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Join Tescan at IPFA 2026 in Singapore

Tescan will be present at IPFA 2026 – the 33rd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, taking place at Marina Bay Sands, Singapore, from 13–16 July 2026.

This flagship event brings together experts in semiconductor failure analysis, reliability, and advanced diagnostics from across industry and academia.

13 - 16 July 2026
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About IPFA 2026 – IEEE Symposium on Failure Analysis

IPFA 2026 is a cornerstone conference for semiconductor failure analysis and reliability assessment, attracting more than 550 participants including researchers, engineers, and solution providers across the semiconductor ecosystem. 

The symposium focuses on:

  • Electrical fault isolation and advanced analytical techniques.
  • Physical and package-level failure analysis.
  • Transistor and memory reliability
  • ESD, latch-up, and hardware security
  • AI-driven methods for failure detection and reliability insights.

Why Tescan is at IPFA 2026

At IPFA, engineers and failure analysis specialists are looking for tools that give them deeper insight into device behavior, defects, and long-term reliability. This aligns strongly with Tescan’s focus on:

  • Advanced electron microscopy solutions for semiconductor diagnostics.
  • FIB-SEM and laser-enabled workflows for sample preparation and cross-sectioning.
  • Integrated workflows that support physical failure analysis and reliability investigations.

Stay Informed About Tescan at IPFA 2026

We’re finalizing our plans for Tescan’s participation at IPFA 2026. As details such as booth number, live demos, and technical sessions are confirmed, this page will be updated so you can plan your visit in advance.

If you’d like updates on Tescan’s presence at IPFA 2026 or want to discuss your analysis workflows, feel free to contact us. Our team will get back to you with the information you need.

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