Driving Materials Innovation: Tescan at TMS 2026

From Preparation to Insight - Faster and More Precisely

A highlight of the conference was Tescan’s presentation, In-Situ Micro-CT Investigation of Thermal Deformation in Semiconductor Devices, which showcased the power of in-situ 3D imaging to capture dynamic structural changes under thermal stress. The talk drew strong interest and reinforced the value of advanced imaging techniques in understanding complex material behavior insemiconductor applications. 

Attendees also showed strong interest in Tescan’s comprehensive portfolio and its ability to support integrated, end-to-end workflows - from sample preparation through advanced imaging and analysis. Conversations frequently centered on correlative approaches, automation, and scalable solutions that can transition seamlessly from research environments to industrial applications. 

Overall, TMS 2026 highlighted growing demand for deeper material insights, faster time-to-results, and more connected workflows, reinforcing Tescan’s position as a trusted partner in advanced materials characterization