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ON-DEMAND WEBINAR |

Up to 40% Faster Automated TEM Lamella Preparation with the Orage™ 2 Gallium FIB Column

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Increase TEM sample throughput. Improve consistency. Reduce operator dependency.

Advanced semiconductor nodes demand ultra-thin, site-specific TEM samples. Manual preparation is slow, complex, and highly dependent on expert operators. This on-demand webinar shows how Tescan addresses these challenges with a new generation Gallium FIB column and AI-driven automation. 

Learn how semiconductor failure analysis and R&D labs can achieve up to 40% faster TEM lamella preparation while improving repeatability, robustness, and overall lab efficiency.

What you will gain by watching

Clear, data-backed insight into throughput gains

  • See real preparation time comparisons between conventional Gallium FIB and Orage™ 2

  • Understand how higher usable beam currents directly reduce milling and thinning time

  • Learn how labs increased output from 6 to 10 TEM samples within the same time window

Practical understanding of automation in real semiconductor failure analysis workflows

  • How AI-driven TEM AutoPrep™ Pro reduces manual steps by more than 75%

  • How automation lowers the barrier for less experienced users while maintaining expert-level results

  • How unattended and overnight runs increase microscope utilization in multi-user environments

Better TEM sample quality for advanced nodes

  • How improved beam profiles reduce overspray, curtaining, and damage

  • How ultra-thin lamella below 50 nm, and even below 30 nm, are achieved reproducibly

  • Why improved low-kV performance is critical for final cleaning and automation reliability

Actionable insight for advanced semiconductor applications 

  • Use cases including FinFET and sub-5 nm technology nodes

  • Inverted, plan-view, and top-down lamella geometries explained

  • How automation supports site-specific preparation across different materials and device structures

Why watch now

If your lab is under pressure to deliver more TEM samples, faster, with consistent quality, this session provides concrete answers. You will leave with a clear understanding of how modern Gallium FIB technology and automation can directly reduce cost per sample while improving reliability and throughput.

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Fill in the form to get instant access and see how Tescan enables faster, more reliable TEM lamella preparation for advanced semiconductor workflows.

Meet the speaker

Lukáš_Hladík_ct_m-1
Lukas Hladik

Lukas Hladik is one of Tescan’s leading experts in semiconductor applications, supporting customers in addressing complex challenges across failure analysis, R&D, and process development. His deep understanding of FIB-SEM, characterization, and delayering technologies allows him to recommend the most effective approaches for each workflow.

Combining hands-on experience with a strong background in physical engineering and nanotechnology, Lukas works closely with semiconductor manufacturers and research teams worldwide, helping them optimize precision, throughput, and analytical performance across a range of materials and device architectures.

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Up to 40% Faster Automated TEM Lamella Preparation with the Orage 2 Gallium FIB Column

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See how advanced Gallium FIB technology and AI-driven automation enable up to 40% faster TEM lamella preparation while improving repeatability and reducing operator dependency in semiconductor failure analysis workflows.