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Tescan will exhibit at the International Symposium for Testing and Failure Analysis (ISTFA), October 4-8, 2026, in San Antonio, Texas.
Organized by ASM International, ISTFA brings together the semiconductor failure analysis community to share the latest methodologies, technologies, and best practices.
Visit Tescan at Booth #605 to explore semiconductor workflows for defect localization, cross-sectioning, high-resolution imaging, and root cause analysis.
ISTFA is an annual symposium focused on semiconductor testing, reliability, and failure analysis. The program features technical presentations, workshops, and discussions on analytical techniques, semiconductor workflows, and device analysis for researchers and industry professionals.
Tescan will participate as an exhibitor at ISTFA 2026 with demonstrations and workflow discussions focused on semiconductor failure analysis. The theme for the event is:
“See the Failure. Solve the Problem.”
Tescan will showcase technologies including:
- Tescan FemtoChisel™ Laser – Femtosecond laser sample preparation for rapid, low-damage cross-sectioning and access to regions of interest, supporting faster semiconductor failure analysis workflows.
- Tescan SOLARIS™ – Plasma FIB-SEM platform for large-area cross-sectioning, high-throughput sample preparation, and 3D characterization of advanced semiconductor devices and packages.
- Tescan AMBER X™ 2 – Next-generation Xe plasma FIB-SEM for high-quality TEM specimen preparation, large-volume serial sectioning, and advanced failure analysis with improved throughput.
- Tescan TENSOR™ S/TEM – Automated analytical scanning/transmission electron microscope supporting high-resolution imaging, diffraction, spectroscopy, and 4D-STEM workflows for nanoscale characterization.
These technologies support integrated semiconductor workflows from defect localization and sample preparation to high-resolution imaging and root cause analysis.
These systems support advanced semiconductor workflows for:
- Defect localization
- FIB-SEM sample preparation
- Site-specific cross-sectioning
- High-resolution SEM imaging
- Failure analysis and root cause investigation
- Semiconductor process and packaging analysis
Visitors to Booth #605 will be able to discuss practical approaches for improving workflow efficiency and analytical accuracy in semiconductor FA (failure analysis) environments.
Agenda / Program
The ISTFA program includes:
- Keynote presentations
- Technical sessions
- Technical sessions
- Workshops
- Networking activities
What You Will Learn
- Approaches to semiconductor failure analysis workflows
- Methods for precise defect localization and navigation
- FIB-based sample preparation techniques for site-specific analysis
- High-resolution SEM imaging for nanoscale structures
- Workflow strategies for reducing time-to-answer in FA laboratories
- Practical applications for logic, memory, advanced packaging, and power devices
- Techniques for improving imaging quality and analytical consistency
Who Should Attend
- Semiconductor failure analysis engineers
- Process and reliability engineers
- Materials scientists
- Microscopy specialists
- Semiconductor researchers
- Advanced packaging engineers
- Laboratory managers and technical directors
- Academic researchers and students working in semiconductor characterization
Why Attend
ISTFA brings together researchers and industry professionals to discuss semiconductor testing, reliability, and failure analysis. Visit Tescan to explore integrated workflows for defect localization, FIB sample preparation, SEM imaging, and root cause analysis.
Registration
Registration information and the full event program are available through the official ISTFA event website hosted by ASM International
Visitors are invited to meet the Tescan team at Booth # 605 to discuss semiconductor failure analysis workflows and microscopy solutions for advanced device characterization.
