Tescan at EIPBN 2026
Join Tescan at the 69th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN 2026), taking place May 26–29, 2026 in Denver, Colorado. #Booth 19
EIPBN is a leading conference on nanofabrication and beam-based technologies, covering electron, ion, and photon beam applications for nanoscale fabrication and analysis. At this year’s event, Tescan will highlight integrated solutions that enable faster, more precise workflows from prototyping to analysis.
Nanofabrication and FIB-SEM Workflows at EIPBN
Featured technologies:
FemtoChisel™ – Femtosecond Laser Processing
Experience ultrafast, highly selective material processing with minimal thermal damage. FemtoChisel enables precise modification and preparation of complex structures, making it ideal for advanced sample preparation and device-level work.
Nanoprototyping workflows
Accelerate innovation with Tescan’s nanoprototyping approach - bridging design, fabrication, and characterization. Our solutions support rapid iteration at the nanoscale, helping researchers and engineers move efficiently from concept to functional structures.
Tescan NanoSpace
Discover a new level of automation and usability with Tescan NanoSpace, designed to streamline complex FIB-SEM workflows. From routine tasks to advanced applications, NanoSpace enhances productivity, reproducibility, and user experience.
What to expect at the Tescan booth
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Live discussions on advanced FIB-SEM and laser-assisted workflows
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Real-world applications in nanofabrication and failure analysis
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Insights into accelerating development cycles through nanoprototyping
Whether you are developing next-generation devices or refining nanoscale processes, Tescan solutions are engineered to deliver precision, flexibility, and performance.
Agenda / Program
Tescan will present multiple contributions focused on AI-driven FIB-SEM workflows and nanoprototyping in nanofabrication.
Session 2C – Industrial Highlights
Wednesday, May 27, 2026 | 15:50 – 17:30 | Location: PMat Centennial C
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HyperFIB: Vision-Guided Closed-Loop AI for Commercial FIB-SEM Enabled by a Dedicated Python Control API
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SEM as a Surface-Engineering Platform for Nanoprototyping: In Situ FEBID/FEBIE, Scripted Workflows, and Digital-Twin Process Control
Session 6B – Nanofabrication for Biology, Nanomedicine & Implantable Devices 2
Friday, May 29, 2026 | 8:00 AM – 9:50 | Location: AMat Centennial B
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Correlative Laser & FIB-SEM Workflows for Metrology, Inspection, and Characterization of Advanced Microelectronics Packages
Visit Tescan at EIPBN 2026 to explore the future of nanoprototyping and advanced material processing.
Registration
Register for EIPBN to explore the latest developments in nanofabrication, beam technologies, and nanoscale analysis. 
Meet the Tescan team at Booth 19 to explore FemtoChisel, NanoSpace, and nanoprototyping solutions in practice.
FAQs
What is EIPBN?
EIPBN (Electron, Ion, and Photon Beam Technology and Nanofabrication) is an international conference focused on beam-based lithography, nanofabrication, and nanoscale characterization technologies.
What is FemtoChisel used for?
FemtoChisel is a femtosecond laser-based system used for precise material processing, sample preparation, and modification of complex structures with minimal thermal damage.
What is nanoprototyping in nanofabrication?
Nanoprototyping is a workflow that combines design, fabrication, and characterization to rapidly develop and test nanoscale structures and devices.
What is NanoSpace in FIB-SEM workflows?
NanoSpace is a platform that improves automation and usability in FIB-SEM workflows, enabling more efficient and reproducible nanofabrication and analysis processes.
Speakers
Pouya Tavousi is Head of AI and Advanced Solutions at Tescan and previously co-founded FemtoInnovations, which was acquired by Tescan in 2025. He leads advanced solution development at the intersection of ultrafast laser micromachining, correlative microscopy, and AI-enabled laser processing and image analysis. His work focuses on automating end-to-end workflows that fuse multimodal imaging with data-driven navigation, and on developing software that enables high-throughput sample preparation for advanced microelectronics - including decapsulation, delayering, and large-area cross-sectioning - for failure analysis and metrology.
