <1 pA–3.3 µA, resolution <10 nm @ 30 keV
	Stage: Motorized 5-axis Compucentric Stage with Tescan Rocking Stage
	Lift-out compatibility: in situ with TEM AutoPrep™ Pro or ex situ with Tescan EXLO™
	Optical microscope: Tescan ONCam™ Navigation Camera
	Nanomanipulator: Tescan OptiLift™
	Grid compatibility: NCD slotted grids, EXpressLO PGrids™ (Cu, Ni); for standard and inverted TEM samples
	Detectors: In-beam SE and BSE detectors; STEM imaging at 0.5 nm resolution @ 30 keV
	Automation: Scheduled electron/ion column alignments for continuous system readiness

SOLARIS X 2

Electron column: Triglav™ UHR SEM with immersion optics

Ion column: Mistral™ Xe Plasma FIB, 500 eV–30 keV, probe current <1 pA–3.3 µA, resolution <10 nm @ 30 keV

Stage: Motorized 5-axis Compucentric Stage with Tescan Rocking Stage

Lift-out compatibility: in situ with TEM AutoPrep™ Pro or ex situ with Tescan EXLO™

Optical microscope: Tescan ONCam™ Navigation Camera

Nanomanipulator: Tescan OptiLift™

Grid compatibility: NCD slotted grids, EXpressLO PGrids™ (Cu, Ni); for standard and inverted TEM samples

Detectors: In-beam SE and BSE detectors; STEM imaging at 0.5 nm resolution @ 30 keV

Automation: Scheduled electron/ion column alignments for continuous system readiness

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Where can you find us:

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.479653 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928 -12.08688

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Tescan SOLARIS X 2 for Semiconductors

HOW Tescan SOLARIS X 2 SUPPORTS YOUR SEMICONDUCTOR ANALYSIS

SOLARIS X 2

Accelerate Failure Analysis with Hybrid Laser and Plasma FIB Workflow

Reveal Bonding Layers Clearly During Physical Failure Analysis of MEMS Motion Sensors

Prepare 1 mm OLED Display Cross Sections Without Delamination

Enhance SEM Observation During FIB Cross-Sectioning

Streamline TEM Lamella Preparation from 7nm Devices

Achieve Consistent 80 nm Lamella for DRAM Failure Analysis

Tescan TRUE X-SECTIONING™

Output Examples

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TESCAN SOLARIS X 2 for Semiconductors

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Where can you find us:

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