Discover What’s Next in Materials Characterization at TMS 2026

Tescan: Powering Materials Innovation from Preparation to Analysis

Join Tescan at TMS 2026 - The Minerals, Metals & Materials Society Annual Meeting & Exhibition, taking place March 15–19, 2026, in San Diego, California, USA, and explore cutting-edge solutions for advanced materials characterization, preparation, and analysis.

At Booth 415, discover how Tescan combines electron microscopy, focused ion beam (FIB-SEM), X-ray micro-CT, and integrated laser technologies to deliver powerful, application-driven workflows for materials science and engineering.

Booth #415

15 - 19 March 2026

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From Preparation to Insight - Faster and More Precisely

From rapid, damage-minimized sample preparation to high-resolution 3D analysis, Tescan technologies help researchers and engineers gain deeper insight across a wide range of materials applications.

At the Tescan booth, learn how our solutions support:

FIB-SEM and SEM workflows enhanced with laser-based sample preparation
High-throughput, site-specific material removal for complex or hard materials
Correlative workflows linking laser processing with 3D imaging and analysis
Scalable platforms for metallurgy, additive manufacturing, batteries, and advanced alloys

Turning Materials Data into Understanding

Whether you are advancing fundamental materials research or optimizing industrial processes, Tescan’s microscopy and laser technologies provide the speed, precision, and flexibility needed to move from raw data to confident understanding.

Our integrated approach helps reduce preparation time, improve data quality, and connect structure, composition, and performance across materials systems.

Materials Characterization with Tescan at TMS 2026

Visit Tescan at Booth 415 and connect with our experts to discuss your materials characterization needs.

Use the form below to start a conversation about how Tescan’s FIB-SEM, micro-CT, and laser-based workflows can support your research or production goals.

Meet the Expert

Dr. David Sampson
Micro-CT Business Development Manager

Dr. Sampson currently serves as Product Specialist for CT at Tescan USA, where he supports advanced materials analysis and the application of X-ray computed tomography. He holds a Ph.D. in Analytical Chemistry from Colorado State University and brings over 25 years of experience in metrology, including work in the semiconductor and hard drive industries. His recent focus is on advanced 3D analysis using X-ray micro-CT.

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Advance your materials characterization

Book a meeting with the Tescan team to explore how FIB-SEM, SEM, micro-CT, and laser-based sample preparation work together to deliver high-quality insight across metallurgy, additive manufacturing, batteries, and advanced alloys.