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Ga⁺ FIB column - Built for Semiconductor Performance
Tescan Orage™ 2
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Orage™ 2, the new Ga⁺ FIB column, raises speed and consistency in TEM lamella preparation with less operator effort.
The improved spot profile of Orage™ 2 at high beam currents delivers up to 40% faster milling for TEM lamella preparation, making high-volume work more efficient and reducing the cost per sample. At the same time, clearer low-keV FIB imaging down to 500 eV ensures precise beam placement during the final cleaning step, helping users avoid the “gray-in-gray” effect and giving them full confidence in achieving ultra-thin lamellae.
With Orage™ 2 at its core, FIB-SEM Tescan SOLARIS™ 2 builds on these advantages to accelerate fully automated lamella preparation by almost half. Automation is driven by the TEM AutoPrep™ Pro software module, which reduces operator effort by managing every step from trench milling and lift-out to the final low-keV clean on the grid. During the lift-out step, Tescan’s OptiLift™ attaches the lamella to the grid in a single, reliable motion. Together, they create a seamless, fully automated workflow for top-down, inverted, and planar geometries, perfectly suited for demanding semiconductor applications such as 3D NAND and FinFETs.
- Run FIB-SEM Tescan SOLARIS™ 2 overnight and return to finished lamellae in the morning. With TEM AutoPrep™ Pro and OptiLift™, SOLARIS™ 2 prepares multiple lamellae from different sites in one unattended run.
- SOLARIS™ 2 delivers ultra-thin TEM lamellae for high-quality TEM analysis, finished with an improved final low-keV cleaning down to 500 eV to minimize amorphous damage and leave clear, high contrast surfaces.
- Designed for failure analysis, quality control engineers, and R&D teams, this solution is built to maximize throughput while delivering reliability needed for fully or semi-automated TEM sample preparation and cross-sectioning.
- Optimized for high-volume labs requiring reproducible multi-sample preparation in quality control workflows.
Low keV performance
With market-leading FIB imaging quality down to 500 eV, Orage™ 2 gives you maximum visibility of the finest details of your lamella. This clarity enables confident cleaning of ultra-thin lamellae (<10nm) with negligible amorphization damage and makes precise beam placement easier, ensuring smooth completion of the final polishing steps during TEM sample preparation.
AI-powered automated workflow
The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation even for demanding semiconductor applications. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.
Up to 40% faster TEM lamella preparation
The improved spot profile at high beam currents allows lamella preparation to be completed up to 40% faster compared to conventional solutions. This improves efficiency across every lab, whether you’re a researcher, failure analysis, or quality control engineer.
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Reliable outcomes
Proven fully automated lamella preparation, combined with long-term column stability and a well-defined beam spot profile, ensures reliable FIB performance across multiple unattended runs and delivers consistent, reproducible results.
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