Back to the events

Join Tescan at IPFA 2026 in Singapore

Tescan will participate in IPFA 2026, the 33rd International Symposium on the Physical Failure Analysis of Integrated Circuits, from 13–16 July 2026 in Singapore. Organized by IEEE, IPFA brings together semiconductor failure analysis, physical failure analysis, reliability, package-level FA, and analytical instrumentation communities.

At Booth A4, Tescan will present streamlined failure analysis workflows for advanced packaging, with a focus on correlative Micro-CT, laser, and Plasma FIB workflows with nanometer precision.

13 - 16 July 2026

Book a Meeting

About IPFA 2026 – IEEE Symposium on Failure Analysis

Tescan will present an integrated semiconductor failure analysis workflow for advanced packaging:

ipfa-2026

The workflow connects non-destructive 3D inspection, laser-based access, Plasma FIB-SEM sample preparation, and downstream nanoscale analysis.

Agenda / Programme

Date	Time	Session	Topic	Speaker	Location
Monday, 13 July 2026	17:00–17:30	WA2	Tescan workshop: Microscopy and Sample Prep	Herve Mace, Semiconductor Solution Sales Development Director	Breakout Room A, MELATI Main 4001AB-4002
Wednesday, 15 July 2026	10:00–10:30	1A.4, ID259	Novel High-Quality High-Throughput Femtosecond Laser Cross-Sectioning for Advanced Microelectronics Failure Analysis and Metrology	Sina Shahbazmohamadi, Head of Technology & Product Marketing	Breakout Room A, MELATI Main 4001AB-4002
Thursday, 16 July 2026	10:20–10:40	4B.4, ID261	Scalable Laser Micromachining Workflows for TEM and NanoCT Sample Preparation	Sina Shahbazmohamadi, Head of Technology & Product Marketing	Breakout Room B, Melati Main 4101AB-4102

What You Will Learn

How correlative workflows combine micro-CT, laser processing, and Plasma FIB-SEM for advanced packaging failure analysis
How non-destructive 3D imaging supports inspection and localization before physical sample preparation
How femtosecond laser cross-sectioning can support high-throughput failure analysis and metrology workflows
How laser micromachining can be applied to TEM and NanoCT sample preparation
How FIB-SEM workflows support precise preparation and analysis of complex semiconductor samples
How an integrated Inspect → Access → Prepare → Analyze workflow can reduce workflow complexity in package-level FA

Why Attend

Advanced packages contain buried structures, complex interfaces, and features that require careful correlation between inspection, access, preparation, and analysis. Tescan’s IPFA 2026 programme focuses on practical workflows for package-level failure analysis, including non-destructive 3D imaging, femtosecond laser processing, Plasma FIB-SEM preparation, and nanoscale analytical methods.

Registration

Visit Tescan at Booth A4 during IPFA 2026 to discuss your failure analysis and sample preparation challenges with our technical team.

Meet our experts at IPFA 2026 - Book a meeting with Tescan.

Our Speakers

Mr. Herve Mace
Global Business Development Director, Tescan

Hervé Macé is Global Business Development Director for Semiconductors at Tescan, focusing on advanced workflows for semiconductor applications. At IPFA 2026, he contributes to discussions on microscopy and sample preparation, supporting integrated approaches to failure analysis and advanced packaging. His work focuses on aligning analytical technologies with practical challenges in semiconductor manufacturing and diagnostics.

Dr. Sina Shahbazmohamadi
Head of Laser Technology, Tescan

Dr. Sina Shahbazmohamadi is Head of Technology at Tescan, focusing on translating advanced engineering developments into practical solutions for semiconductor and materials science applications. At IPFA 2026, he presents on femtosecond laser processing and scalable workflows for high-throughput failure analysis and sample preparation in advanced microelectronics. His work bridges innovation and application, supporting efficient and reproducible analytical workflows.

BOOK A MEETING

Built around your needs

Your nearest office is:

Tescan Brno
Libušina tř. 21
623 00 Brno - Kohoutovice

Czech Republic  +420 530 353 411
info@Tescan.com

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

No distributors found.